公开(公告)号：US08288869B2

公开(公告)日：2012-10-16

申请号：US12779818

申请日：2010-05-13

申请人： Shih-Fu Huang ,  Yuan-Chang Su ,  Chia-Cheng Chen ,  Kuang-Hsiung Chen ,  Ming-Chiang Lee ,  Bernd Karl Appelt ,  Chia-Hsiung Hsieh

发明人： Shih-Fu Huang ,  Yuan-Chang Su ,  Chia-Cheng Chen ,  Kuang-Hsiung Chen ,  Ming-Chiang Lee ,  Bernd Karl Appelt ,  Chia-Hsiung Hsieh

IPC分类号： H01L23/48

CPC分类号： H01L23/49827 ,  H01L21/486 ,  H01L23/145 ,  H01L24/16 ,  H01L24/28 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/13099 ,  H01L2224/16237 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/484 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/49 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/0665 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/85399 ,  H01L2224/05599

摘要： A semiconductor package includes a substrate, a die, and a package body. The substrate includes: (a) a core including a resin reinforced with fibers; (b) a plurality of openings extending through the core; (c) a dielectric layer; and (d) a single conductive layer disposed between the dielectric layer and the core. Portions of a lower surface of the single conductive layer cover the plurality of openings to form a plurality of first contact pads for electrical connection external to the semiconductor package. Exposed portions of an upper surface of the single conductive layer form a plurality of second contact pads. The die is electrically connected to the plurality of second contact pads, and the package body encapsulates the die.

摘要翻译： 半导体封装包括基板，管芯和封装体。 基材包括：（a）包含用纤维增强的树脂的芯; （b）延伸穿过所述芯的多个开口; （c）电介质层; 和（d）设置在电介质层和芯之间的单个导电层。 单个导电层的下表面的一部分覆盖多个开口以形成多个用于半导体封装外部电连接的第一接触焊盘。 单个导电层的上表面的暴露部分形成多个第二接触焊盘。 模具电连接到多个第二接触焊盘，并且封装体封装模具。

公开(公告)号：US20100320610A1

公开(公告)日：2010-12-23

申请号：US12779818

申请日：2010-05-13

申请人： SHIH-FU HUANG ,  Yuan-Chang Su ,  Chia-Cheng Chen ,  Kuang-Hsiung Chen ,  Ming-Chiang Lee ,  Bernd Karl Appelt ,  Chia-Hsiung Hsieh

发明人： SHIH-FU HUANG ,  Yuan-Chang Su ,  Chia-Cheng Chen ,  Kuang-Hsiung Chen ,  Ming-Chiang Lee ,  Bernd Karl Appelt ,  Chia-Hsiung Hsieh

IPC分类号： H01L23/48 ,  H01L21/768

CPC分类号： H01L23/49827 ,  H01L21/486 ,  H01L23/145 ,  H01L24/16 ,  H01L24/28 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/13099 ,  H01L2224/16237 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/484 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/49 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/0665 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/85399 ,  H01L2224/05599

摘要： A semiconductor package includes a substrate, a die, and a package body. The substrate includes: (a) a core including a resin reinforced with fibers; (b) a plurality of openings extending through the core; (c) a dielectric layer; and (d) a single conductive layer disposed between the dielectric layer and the core. Portions of a lower surface of the single conductive layer cover the plurality of openings to form a plurality of first contact pads for electrical connection external to the semiconductor package. Exposed portions of an upper surface of the single conductive layer form a plurality of second contact pads. The die is electrically connected to the plurality of second contact pads, and the package body encapsulates the die.

摘要翻译： 半导体封装包括基板，管芯和封装体。 基材包括：（a）包含用纤维增强的树脂的芯; （b）延伸穿过所述芯的多个开口; （c）电介质层; 和（d）设置在电介质层和芯之间的单个导电层。 单个导电层的下表面的一部分覆盖多个开口以形成多个用于半导体封装外部电连接的第一接触焊盘。 单个导电层的上表面的暴露部分形成多个第二接触焊盘。 模具电连接到多个第二接触焊盘，并且封装体封装模具。

公开(公告)号：US08786062B2

公开(公告)日：2014-07-22

申请号：US12904799

申请日：2010-10-14

申请人： Yuan-Chang Su ,  Shih-Fu Huang ,  Chia-Cheng Chen ,  Chia-Hsiung Hsieh ,  Tzu-Hui Chen ,  Kuang-Hsiung Chen ,  Pao-Ming Hsieh

发明人： Yuan-Chang Su ,  Shih-Fu Huang ,  Chia-Cheng Chen ,  Chia-Hsiung Hsieh ,  Tzu-Hui Chen ,  Kuang-Hsiung Chen ,  Pao-Ming Hsieh

IPC分类号： H01L21/683 ,  H01L23/31 ,  H01L23/498

CPC分类号： H01L23/3128 ,  H01L21/6835 ,  H01L23/49816 ,  H01L23/49827 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L2221/68345 ,  H01L2224/27013 ,  H01L2224/32188 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/484 ,  H01L2224/73265 ,  H01L2224/83051 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/078 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/85399 ,  H01L2224/05599

摘要： A package carrier includes: (a) a dielectric layer defining a plurality of openings; (b) patterned electrically conductive layer, embedded in the dielectric layer and disposed adjacent to a first surface of the dielectric layer; a plurality of electrically conductive posts, disposed in respective ones of the openings, wherein the openings extend between a second surface of the dielectric layer to the patterned electrically conductive layer, the electrically conductive posts a connected to the patterned electrically conductive layer, and an end of each of the electrically conductive posts has a curved profile and is faced away from the patterned electrically conductive layer; and (d) a patterned solder resist layer, disposed adjacent to the first surface of the dielectric layer and exposing portions of the patterned electrically conductive layer corresponding to contact pads. A semiconductor package includes the package carrier, a chip, and an encapsulant covering the chip and the package carrier.

摘要翻译： 包装载体包括：（a）限定多个开口的电介质层; （b）图案化的导电层，嵌入在介电层中并邻近介质层的第一表面设置; 多个导电柱，设置在相应的一个开口中，其中开口在介电层的第二表面与图案化的导电层之间延伸，导电柱a连接到图案化的导电层，端部 每个导电柱具有弯曲轮廓并且背离图案化的导电层; 和（d）图案化的阻焊层，邻近电介质层的第一表面设置并暴露与接触焊盘对应的图案化导电层的部分。 半导体封装包括封装载体，芯片和覆盖芯片和封装载体的密封剂。

公开(公告)号：US20110056736A1

公开(公告)日：2011-03-10

申请号：US12694539

申请日：2010-01-27

申请人： SHIH-FU HUANG ,  Yuan-Chang Su ,  Chia-Hsiung Hsieh

发明人： SHIH-FU HUANG ,  Yuan-Chang Su ,  Chia-Hsiung Hsieh

IPC分类号： H05K1/16 ,  H05K1/11 ,  H05K3/46 ,  H05K3/02 ,  H05K3/06

CPC分类号： H05K3/403 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/15311 ,  H05K3/027 ,  H05K3/427 ,  H05K2201/09645 ,  H05K2203/107 ,  H01L2924/00

摘要： A circuit board, a chip package structure and a fabrication method of the circuit board are provided. By applying the fabrication method, a plurality of conductive channels can be formed in a single through hole of the circuit substrate. Unlike the conductive channels respectively formed in the through holes according to the related art, the conductive channels of the proposed circuit board can be formed in a single through hole. As such, it is conducive to the expansion of available layout area of the circuit board, the increase in layout flexibility, and the improvement of layout density of the circuit board.

摘要翻译： 提供电路板，芯片封装结构和电路板的制造方法。 通过应用制造方法，可以在电路基板的单个通孔中形成多个导电沟道。 与根据现有技术的通孔中分别形成的导电通道不同，所提出的电路板的导电通道可以形成在单个通孔中。 因此，有利于电路板可用布局面积的扩大，布局灵活性的提高以及电路板布局密度的提高。

公开(公告)号：US08357861B2

公开(公告)日：2013-01-22

申请号：US12694539

申请日：2010-01-27

申请人： Shih-Fu Huang ,  Yuan-Chang Su ,  Chia-Hsiung Hsieh

发明人： Shih-Fu Huang ,  Yuan-Chang Su ,  Chia-Hsiung Hsieh

IPC分类号： H05K1/11

CPC分类号： H05K3/403 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/15311 ,  H05K3/027 ,  H05K3/427 ,  H05K2201/09645 ,  H05K2203/107 ,  H01L2924/00

摘要： A circuit board, a chip package structure and a fabrication method of the circuit board are provided. By applying the fabrication method, a plurality of conductive channels can be formed in a single through hole of the circuit substrate. Unlike the conductive channels respectively formed in the through holes according to the related art, the conductive channels of the proposed circuit board can be formed in a single through hole. As such, it is conducive to the expansion of available layout area of the circuit board, the increase in layout flexibility, and the improvement of layout density of the circuit board.

摘要翻译： 提供电路板，芯片封装结构和电路板的制造方法。 通过应用制造方法，可以在电路基板的单个通孔中形成多个导电沟道。 与根据现有技术的通孔中分别形成的导电通道不同，所提出的电路板的导电通道可以形成在单个通孔中。 因此，有利于电路板可用布局面积的扩大，布局灵活性的提高以及电路板布局密度的提高。