Manufacturing method of a light emitting device
    1.
    发明申请
    Manufacturing method of a light emitting device 有权
    发光装置的制造方法

    公开(公告)号:US20050053720A1

    公开(公告)日:2005-03-10

    申请号:US10894434

    申请日:2004-07-20

    CPC分类号: H01L51/56 H01L27/3244

    摘要: The present invention provides an active matrix substrate which can be fabricated at a lower cost and a light emitting device having a large display area fabricated by a vapor deposition system which makes a film with uniform thickness for a large substrate. According to the invention, an organic light-emitting device can be fabricated by performing vapor deposition toward a large substrate provided with a pixel portion (and a driver circuit) including an n-channel TFT having a amorphous silicon film, semi-amorphous semiconductor film or an organic semiconductor film as an active layer.

    摘要翻译: 本发明提供了一种能够以较低成本制造的有源矩阵基板和具有由气相沉积系统制造的具有大的显示面积的发光器件,该气相沉积系统制造了具有均匀厚度的薄膜用于大基片。 根据本发明,可以通过向具有包括具有非晶硅膜,半非晶半导体膜的n沟道TFT的像素部分(和驱动电路)的大型衬底进行气相沉积来制造有机发光器件 或有机半导体膜作为活性层。

    Method for manufacturing semiconductor device
    3.
    发明申请
    Method for manufacturing semiconductor device 有权
    制造半导体器件的方法

    公开(公告)号:US20050014319A1

    公开(公告)日:2005-01-20

    申请号:US10885636

    申请日:2004-07-08

    摘要: An object of the present invention is to provide a method for manufacturing a semiconductor device of which manufacturing process is simplified by improving usage rate of a material. A method for manufacturing a semiconductor device of the invention comprises the steps of: forming gate electrodes with a droplet discharge method on a substrate having an insulating surface; laminating gate insulating layers, semiconductor layers, and a semiconductor layer containing one-conductivity type impurity over the gate electrodes; forming first conductive layers serving as masks with a droplet discharge method in a position overlapping the gate electrodes, etching the semiconductor layer and the semiconductor layer containing one-conductivity type impurity with the first conductive layers, forming a second conductive layer serving as a source wiring or a drain wiring with a droplet discharge method over the first conductive layers; and etching the first conductive layers and the semiconductor layer containing one-conductivity type impurity, using the second conductive layers as masks.

    摘要翻译: 本发明的目的是提供一种通过提高材料的使用率来简化制造工艺的半导体器件的制造方法。 本发明的半导体器件的制造方法包括以下步骤:在具有绝缘表面的基板上形成具有液滴喷射法的栅电极; 在栅电极上层叠栅绝缘层,半导体层和含有一导电型杂质的半导体层; 在与栅电极重叠的位置处形成用作液滴喷射法的掩模的第一导电层,用第一导电层蚀刻半导体层和含有一导电型杂质的半导体层,形成用作源极布线的第二导电层 或在第一导电层上具有液滴喷射方法的漏极布线; 并且使用第二导电层作为掩模来蚀刻第一导电层和含有一种导电型杂质的半导体层。

    Display device and method for manufacturing the same, and television receiver
    4.
    发明授权
    Display device and method for manufacturing the same, and television receiver 失效
    显示装置及其制造方法以及电视接收机

    公开(公告)号:US07709843B2

    公开(公告)日:2010-05-04

    申请号:US10574880

    申请日:2004-10-25

    IPC分类号: H01L29/786

    摘要: According to the present invention, which is a display device in which a light-emitting element where an organic substance generating luminescence referred to as electroluminescence or a medium including a mixture of an organic substance and an inorganic substance is sandwiched between electrodes is connected to a TFT, the invention is to manufacture a display panel by forming at least one or more of a conductive layer which forms a wiring or an electrode and a pattern necessary for manufacturing a display panel such as a mask layer for forming a predetermined pattern is formed by a method capable of selectively forming a pattern. A droplet discharge method capable of forming a predetermined pattern by selectively discharging a droplet of a composition in accordance with a particular object and by forming a conductive layer or an insulating layer is used as a method capable of selectively forming a pattern.

    摘要翻译: 根据本发明,其中将发出被称为电致发光的有机物质的发光元件或包含有机物和无机物的混合物的介质夹在电极之间的发光元件连接到 TFT,本发明通过形成至少一个或多个形成布线或电极的导电层以及用于制造用于形成预定图案的掩模层等显示面板所需的图案来制造显示面板,由 能够选择性地形成图案的方法。 使用能够通过选择性地排出根据特定目的的组合物的液滴并且通过形成导电层或绝缘层来形成预定图案的液滴喷射方法作为能够选择性地形成图案的方法。

    Method for manufacturing semiconductor device
    7.
    发明授权
    Method for manufacturing semiconductor device 有权
    制造半导体器件的方法

    公开(公告)号:US07572688B2

    公开(公告)日:2009-08-11

    申请号:US11797533

    申请日:2007-05-04

    IPC分类号: H01L21/00 H01L21/84

    摘要: An object of the present invention is to provide a method for manufacturing a semiconductor device of which manufacturing process is simplified by improving usage rate of a material. A method for manufacturing a semiconductor device of the invention comprises the steps of: forming gate electrodes with a droplet discharge method on a substrate having an insulating surface; laminating gate insulating layers, semiconductor layers, and a semiconductor layer containing one-conductivity type impurity over the gate electrodes; forming first conductive layers serving as masks with a droplet discharge method in a position overlapping the gate electrodes, etching the semiconductor layer and the semiconductor layer containing one-conductivity type impurity with the first conductive layers, forming a second conductive layer serving as a source wiring or a drain wiring with a droplet discharge method over the first conductive layers; and etching the first conductive layers and the semiconductor layer containing one-conductivity type impurity, using the second conductive layers as masks.

    摘要翻译: 本发明的目的是提供一种通过提高材料的使用率来简化制造工艺的半导体器件的制造方法。 本发明的半导体器件的制造方法包括以下步骤:在具有绝缘表面的基板上形成具有液滴喷射法的栅电极; 在栅电极上层叠栅绝缘层,半导体层和含有一导电型杂质的半导体层; 在与栅电极重叠的位置处形成用作液滴喷射法的掩模的第一导电层,用第一导电层蚀刻半导体层和含有一导电型杂质的半导体层,形成用作源极布线的第二导电层 或在第一导电层上具有液滴喷射方法的漏极布线; 并且使用第二导电层作为掩模来蚀刻第一导电层和含有一种导电型杂质的半导体层。

    Method for manufacturing semiconductor device
    8.
    发明授权
    Method for manufacturing semiconductor device 有权
    制造半导体器件的方法

    公开(公告)号:US07229862B2

    公开(公告)日:2007-06-12

    申请号:US10885636

    申请日:2004-07-08

    IPC分类号: H01L21/84

    摘要: An object of the present invention is to provide a method for manufacturing a semiconductor device of which manufacturing process is simplified by improving usage rate of a material. A method for manufacturing a semiconductor device of the invention comprises the steps of: forming gate electrodes with a droplet discharge method on a substrate having an insulating surface; laminating gate insulating layers, semiconductor layers, and a semiconductor layer containing one-conductivity type impurity over the gate electrodes; forming first conductive layers serving as masks with a droplet discharge method in a position overlapping the gate electrodes, etching the semiconductor layer and the semiconductor layer containing one-conductivity type impurity with the first conductive layers, forming a second conductive layer serving as a source wiring or a drain wiring with a droplet discharge method over the first conductive layers; and etching the first conductive layers and the semiconductor layer containing one-conductivity type impurity, using the second conductive layers as masks.

    摘要翻译: 本发明的目的是提供一种通过提高材料的使用率来简化制造工艺的半导体器件的制造方法。 本发明的半导体器件的制造方法包括以下步骤:在具有绝缘表面的基板上形成具有液滴喷射法的栅电极; 在栅电极上层叠栅绝缘层,半导体层和含有一导电型杂质的半导体层; 在与栅电极重叠的位置处形成用作液滴喷射法的掩模的第一导电层,用第一导电层蚀刻半导体层和含有一导电型杂质的半导体层,形成用作源极布线的第二导电层 或在第一导电层上具有液滴喷射方法的漏极布线; 并且使用第二导电层作为掩模来蚀刻第一导电层和含有一种导电型杂质的半导体层。

    Method for manufacturing semiconductor device

    公开(公告)号:US20070212828A1

    公开(公告)日:2007-09-13

    申请号:US11797533

    申请日:2007-05-04

    IPC分类号: H01L21/84

    摘要: An object of the present invention is to provide a method for manufacturing a semiconductor device of which manufacturing process is simplified by improving usage rate of a material. A method for manufacturing a semiconductor device of the invention comprises the steps of: forming gate electrodes with a droplet discharge method on a substrate having an insulating surface; laminating gate insulating layers, semiconductor layers, and a semiconductor layer containing one-conductivity type impurity over the gate electrodes; forming first conductive layers serving as masks with a droplet discharge method in a position overlapping the gate electrodes, etching the semiconductor layer and the semiconductor layer containing one-conductivity type impurity with the first conductive layers, forming a second conductive layer serving as a source wiring or a drain wiring with a droplet discharge method over the first conductive layers; and etching the first conductive layers and the semiconductor layer containing one-conductivity type impurity, using the second conductive layers as masks.