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    Method of polishing a multi-layer substrate
    1.
    发明授权
    Method of polishing a multi-layer substrate 有权
    抛光多层基材的方法

    公开(公告)号：US06867140B2

    公开(公告)日：2005-03-15

    申请号：US10353512

    申请日：2003-01-29

    申请人： Shumin Wang ,  Vlasta Brusic Kaufman ,  Steven K. Grumbine ,  Isaac K. Cherian

    发明人： Shumin Wang ,  Vlasta Brusic Kaufman ,  Steven K. Grumbine ,  Isaac K. Cherian

    IPC分类号： C09G1/02 ,  H01L21/321 ,  H01L21/302

    CPC分类号： H01L21/3212 ,  C09G1/02

    摘要： The invention provides a method for polishing one or more layers of a multi-layer substrate that includes a first metal layer and a second layer comprising (i) contacting the first metal layer with a polishing system comprising a liquid carrier, at least one oxidizing agent, at least one polishing additive that increases the rate at which the system polishes at least one layer of the substrate, at least one stopping compound with a polishing selectivity of the first metal layer:second layer of at least about 30:1, wherein the stopping compound is a cationically charged nitrogen containing compound selected from compounds comprising amines, imines, amides, imides, and mixtures thereof, and a polishing pad and/or an abrasive, and (ii) polishing the first metal layer with the system until at least a portion of the first metal layer is removed from the substrate.

    摘要翻译： 本发明提供了一种用于抛光一层或多层多层基材的方法，所述多层基材包括第一金属层和第二层，其包括（i）使第一金属层与包括液体载体，至少一种氧化剂 至少一种抛光添加剂，其增加系统抛光至少一层基材的速率，至少一种具有至少约30:1的第一金属层的抛光选择性的停止化合物：第二层，其至少约30:1 停止化合物是选自包含胺，亚胺，酰胺，酰亚胺及其混合物的化合物的阳离子充氮的含氮化合物，以及抛光垫和/或研磨剂，和（ii）用系统抛光第一金属层直到至少 从衬底去除第一金属层的一部分。

    Method of polishing a multi-layer substrate
    2.
    发明授权
    Method of polishing a multi-layer substrate 有权
    抛光多层基材的方法

    公开(公告)号：US06852632B2

    公开(公告)日：2005-02-08

    申请号：US10353542

    申请日：2003-01-29

    申请人： Shumin Wang ,  Vlasta Brusic Kaufman ,  Steven K. Grumbine ,  Isaac K. Cherian ,  Renjie Zhou

    发明人： Shumin Wang ,  Vlasta Brusic Kaufman ,  Steven K. Grumbine ,  Isaac K. Cherian ,  Renjie Zhou

    IPC分类号： B24B57/02 ,  B24D11/00 ,  C09G1/02 ,  C09K3/14 ,  H01L21/304 ,  H01L21/302 ,  C09K13/00

    CPC分类号： C09G1/02

    摘要： The invention provides a method for polishing one or more layers of a multi-layer substrate that includes a first metal layer and a second layer comprising (i) contacting the first metal layer with a polishing system comprising a liquid carrier, at least one oxidizing agent, at least one polishing additive that increases the rate at which the system polishes at least one layer of the substrate, wherein the polishing additive is selected from the group consisting of pyrophosphates, condensed phosphates, phosphonic acids and salts thereof, amines, amino alcohols, amides, imines, imino acids, nitriles, nitros, thiols thioesters, thioethers, carbothiolic acids, carbothionic acids, thiocarboxylic acids, thiosalicylic acids, and mixtures thereof, and a polishing pad and/or an abrasive, and (ii) polishing the first metal layer with the system until at least a portion of the first metal layer is removed from the substrate.

    摘要翻译： 本发明提供了一种用于抛光一层或多层多层基材的方法，所述多层基材包括第一金属层和第二层，其包括（i）使第一金属层与包括液体载体，至少一种氧化剂 至少一种抛光添加剂，其增加系统抛光至少一层基材的速率，其中所述抛光添加剂选自焦磷酸盐，缩合磷酸盐，膦酸及其盐，胺，氨基醇， 酰胺，亚胺，亚氨基酸，腈，亚硝基，硫醇硫酯，硫醚，硫代硫酸，碳硫酸，硫代羧酸，硫代水杨酸及其混合物，以及抛光垫和/或磨料，和（ii） 层，直到第一金属层的至少一部分从衬底去除。

    Polishing system with stopping compound and method of its use
    3.
    发明授权
    Polishing system with stopping compound and method of its use 有权
    具有停车复合抛光系统及其使用方法

    公开(公告)号：US06855266B1

    公开(公告)日：2005-02-15

    申请号：US09636246

    申请日：2000-08-10

    申请人： Shumin Wang ,  Vlasta Brusic Kaufman ,  Steven K. Grumbine ,  Isaac K. Cherian

    发明人： Shumin Wang ,  Vlasta Brusic Kaufman ,  Steven K. Grumbine ,  Isaac K. Cherian

    IPC分类号： C09G1/02 ,  H01L21/321 ,  C09K13/00

    CPC分类号： H01L21/3212 ,  C09G1/02

    摘要： The invention provides a system for polishing one or more layers of a multi-layer substrate that includes a first metal layer and a second layer comprising (i) a liquid carrier, (ii) at least one oxidizing agent, (iii) at least one polishing additive that increases the rate at which the system polishes at least one layer of the substrate, (iv) at least one stopping compound with a polishing selectivity of the first metal layer:second layer of at least about 30:1, and (v) a polishing pad and/or an abrasive. The invention also provides a composition comprising (i) a liquid carrier, (ii) at least one oxidizing agent, (iii) at least one polishing additive (iv) at least one stopping compound with a polishing selectivity of the first metal layer:second layer of at least about 30:1, to be used with (v) a polishing pad and/or an abrasive.

    摘要翻译： 本发明提供一种用于抛光多层基底的一层或多层的系统，其包括第一金属层和第二层，所述第二层包括（i）液体载体，（ii）至少一种氧化剂，（iii）至少一种 抛光添加剂，其增加系统抛光至少一层基材的速率，（iv）至少一种具有第一金属层的抛光选择性的停止化合物：至少约30:1的第二层，和（v ）抛光垫和/或磨料。 本发明还提供一种组合物，其包含（i）液体载体，（ii）至少一种氧化剂，（iii）至少一种抛光添加剂（iv）至少一种具有第一金属层的抛光选择性的停止化合物：第二 至少约30:1的层，与（v）抛光垫和/或研磨剂一起使用。