摘要:
Semiconductor memory modules and semiconductor memory systems using the same are described herein. The modules divide a conventional DIMM into a series of separate, smaller memory modules. Each memory module includes at least one semiconductor memory chip arranged on a substrate; CAwD signal input lines arranged on the substrate in a first predetermined line number and connecting one of the semiconductor memory chips to CAwD input signal pins on the substrate; and rD signal output lines arranged on the substrate in a second predetermined line number and connecting the one or a last semiconductor memory to a second number of rD output signal pins of the substrate. In a semiconductor memory system including the semiconductor memory modules, each memory module is separately connected to a memory controller by the CAwD signal input lines and the rD signal output lines in a respective point-to-point fashion.
摘要:
A memory circuit includes multiple memory chips configured to store data and disposed in at least one stack. The memory circuit includes multiple ports configured to receive and transmit control signals and data to and from the memory chips and to supply energy to the memory circuit. The memory circuit includes a housing accommodating the multiple memory chips and the multiple ports.
摘要:
A memory module device includes a printed circuit board, a plurality of memory modules and a buffer module. Lines are provided in or on the printed circuit board to connect the buffer module to the memory modules. The memory modules are combined at least partially to form memory module stacks.
摘要:
A memory circuit includes multiple memory chips configured to store data and disposed in at least one stack. The memory circuit includes multiple ports configured to receive and transmit control signals and data to and from the memory chips and to supply energy to the memory circuit. The memory circuit includes a housing accommodating the multiple memory chips and the multiple ports.
摘要:
The present invention includes a semiconductor memory modules and semiconductor memory systems using the same. The modules divide a conventional DIMM into a series of separate, smaller memory modules. Each memory module includes at least one semiconductor memory chip arranged on a substrate; CAwD signal input lines arranged on the substrate in a first predetermined line number and connecting one of the semiconductor memory chips to CAwD input signal pins on the substrate; and rD signal output lines arranged on the substrate in a second predetermined line number and connecting the one or a last semiconductor memory to a second number of rD output signal pins of the substrate. In a semiconductor memory system including the semiconductor memory modules, each memory module is separately connected to a memory controller by the CAwD signal input linesand the rD signal output lines in a respective point-to-point fashion.
摘要:
A circuit system includes a means for controlling a first and a second memory unit by means of a differential control signal. The differential control signal includes a first control signal and a second control signal, which is inverted to the first control signal. Further, the circuit system comprises a differential control signal line, which includes a first signal line for routing the first control signal and a second signal line for routing the second control signal. The first switching unit is connected via the first signal line and the second circuit unit is connected via the second signal line to the means for controlling.
摘要:
Interface parameters for a plurality of semiconductor devices, particularly parameters for output drivers (i.e. on chip driver) and terminations (i.e. on die termination) for double data rate dynamic random access memories, are aligned using a calibration reference which is common to the semiconductor devices and is connected to calibration connections on the semiconductor devices. The semiconductor devices are calibrated in succession, in each case individually, and the calibration connection on the respective semiconductor device which is currently performing calibration is connected to an internal calibration unit by an internal switching unit in the process, and the calibration connections on all other semiconductor devices are terminated to a high impedance internally.
摘要:
A memory system is functionally designed so that, despite operation without an error correction device, memory chips of a memory module that are actually provided for error correction are concomitantly used for the data transfer. A control device is configured to receive, store and transfer data packets to and from a first and second set of memory chips. Transfer of an internal packet data from the control device to memory takes place such that a first record is stored in a second set of memory chips and additional records are stored in the first set of memory chips. In preferred embodiments, data is allocated in the second set of memory chips such that at least one additional transfer step takes place to the second set of memory chips compared with transfers to the first set of memory chips. In the additional transfer step(s), the first set of memory chips is masked from receiving data.
摘要:
An integrated device comprising a storage location, wherein data stored in the storage location is repeatedly refreshed with a first predetermined refresh rate during a first period of time. The first period of time provides a first predetermined duration. After the end of the first period of time, the data is repeatedly refreshed with a second predetermined refresh rate.
摘要:
Embodiments of the invention provide a memory device that may be accessed by a plurality of controllers or processor cores via respective ports of the memory device. Each controller may be coupled to a respective port of the memory device via a data bus. Each port of the memory device may be associated a predefined section of memory, thereby giving each controller access to a distinct section of memory without interference from other controllers. A common command/address bus may couple the plurality of controllers to the memory device. Each controller may assert an active signal on a memory access control bus to gain access to the command/address bus to initiate a memory access. In some embodiments, the memory device may be a package comprising a plurality of stacked memory dies.