-
公开(公告)号：US06852632B2
公开(公告)日：2005-02-08
申请号：US10353542
申请日：2003-01-29
IPC分类号： B24B57/02 , B24D11/00 , C09G1/02 , C09K3/14 , H01L21/304 , H01L21/302 , C09K13/00
CPC分类号： C09G1/02
摘要： The invention provides a method for polishing one or more layers of a multi-layer substrate that includes a first metal layer and a second layer comprising (i) contacting the first metal layer with a polishing system comprising a liquid carrier, at least one oxidizing agent, at least one polishing additive that increases the rate at which the system polishes at least one layer of the substrate, wherein the polishing additive is selected from the group consisting of pyrophosphates, condensed phosphates, phosphonic acids and salts thereof, amines, amino alcohols, amides, imines, imino acids, nitriles, nitros, thiols thioesters, thioethers, carbothiolic acids, carbothionic acids, thiocarboxylic acids, thiosalicylic acids, and mixtures thereof, and a polishing pad and/or an abrasive, and (ii) polishing the first metal layer with the system until at least a portion of the first metal layer is removed from the substrate.
摘要翻译： 本发明提供了一种用于抛光一层或多层多层基材的方法，所述多层基材包括第一金属层和第二层，其包括（i）使第一金属层与包括液体载体，至少一种氧化剂 至少一种抛光添加剂，其增加系统抛光至少一层基材的速率，其中所述抛光添加剂选自焦磷酸盐，缩合磷酸盐，膦酸及其盐，胺，氨基醇， 酰胺，亚胺，亚氨基酸，腈，亚硝基，硫醇硫酯，硫醚，硫代硫酸，碳硫酸，硫代羧酸，硫代水杨酸及其混合物，以及抛光垫和/或磨料，和（ii） 层，直到第一金属层的至少一部分从衬底去除。
-
公开(公告)号：US06705926B2
公开(公告)日：2004-03-16
申请号：US10033152
申请日：2001-10-24
IPC分类号： B24D334
CPC分类号： B24B37/24 , B24B37/245 , C09G1/02 , C09K3/1463 , H01L21/3212 , Y10T156/1051
摘要： The invention provides a chemical-mechanical polishing system comprising an abrasive, a carrier, and either boric acid, or a conjugate base thereof, wherein the boric acid and conjugate base are not present together in the polishing system in a sufficient amount to act as a pH buffer, or a water-soluble boron-containing compound, or salt thereof, that is not boric acid, and a method of polishing a substrate using the chemical-mechanical polishing system.
-
公开(公告)号：US07311856B2
公开(公告)日：2007-12-25
申请号：US11093806
申请日：2005-03-30
申请人： Renjie Zhou , Steven K. Grumbine , Jian Zhang , Isaac K. Cherian
发明人： Renjie Zhou , Steven K. Grumbine , Jian Zhang , Isaac K. Cherian
IPC分类号： C09K13/00 , C09K13/06 , H01L21/302
CPC分类号： H01L21/3212 , C09G1/02 , C09K3/1463 , C11D1/008 , C11D1/58 , C11D11/0047 , C11D17/049
摘要： The invention provides a chemical-mechanical polishing system comprising a polishing component, a surfactant, and a liquid carrier. The invention further provides a method of chemically-mechanically polishing a substrate with the polishing system.
摘要翻译： 本发明提供一种包括抛光组分，表面活性剂和液体载体的化学机械抛光系统。 本发明还提供了一种用抛光系统对衬底进行化学机械抛光的方法。
-
公开(公告)号：US06527622B1
公开(公告)日：2003-03-04
申请号：US10054059
申请日：2002-01-22
IPC分类号： B24B100
CPC分类号： H01L21/3212 , B24B37/044 , C09G1/02 , C09K3/1463 , C23F3/04 , C23F3/06 , H01L28/65
摘要： The invention provides a method of polishing a substrate comprising a noble metal comprising (i) contacting the substrate with a CMP system and (ii) abrading at least a portion of the substrate to polish the substrate. The CMP systems each comprise an abrasive and/or polishing pad, a liquid carrier, and optionally one or more polishing additives. In a first embodiment, the polishing additives are selected from the group consisting of diketones, diketonates, heterocyclic nitrogen-containing compounds, heterocyclic oxygen-containing compounds, heterocyclic phosphorus-containing compounds, urea compounds, nitrogen-containing compounds that can be zwitterionic compounds, salts thereof, and combinations thereof. In a second embodiment, the polishing additive is a metal compound with two or more oxidation states and is used in conjunction with a peroxy-type oxidizer. In a third embodiment, the CMP system comprises &agr;-alumina and fumed alumina, wherein the weight ratio of &agr;-alumina to fumed alumina is about 0.6:1 to about 9:1.
摘要翻译： 本发明提供一种抛光包括贵金属的基材的方法，包括（i）使基板与CMP系统接触，以及（ii）研磨基材的至少一部分以抛光基材。 CMP系统各自包括磨料和/或抛光垫，液体载体和任选的一种或多种抛光添加剂。 在第一实施方案中，抛光添加剂选自二酮，二酮，杂环含氮化合物，含杂环氧的化合物，含杂环的化合物，尿素化合物，可以是两性离子化合物的含氮化合物， 其盐，及其组合。 在第二实施方案中，抛光添加剂是具有两种或更多种氧化态的金属化合物，并与过氧型氧化剂结合使用。 在第三个实施方案中，CMP系统包括α-氧化铝和热解氧化铝，其中α-氧化铝与热解氧化铝的重量比为约0.6:1至约9:1。
-
公开(公告)号：US07001253B2
公开(公告)日：2006-02-21
申请号：US10801316
申请日：2004-03-16
IPC分类号： B24B1/00
CPC分类号： B24B37/24 , B24B37/245 , C09G1/02 , C09K3/1463 , H01L21/3212 , Y10T156/1051
摘要： The invention provides a chemical-mechanical polishing system comprising an abrasive, a carrier, and either boric acid, or a conjugate base thereof, wherein the boric acid and conjugate base are not present together in the polishing system in a sufficient amount to act as a pH buffer, or a water-soluble boron-containing compound, or salt thereof, that is not boric acid, and a method of polishing a substrate using the chemical-mechanical polishing system.
-
公开(公告)号：US08497209B2
公开(公告)日：2013-07-30
申请号：US12764268
申请日：2010-04-21
申请人： Steven K. Grumbine , Renjie Zhou , Zhan Chen , Phillip W. Carter
发明人： Steven K. Grumbine , Renjie Zhou , Zhan Chen , Phillip W. Carter
IPC分类号： H01L21/302 , H01L21/321
CPC分类号： H01L21/3212 , C09G1/02 , C09K3/1463 , C23F3/04 , C23F3/06
摘要： The present invention provides a chemical-mechanical polishing (CMP) composition comprising an amino compound, a radical-forming oxidizing agent, a radical trapping agent capable of inhibiting radical-induced oxidation of the amino compound, and an aqueous carrier therefore. The radical trapping agent is a hydroxyl-substituted polyunsaturated cyclic compound, a nitrogenous compound, or a combination thereof. Optionally, the composition comprises a metal oxide abrasive (e.g., silica, alumina, titania, ceria, zirconia, or a combination of two or more of the foregoing abrasives).
摘要翻译： 本发明提供一种包含氨基化合物，自由基形成氧化剂，能够抑制氨基化合物自由基诱导氧化的自由基捕获剂的化学机械抛光（CMP）组合物，以及含水载体。 自由基捕获剂是羟基取代的多不饱和环状化合物，含氮化合物或其组合。 任选地，组合物包含金属氧化物研磨剂（例如二氧化硅，氧化铝，二氧化钛，二氧化铈，氧化锆，或两种或更多种前述研磨剂的组合）。
-
公开(公告)号：US20100200802A1
公开(公告)日：2010-08-12
申请号：US12764268
申请日：2010-04-21
申请人： Steven K. GRUMBINE , Renjie Zhou , Zhan Chen , Phillip W. Carter
发明人： Steven K. GRUMBINE , Renjie Zhou , Zhan Chen , Phillip W. Carter
IPC分类号： C09K13/00
CPC分类号： H01L21/3212 , C09G1/02 , C09K3/1463 , C23F3/04 , C23F3/06
摘要： The present invention provides a chemical-mechanical polishing (CMP) composition comprising an amino compound, a radical-forming oxidizing agent, a radical trapping agent capable of inhibiting radical-induced oxidation of the amino compound, and an aqueous carrier therefore. The radical trapping agent is a hydroxyl-substituted polyunsaturated cyclic compound, a nitrogenous compound, or a combination thereof. Optionally, the composition comprises a metal oxide abrasive (e.g., silica, alumina, titania, ceria, zirconia, or a combination of two or more of the foregoing abrasives).
摘要翻译： 本发明提供一种包含氨基化合物，自由基形成氧化剂，能够抑制氨基化合物自由基诱导氧化的自由基捕获剂的化学机械抛光（CMP）组合物，以及含水载体。 自由基捕获剂是羟基取代的多不饱和环状化合物，含氮化合物或其组合。 任选地，组合物包含金属氧化物研磨剂（例如二氧化硅，氧化铝，二氧化钛，二氧化铈，氧化锆，或两种或更多种前述研磨剂的组合）。
-
公开(公告)号：US07732393B2
公开(公告)日：2010-06-08
申请号：US11384538
申请日：2006-03-20
申请人： Steven K. Grumbine , Renjie Zhou , Zhan Chen , Phillip W. Carter
发明人： Steven K. Grumbine , Renjie Zhou , Zhan Chen , Phillip W. Carter
IPC分类号： C09G1/00
CPC分类号： H01L21/3212 , C09G1/02 , C09K3/1463 , C23F3/04 , C23F3/06
摘要： The present invention provides a chemical-mechanical polishing (CMP) composition comprising an amino compound, a radical-forming oxidizing agent, a radical trapping agent capable of inhibiting radical-induced oxidation of the amino compound, and an aqueous carrier therefore. The radical trapping agent is a hydroxyl-substituted polyunsaturated cyclic compound, a nitrogenous compound, or a combination thereof. Optionally, the composition comprises a metal oxide abrasive (e.g., silica, alumina, titania, ceria, zirconia, or a combination of two or more of the foregoing abrasives). The invention further provides a method of chemically-mechanically polishing a substrate with the CMP compositions, as well as a method of enhancing the shelf-life of CMP compositions containing an amine and a radical-forming oxidizing agent, in which a radical trapping agent is added to the CMP composition.
摘要翻译： 本发明提供一种包含氨基化合物，自由基形成氧化剂，能够抑制氨基化合物自由基诱导氧化的自由基捕获剂的化学机械抛光（CMP）组合物，以及含水载体。 自由基捕获剂是羟基取代的多不饱和环状化合物，含氮化合物或其组合。 任选地，组合物包含金属氧化物研磨剂（例如二氧化硅，氧化铝，二氧化钛，二氧化铈，氧化锆，或两种或更多种前述研磨剂的组合）。 本发明还提供了用CMP组合物对基材进行化学机械抛光的方法，以及提高含有胺和自由基形成氧化剂的CMP组合物的保存期限的方法，其中自由基捕获剂是 添加到CMP组合物中。
-
公开(公告)号：US20080156774A1
公开(公告)日：2008-07-03
申请号：US12075019
申请日：2008-03-07
申请人： Vlasta Brusic , Renjie Zhou , Christopher Thompson
发明人： Vlasta Brusic , Renjie Zhou , Christopher Thompson
IPC分类号： B44C1/22
CPC分类号： C23F3/04 , C09G1/02 , H01L21/3212
摘要： The invention provides a method of chemically-mechanically polishing a gold-containing surface of a substrate with a cyanide-free chemical-mechanical polishing (CMP) composition.
摘要翻译： 本发明提供了用无氰化学机械抛光（CMP）组合物化学机械地抛光基底的含金表面的方法。
-
公开(公告)号：US07368066B2
公开(公告)日：2008-05-06
申请号：US11444866
申请日：2006-05-31
申请人： Vlasta Brusic , Renjie Zhou , Christopher Thompson
发明人： Vlasta Brusic , Renjie Zhou , Christopher Thompson
IPC分类号： B44C1/22
CPC分类号： C23F3/04 , C09G1/02 , H01L21/3212
摘要： The invention provides a cyanide-free chemical-mechanical polishing (CMP) composition useful for polishing a gold-containing surface of a substrate. The CMP composition comprises an abrasive, a gold-oxidizing agent, a cyanide-free gold-solubilizing agent, and an aqueous carrier therefor. The invention further provides a method of chemically-mechanically polishing a gold-containing surface of a substrate with the aforementioned polishing composition.
摘要翻译： 本发明提供了一种无氰化学机械抛光（CMP）组合物，其可用于抛光基底的含金表面。 CMP组合物包含研磨剂，金氧化剂，不含氰化物的金增溶剂及其水性载体。 本发明还提供了利用上述抛光组合物对衬底的含金表面进行化学机械抛光的方法。
-
-
-
-
-
-
-
-
-
搜索结果
27 条记录 (耗时 0.026 秒)
