公开(公告)号：US5938862A

公开(公告)日：1999-08-17

申请号：US70070

申请日：1998-04-03

申请人： Shing Yeh ,  Curtis Wayne Melcher ,  Bradley Howard Carter

发明人： Shing Yeh ,  Curtis Wayne Melcher ,  Bradley Howard Carter

IPC分类号： B23K35/26 ,  C22C13/00 ,  C22C7/00

CPC分类号： B23K35/262 ,  C22C13/00

摘要： A lead-free solder alloy suitable for forming solder joints of a surface-mount integrated circuit device, such as a flip chip. The solder alloy has a sufficiently low liquidus temperature to achieve desirable reflow properties at temperatures of 240.degree. C. and less, and is therefore compatible with integrated circuit processes. The solder alloy has a sufficiently high solidus temperature to ensure that solder joints formed with the alloy exhibit suitable mechanical properties at application temperatures up to 150.degree. C. when mounting a component to a laminate substrate. The solder alloy generally contains, in weight percent, about 7 to about 11% indium, about 2.5 to about 3.5% silver, and about 0.5 to about 1.5% copper, the balance tin and incidental impurities.

摘要翻译： 适用于形成表面贴装集成电路器件如倒装芯片的焊点的无铅焊料合金。 焊料合金具有足够低的液相线温度，以在240℃以下的温度下实现期望的回流性能，因此与集成电路工艺兼容。 焊料合金具有足够高的固相线温度，以确保当将组件安装到层压基板上时，由合金形成的焊点在高达150℃的应用温度下表现出适当的机械性能。 焊料合金通常含有约7至约11％的铟，约2.5至约3.5％的银和约0.5至约1.5％的铜，余量为锡和附带的杂质。

公开(公告)号：US5803340A

公开(公告)日：1998-09-08

申请号：US536592

申请日：1995-09-29

申请人： Shing Yeh ,  Bradley Howard Carter

发明人： Shing Yeh ,  Bradley Howard Carter

IPC分类号： B23K35/22 ,  B23K35/02 ,  B23K35/14 ,  B23K35/26 ,  H01L21/60 ,  H01L23/485 ,  H05K3/34 ,  H01L21/441

CPC分类号： H01L24/10 ,  B23K35/025 ,  B23K35/268 ,  H01L24/13 ,  H05K3/3484 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15787 ,  H05K2201/0272 ,  H05K2203/043 ,  H05K2203/0568 ,  H05K2203/0769 ,  H05K3/3463

摘要： Composite solder paste compositions adapted to be deposited using a dry film photoresist mask to form solder joints for flip chip integrated circuit devices. The composite solder paste compositions are characterized by the ability to flow at a first temperature during bumping reflow while the photoresist mask is present, yet upon subsequently reheating to a higher temperature yield solder joints capable of withstanding temperatures of 200.degree. C. and higher. As such, the present invention retains the advantages associated with using a dry film photoresist as a mask during deposition of the solder, yet results in the formation of solder joints that exhibit enhanced reliability in severe thermal environments.

摘要翻译： 适用于使用干膜光致抗蚀剂掩模沉积的复合焊膏组合物以形成倒装芯片集成电路器件的焊接接头。 复合焊膏组合物的特征在于在凸起回流期间在第一温度下流动的能力，同时存在光致抗蚀剂掩模，然后在随后再加热至更高温度时产生能够承受200℃及更高温度的焊点。 因此，本发明保留了在沉积焊料期间使用干膜光致抗蚀剂作为掩模相关的优点，但是导致在严酷的热环境中表现出增强的可靠性的焊点的形成。

公开(公告)号：US06221514B1

公开(公告)日：2001-04-24

申请号：US09385051

申请日：1999-08-30

申请人： Kevin Joseph Hawes ,  David Jay Vess ,  Dwadasi Hare Rama Sarma ,  Bradley Howard Carter ,  Jerome Anthony Schneider

发明人： Kevin Joseph Hawes ,  David Jay Vess ,  Dwadasi Hare Rama Sarma ,  Bradley Howard Carter ,  Jerome Anthony Schneider

IPC分类号： B32B1502

CPC分类号： H05K1/0265 ,  B23K35/0222 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/262 ,  H05K1/09 ,  H05K3/1225 ,  H05K3/245 ,  H05K2201/0215 ,  H05K2203/043 ,  Y10S428/901 ,  Y10S428/931 ,  Y10T428/12014 ,  Y10T428/12708 ,  Y10T428/12715

摘要： A method by which a conventional circuit trace (14) is modified with a layer (16) of high-conductivity solder alloy to yield a high-current circuit trace (12) for high-current routing on a substrate (10). The method generally entails the use of a solder composition that contains a dispersion of metal particles (18) in a solder alloy (20). The metal particles (18) are selected on the basis of having a higher electrical conductivity than the solder alloy (20), and are present in sufficient amounts so that the electrical conductivity of the solder composition is significantly higher than that of the solder alloy (20). The solder composition is deposited on a conductor (14), and then reflowed to form a conductive layer (16) on the conductor (14). The metal particles (18) remain as a discrete dispersion within the conductive layer (16) in order to suitably promote the conductivity of the layer (16). The solder composition is preferably deposited in an amount sufficient to increase the current-carrying capacity of the resulting circuit trace (12) for high-current routing on the substrate (10), e.g., in excess of six amps.

摘要翻译： 常规电路迹线（14）用高导电性焊料合金的层（16）修饰以产生用于衬底（10）上的大电流布线的高电流电路迹线（12）的方法。 该方法通常需要使用包含金属颗粒（18）在焊料合金（20）中的分散体的焊料组合物。 基于具有比焊料合金（20）更高的导电性来选择金属颗粒（18），并且以足够的量存在，使得焊料组合物的电导率显着高于焊料合金的导电性（ 20）。 焊料组合物沉积在导体（14）上，然后回流以在导体（14）上形成导电层（16）。 为了适当地促进层（16）的导电性，金属颗粒（18）保持为导电层（16）内的离散分散体。 焊料组合物优选以足以增加所得到的电路迹线（12）的载流能力的量沉积，用于在衬底（10）上的高电流布线，例如超过6安培。

公开(公告)号：US06328914B1

公开(公告)日：2001-12-11

申请号：US09240084

申请日：1999-01-29

申请人： Frans Peter Lautzenhiser ,  Carl William Berlin ,  Bradley Howard Carter ,  Dwadasi Hare Rama Sarma ,  John Karl Isenberg

发明人： Frans Peter Lautzenhiser ,  Carl William Berlin ,  Bradley Howard Carter ,  Dwadasi Hare Rama Sarma ,  John Karl Isenberg

IPC分类号： H01B106

CPC分类号： H01L23/49883 ,  H01L21/563 ,  H01L2224/73203 ,  H01L2924/01025 ,  H01L2924/01046 ,  H01L2924/01068 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H05K1/092

摘要： A thick-film paste for printing thick-film circuit elements, including solder stops, conductors, resistors and capacitors, and a method for using the paste. The paste has a composition that includes an organic vehicle, a filler material that contributes the desired electrical and/or material properties to the thick film fired from the paste, and an additive that is insoluble in the organic vehicle and contributes pseudoplastic Theological properties to the paste during printing. The additive also preferably evaporates, burns off, sublimates or is otherwise removed below the firing temperature of the paste.

摘要翻译： 用于印刷厚膜电路元件的厚膜浆料，包括焊料停止点，导体，电阻器和电容器，以及使用该糊料的方法。 该糊剂具有包含有机载体，填充材料，其对于从该糊状物发射的厚膜有助于所需的电气和/或材料性质，以及不溶于有机载体的添加剂，并且对于 打印期间粘贴。 添加剂还优选蒸发，燃烧，升华或以其它方式除去低于糊料的焙烧温度。