公开(公告)号：US5365402A

公开(公告)日：1994-11-15

申请号：US800268

申请日：1991-11-29

申请人： Toshio Hatada ,  Shigeo Ohashi ,  Tadakatsu Nakajima ,  Heikichi Kuwahara ,  Hitoshi Matsushima ,  Motohiro Sato ,  Hiroshi Inouye ,  Takao Ohba ,  Akira Yamagiwa ,  Kanji Otsuka ,  Yuuji Shirai

发明人： Toshio Hatada ,  Shigeo Ohashi ,  Tadakatsu Nakajima ,  Heikichi Kuwahara ,  Hitoshi Matsushima ,  Motohiro Sato ,  Hiroshi Inouye ,  Takao Ohba ,  Akira Yamagiwa ,  Kanji Otsuka ,  Yuuji Shirai

IPC分类号： H01L23/36 ,  H01L23/367 ,  H01L23/40 ,  H01L23/433 ,  H05K7/20

CPC分类号： H01L23/433 ,  H01L23/3677 ,  H01L23/4006 ,  H01L2023/405 ,  H01L2224/32188 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/16195

摘要： A cooling apparatus for an electronic device of high calorific density including an elastomer interposed between a semiconductor chip and a heat sink so as to connect them thermally. The elastomer may also be in close contact with a large number of semiconductor chips having various configurations which are mounted on a board, so that the elastomer is thermally connected with them, whereby the elastomer absorbs thermal deformations.

摘要翻译： 一种用于高热密度的电子装置的冷却装置，包括插入在半导体芯片和散热片之间的弹性体，以便将它们热连接。 弹性体还可以与安装在板上的具有各种构造的大量半导体芯片紧密接触，使得弹性体与它们热连接，由此弹性体吸收热变形。

公开(公告)号：US5270572A

公开(公告)日：1993-12-14

申请号：US903458

申请日：1992-06-24

申请人： Tadakatsu Nakajima ,  Shigeo Ohashi ,  Heikichi Kuwahara ,  Noriyuki Ashiwake ,  Motohiro Sato ,  Toshio Hatsuda ,  Takahiro Daikoku ,  Toshio Hatada ,  Shigeyuki Sasaki ,  Hiroshi Inouye ,  Atsuo Nishihara ,  Kenichi Kasai

发明人： Tadakatsu Nakajima ,  Shigeo Ohashi ,  Heikichi Kuwahara ,  Noriyuki Ashiwake ,  Motohiro Sato ,  Toshio Hatsuda ,  Takahiro Daikoku ,  Toshio Hatada ,  Shigeyuki Sasaki ,  Hiroshi Inouye ,  Atsuo Nishihara ,  Kenichi Kasai

IPC分类号： H01L23/44 ,  H01L23/473 ,  H05K7/20 ,  H01L23/02 ,  H01L25/04

CPC分类号： H01L23/4735 ,  H01L2924/0002 ,  H01L2924/12044

摘要： A semiconductor cooling unit for directly jetting a cooling medium against surfaces of semiconductor devices for use in a high-speed computer or the like to effectively remove heat from the semiconductor devices, in which partition members for partitioning a space into regions where semiconductor devices are placed. Each partitioned region has an opening at its ceiling side, and a pipe for supplying or discharging the cooling medium through the opening is disposed so as to project toward a central portion of the back surface of each semiconductor device. This pipe is utilized to also section a cooling medium supply header or a cooling medium return header so that bubbles generated from the semiconductor device surfaces can be smoothly removed, and so that the cooling medium can flow smoothly onto the semiconductor devices.

摘要翻译： 一种半导体冷却单元，用于将冷却介质直接喷射到用于高速计算机等的半导体器件的表面上，以有效地从半导体器件移除热量，其中用于将空间分隔成半导体器件放置的区域的分隔构件 。 每个分隔区域在其顶侧具有开口，并且通过所述开口供给或排出冷却介质的管设置成朝向每个半导体器件的背面的中心部分突出。 该管也用于将冷却介质供应集管或冷却介质返回集管分成一部分，从而可以平滑地去除从半导体器件表面产生的气泡，从而冷却介质可以顺利地流动到半导体器件上。

公开(公告)号：US4977444A

公开(公告)日：1990-12-11

申请号：US261639

申请日：1988-10-24

申请人： Tadakatsu Nakajima ,  Heikichi Kuwahara ,  Shigeo Ohashi ,  Motohiro Satoh ,  Toshihiro Yamada ,  Kenichi Kasai ,  Satomi Kobayashi ,  Akihide Watanabe

发明人： Tadakatsu Nakajima ,  Heikichi Kuwahara ,  Shigeo Ohashi ,  Motohiro Satoh ,  Toshihiro Yamada ,  Kenichi Kasai ,  Satomi Kobayashi ,  Akihide Watanabe

IPC分类号： H01L23/473

CPC分类号： H01L23/473 ,  H01L23/4735 ,  H01L2924/0002

摘要： Flexible cooling paths are connected to semiconductor elements which are heated members. A cooling apparatus comprises cooling blocks connected to cooling blocks, coolant flow paths through which the coolant flows, coolant branching mechanisms provided in the coolant flow paths and connecting mechanism for connecting the branching mechanism and the cooling blocks through O-rings. A part of coolant flowing through the cooling flow paths is introduced into the cooling blocks for the respective heated chips in order.

摘要翻译： 柔性冷却路径连接到作为加热构件的半导体元件。 冷却装置包括连接到冷却块的冷却块，冷却剂流过的冷却剂流路，设置在冷却剂流动路径中的冷却剂分支机构和用于通过O形环连接分支机构和冷却块的连接机构。 流过冷却流路的冷却剂的一部分依次被引入各加热芯片的冷却块中。

公开(公告)号：US5805417A

公开(公告)日：1998-09-08

申请号：US728171

申请日：1996-10-09

申请人： Tsuyoshi Nakagawa ,  Yasushi Neho ,  Naoyuki Sakamoto ,  Shigeo Ohashi ,  Yoshito Ohmura ,  Yukiko Iwama ,  Tadakatsu Nakajima ,  Yoshihiro Kondo ,  Susumu Iwai ,  Hitoshi Matsushima

发明人： Tsuyoshi Nakagawa ,  Yasushi Neho ,  Naoyuki Sakamoto ,  Shigeo Ohashi ,  Yoshito Ohmura ,  Yukiko Iwama ,  Tadakatsu Nakajima ,  Yoshihiro Kondo ,  Susumu Iwai ,  Hitoshi Matsushima

IPC分类号： G06F1/20 ,  H05K1/02 ,  H05K1/14 ,  H05K1/18 ,  H05K3/36 ,  H05K7/20

CPC分类号： G06F1/203 ,  H05K1/141 ,  H05K1/0203 ,  H05K1/0204 ,  H05K1/182 ,  H05K2201/066 ,  H05K2201/09054 ,  H05K2201/09072 ,  H05K3/368

摘要： A personal computer comprises a heat dissipation plate installed on a floor of its case, a motherboard disposed apart from the heat dissipation plate by a predetermined distance, and a daughter board disposed in such a manner that the motherboard is positioned between the heat dissipation plate and the daughter board. The daughter board is mounted with a central processing unit which generates heat. The motherboard is provided with a hole. A heat dissipation block extends from the heat dissipation plate through the hole in the motherboard, and is connected to the central processing unit through a heat conductive coupler. This forms a heat dissipation path which passes through the central processing unit, the heat dissipation block, the heat dissipation plate, and the case. In addition, another heat dissipation block is interposed between a keyboard and the daughter board so that another heat dissipation path can be formed through the central processing unit, another heat dissipation block, another heat dissipation plate, and the keyboard. A heat pipe may be connected to a heat dissipation plate.

摘要翻译： 个人计算机包括安装在其壳体的地板上的散热板，与散热板隔开预定距离的母板和设置成使得主板位于散热板和 女儿板。 子板安装有产生热量的中央处理单元。 主板上有一个孔。 散热块从散热板延伸穿过主板的孔，并通过导热耦合器连接到中央处理单元。 这形成了通过中央处理单元，散热块，散热板和壳体的散热路径。 此外，在键盘和子板之间插入另一个散热块，从而可以通过中央处理单元，另一个散热块，另一个散热板和键盘形成另一个散热路径。 热管可以连接到散热板。

公开(公告)号：US6094343A

公开(公告)日：2000-07-25

申请号：US145737

申请日：1998-09-02

申请人： Tsuyoshi Nakagawa ,  Yasushi Neho ,  Naoyuki Sakamoto ,  Shigeo Ohashi ,  Yoshito Ohmura ,  Yukiko Iwama ,  Tadakatsu Nakajima ,  Yoshihiro Kondo ,  Susumu Iwai ,  Hitoshi Matsushima

发明人： Tsuyoshi Nakagawa ,  Yasushi Neho ,  Naoyuki Sakamoto ,  Shigeo Ohashi ,  Yoshito Ohmura ,  Yukiko Iwama ,  Tadakatsu Nakajima ,  Yoshihiro Kondo ,  Susumu Iwai ,  Hitoshi Matsushima

IPC分类号： G06F1/20 ,  H05K1/02 ,  H05K1/14 ,  H05K1/18 ,  H05K3/36 ,  H05K7/20

CPC分类号： G06F1/203 ,  H05K1/141 ,  H05K1/0203 ,  H05K1/0204 ,  H05K1/182 ,  H05K2201/066 ,  H05K2201/09054 ,  H05K2201/09072 ,  H05K3/368

摘要： A personal computer comprises a heat dissipation plate installed on a floor of its case, a motherboard disposed apart from the heat dissipation plate by a predetermined distance, and a daughter board disposed in such a manner that the motherboard is positioned between the heat dissipation plate and the daughter board. The daughter board is mounted with a central processing unit which generates heat. The motherboard is provided with a hole. A heat dissipation block extends from the heat dissipation plate through the hole in the motherboard, and is connected to the central processing unit through a heat conductive coupler. This forms a heat dissipation path which passes through the central processing unit, the heat dissipation block, the heat dissipation plate, and the case. In addition, another heat dissipation block is interposed between a keyboard and the daughter board so that another heat dissipation path can be formed through the central processing unit, another heat dissipation block, another heat dissipation plate, and the keyboard.

摘要翻译： 个人计算机包括安装在其壳体的地板上的散热板，与散热板隔开预定距离的母板和设置成使得主板位于散热板和 女儿板。 子板安装有产生热量的中央处理单元。 主板上有一个孔。 散热块从散热板延伸穿过主板的孔，并通过导热耦合器连接到中央处理单元。 这形成了通过中央处理单元，散热块，散热板和壳体的散热路径。 此外，在键盘和子板之间插入另一个散热块，从而可以通过中央处理单元，另一个散热块，另一个散热板和键盘形成另一个散热路径。

公开(公告)号：US5694294A

公开(公告)日：1997-12-02

申请号：US593049

申请日：1996-01-29

申请人： Shigeo Ohashi ,  Tadakatsu Nakajima ,  Yoshihiro Kondo ,  Mitsuru Honma ,  Kenji Onishi ,  Hiroshi Tsuzaki ,  Hitoshi Matsushima

发明人： Shigeo Ohashi ,  Tadakatsu Nakajima ,  Yoshihiro Kondo ,  Mitsuru Honma ,  Kenji Onishi ,  Hiroshi Tsuzaki ,  Hitoshi Matsushima

IPC分类号： G06F1/20 ,  H05K7/20

CPC分类号： G06F1/203

摘要： In a portable personal computer in which high-exothermic devices are mounted within a flat case equipped with an input unit, the and in which a surface temperature of the exothermic devices and the input unit is cooled down to or below a predetermined temperature. A first space is created between the back of a keyboard operating section and an electronic circuit board 3, the electronic circuit board 3 is installed so that the face thereof on which the high-exothermic devices are mounted faces away from the back of the keyboard, a second space is created between the electronic circuit board 3 and an electronic circuit board 2, and a fan 4 is installed inside the case so that cooling air flows from the first space to the second space. A flow path for circulating outside air into the case via an air intake hole 8 is constructed on the wall of the input device operating section.

摘要翻译： 在其中高放热装置安装在配备有输入单元的平坦壳体内并且其中放热装置和输入单元的表面温度被冷却到或低于预定温度的便携式个人计算机中。 在键盘操作部分的背面和电子电路板3之间产生第一空间，电子电路板3被安装成使得其上安装有高放热装置的表面远离键盘的背面， 在电子电路板3和电子电路板2之间产生第二空间，风扇4安装在壳体内部，使得冷却空气从第一空间流到第二空间。 用于经由进气孔8将外部空气循环到壳体中的流动路径被构造在输入装置操作部分的壁上。

公开(公告)号：US6094344A

公开(公告)日：2000-07-25

申请号：US433209

申请日：1999-11-04

申请人： Tsuyoshi Nakagawa ,  Yasushi Neho ,  Naoyuki Sakamoto ,  Shigeo Ohashi ,  Yoshito Ohmura ,  Yukiko Iwama ,  Tadakatsu Nakajima ,  Yoshihiro Kondo ,  Susumu Iwai ,  Hitoshi Matsushima

发明人： Tsuyoshi Nakagawa ,  Yasushi Neho ,  Naoyuki Sakamoto ,  Shigeo Ohashi ,  Yoshito Ohmura ,  Yukiko Iwama ,  Tadakatsu Nakajima ,  Yoshihiro Kondo ,  Susumu Iwai ,  Hitoshi Matsushima

IPC分类号： G06F1/20 ,  H05K1/02 ,  H05K1/14 ,  H05K1/18 ,  H05K3/36 ,  H05K7/20

CPC分类号： G06F1/203 ,  H05K1/141 ,  H05K1/0203 ,  H05K1/0204 ,  H05K1/182 ,  H05K2201/066 ,  H05K2201/09054 ,  H05K2201/09072 ,  H05K3/368

摘要： A personal computer including a bottomed case, a keyboard, a top cover forming with said keyboard, an upper face covering said bottomed case, and a heat dissipation structure disposed between the upper face and the bottomed case. The heat dissipation structure includes a printed circuit board having a current consuming device mounted thereon, a first heat dissipation plate disposed under the keyboard, and a first heat conductive block coupled to the first heat dissipation plate and the printed circuit board. The heat conductive block conducts heat generated by the current consuming device to the first heat dissipation plate. The heat dissipation structure further includes a second heat dissipation plate disposed on the bottomed case, and a second heat conductive block coupled to the second heat dissipation plate and the printed board, wherein the second heat conductive block conducts the heat generated by the current consuming device to the second heat dissipation plate.

摘要翻译： 一种个人计算机，包括底壳，键盘，用所述键盘形成的顶盖，覆盖所述有底壳体的上表面，以及设置在所述上​​表面和所述有底壳体之间的散热结构。 散热结构包括其上安装有电流消耗装置的印刷电路板，设置在键盘下方的第一散热板和耦合到第一散热板和印刷电路板的第一导热块。 导热块将由电流消耗装置产生的热量传导到第一散热板。 散热结构还包括设置在有底壳体上的第二散热板和耦合到第二散热板和印刷板的第二导热块，其中第二导热块传导由电流消耗装置产生的热量 到第二散热板。

公开(公告)号：US4949164A

公开(公告)日：1990-08-14

申请号：US216704

申请日：1988-07-07

申请人： Shigeo Ohashi ,  Heikichi Kuwabara ,  Tadakatsu Nakajima ,  Wataru Nakayama ,  Motohiro Sato ,  Kenichi Kasai

发明人： Shigeo Ohashi ,  Heikichi Kuwabara ,  Tadakatsu Nakajima ,  Wataru Nakayama ,  Motohiro Sato ,  Kenichi Kasai

IPC分类号： H01L23/427

CPC分类号： H01L23/427 ,  H01L23/44 ,  H01L2924/0002

摘要： High heat generation member of electronic integrated circuit etc. is boiled and cooled. A refrigerant steam is generated by cooling of the heat generation member and is condensed by a condenser which is provided an upper portion. A refrigerant steam flow path and a condensed refrigerant flow path from the condenser are separated with a partition wall. The condensed liquid sent back to the partition wall is supplied to the heat generation member through the partition wall.

公开(公告)号：US06449149B1

公开(公告)日：2002-09-10

申请号：US09057339

申请日：1998-04-09

申请人： Shigeo Ohashi ,  Takashi Naganawa ,  Tadakatsu Nakajima ,  Tsuyoshi Nakagawa ,  Masaaki Eishima ,  Yoshihiro Kondo

发明人： Shigeo Ohashi ,  Takashi Naganawa ,  Tadakatsu Nakajima ,  Tsuyoshi Nakagawa ,  Masaaki Eishima ,  Yoshihiro Kondo

IPC分类号： G06F116

CPC分类号： G06F1/203 ,  G06F2200/203

摘要： An electronic equipment includes a first casing on which are mounted a keyboard and a wiring board and a second casing which is rotatably mounted on the first casing by means of a hinge. The cooling structure of the electronic equipment includes one or more elements that is the subject of cooling arranged within the first casing, a first heat-discharging member thermally connected with this element and the first casing, a second heat-discharging member that is arranged in the interior of the second casing, and connection means for thermally connecting the first heat-discharging element and the second heat-discharging element.

摘要翻译： 电子设备包括：第一壳体，其上安装有键盘和布线板;第二壳体，其通过铰链可旋转地安装在第一壳体上。 电子设备的冷却结构包括作为第一壳体内的冷却对象的一个​​或多个元件，与该元件和第一壳体热连接的第一加热排放构件，第二加热排出构件，其布置在 第二壳体的内部和用于热连接第一散热元件和第二散热元件的连接装置。

公开(公告)号：US06185481B2

公开(公告)日：2001-02-06

申请号：US08969361

申请日：1997-11-28

申请人： Yoshihiro Kondou ,  Tadakatsu Nakajima ,  Shigeo Ohashi ,  Susumu Iwai ,  Masayoshi Miyazaki ,  Shoohei Fuse ,  Kazuo Morita ,  Hidetada Fukunaka

发明人： Yoshihiro Kondou ,  Tadakatsu Nakajima ,  Shigeo Ohashi ,  Susumu Iwai ,  Masayoshi Miyazaki ,  Shoohei Fuse ,  Kazuo Morita ,  Hidetada Fukunaka

IPC分类号： G05B1300

CPC分类号： H05K7/20154 ,  H01L2924/0002 ,  H05K7/2019 ,  H01L2924/00

摘要： A semiconductor device provided with a first cooling fan and heat-radiating fins is mounted on a board, and there is provided a second cooling fan for supplying cooling air to the board, such that a flow passage is formed for directing the cooling air, supplied from the second cooling fan, toward the board through the first cooling fan.

摘要翻译： 设置有第一冷却风扇和散热翅片的半导体装置安装在基板上，并且设置有用于向板供给冷却空气的第二冷却风扇，从而形成用于引导冷却空气的流动通道，供给 从第二个冷却风扇，通过第一个冷却风扇朝向板子。