摘要:
A stage apparatus which can highly accurately measure the position of a stage, while achieving a high throughput, and an exposure apparatus provided with the stage apparatus. A stage apparatus is provided with: air-conditioning apparatuses (28X, 28Y) that supply temperature controlled air (down flow), which comes from a +Z direction to a −Z direction, to a light path of a laser beam radiated from a laser interferometer onto moving mirrors (26X, 26Y) provided on a wafer stage (WST); and an air conditioning apparatus (29) that supplies temperature controlled air (lower layer side flow), which comes from a −Y direction to a +Y direction, to a space lower than the light path of the laser beam. Furthermore, an air conditioning apparatus (34), which supplied temperature controlled air to a light path of an autofocusing sensor composed of an irradiation optical system (33a) and a light receiving optical system (33b), is provided.
摘要:
The exposure system comprises a projection optical system that irradiates exposure light emitted from a mask onto a substrate, a first support member that supports the projection optical system, and a support structure that supports the first support member, wherein the support member supports the first support member at a position that is higher than the position at which the first support member supports the projection optical system.
摘要:
The exposure system comprises a projection optical system that irradiates exposure light emitted from a mask onto a substrate, a first support member that supports the projection optical system, and a support structure that supports the first support member, wherein the support member supports the first support member at a position that is higher than the position at which the first support member supports the projection optical system.
摘要:
An exposure apparatus transfers a pattern of a mask onto a substrate and includes a covering member which is disposed in the exposure apparatus and which substantially isolates a predetermined spacing from outside gas. The covering member includes a first thin film made of a first material which blocks penetration of the outside gas with respect to the predetermined spacing and a second thin film having a low degasification property and made of a second material of at least one of a metal and an inorganic substance. An exposure method transfers a pattern of a mask onto a substrate and includes the steps of isolating a part spacing of an optical path spacing for an exposure beam which transfers the pattern of the mask onto the substrate from outside gas by using such a covering member.
摘要:
The thickness of a substrate is one of the most important parameters in detecting the flexure of the substrate. The thickness of a reference substrate disposed on a stage and its amount of flexure are measured. Thus measured data are stored in a memory of apparatus. Then, the apparatus measures the thickness of a substrate to be measured. The data concerning thus measured thickness of the substrate to be measured and the data concerning the thickness and amount of flexure of the reference substrate stored in the memory are utilized to calculate the amount of flexure of the substrate to be measured. This apparatus measures the pattern position of the substrate to be measured in thus flexed state. The apparatus corrects thus measured pattern position of the substrate to be measured on the basis of the amount of flexure which has been indirectly measured as mentioned above.
摘要:
An improved ink-jet printer of the so-called current flow type wherein a current is passed through a conductive ink contained between a pair of electrodes so as to cause the ink to become vaporized and cause trapped gasses or bubbles to expand suddenly, exerting a sufficient pressure upon the ink to force a droplet of ink from a nozzle is disclosed, wherein at least one projection of electrically insulating material is disposed between the pair of electrode for increasing the density of the current at a position directly below a nozzle. With the projection thus provided, only a limited portion of the conductive ink participates in the generation of heat, and boiling of the conductive ink takes place only at the position directly below the nozzle. Accordingly, droplets of conductive ink are produced with minimum power consumption and can be ejected in a uniform direction. The position where boiling of the conductive ink takes place is remote from the electrodes, so that the electrodes are substantially free from cavitation and thermal shock and, hence, they have a long life span.
摘要:
The invention provides an electrofusion joint made of a thermoplastic resin for connection with a resin pipe by heat generation of heating wires embedded in its saddle portion through electric conduction, such as a saddle joint comprising a saddle portion to be fitted to an outer circumferential surface of a resin pipe provided with heating wires embedded in its surface to be joined to the resin pipe, also comprising a spigot projecting from the saddle portion and to which a branch pipe is to be connected, or a service tee joint comprising a saddle portion in which heating wires are embedded, a trunk portion projecting from the saddle portion and a spigot projecting in a lateral direction from the trunk portion. A recess is formed in a part on the collar portion side along the base of the spigot of the saddle joint or trunk portion of the service tee joint, to increase the length from the recess to the collar portion where a latch of a clamping device is engaged, so that the collar portion becomes sufficiently flexible to achieve closer contact with the pipe and to prevent defective fusion welding, even though wall thickness or rigidity of the saddle portion is large.
摘要:
With respect to a projection exposure apparatus in which a reticle is illuminated with an exposure beam and a wafer is exposed with the exposure beam via a projection optical system, the projection optical system is mounted on a frame mechanism slidable on a level block, and a wafer stage system is provided, on the level block, inside of the frame mechanism. Further, in order to pull the projection optical system out of the main body of the projection exposure apparatus, an adjustment table is provided separately from the level block, and after the wafer stage system being moved, the frame mechanism is moved onto the adjustment table, in a state that the frame mechanism is supporting the projection optical system.