公开(公告)号：US06783427B2

公开(公告)日：2004-08-31

申请号：US10277131

申请日：2002-10-22

申请人： Soichi Isobe ,  Tadakazu Sone ,  Takuji Hayama ,  Manabu Tsujimura

发明人： Soichi Isobe ,  Tadakazu Sone ,  Takuji Hayama ,  Manabu Tsujimura

IPC分类号： B24B100

CPC分类号： B24B37/005 ,  B24B55/06 ,  Y10S134/902

摘要： A polishing apparatus comprises: a housing defining a chamber wherein articles to be polished are subject to polishing and cleaning operations; partition walls for dividing the chamber of the housing into a plurality of sections; and, an air exhaust device. The exhaust device comprises: air exhaust conduits which are fluidly connected to the sections in the housing to exhaust air from the sections; valves for closing and opening the air exhaust conduits, respectively; and, a controller for independently controlling the valves to regulate air flows exhausted through the conduits. The conduits have inlet openings located in a vicinity of spaces where any air pollutant is generated in the sections in the housing.

摘要翻译： 抛光装置包括：限定腔室的壳体，其中要抛光的物品经受抛光和清洁操作; 隔壁，用于将壳体的腔室分成多个部分; 和排气装置。 排气装置包括：排气管道，其流体地连接到壳体中的部分以从部分排出空气; 用于分别关闭和打开排气管道的阀门; 以及用于独立地控制阀以调节通过导管排出的空气流的控制器。 导管具有位于空间附近的入口开口，其中在壳体中的部分中产生任何空气污染物。

公开(公告)号：US06435949B1

公开(公告)日：2002-08-20

申请号：US09652148

申请日：2000-08-31

申请人： Seiji Katsuoka ,  Hozumi Yasuda ,  Tadakazu Sone ,  Shunichiro Kojima ,  Manabu Tsujimura

发明人： Seiji Katsuoka ,  Hozumi Yasuda ,  Tadakazu Sone ,  Shunichiro Kojima ,  Manabu Tsujimura

IPC分类号： B24B100

CPC分类号： B24B37/30 ,  B24B37/32

摘要： A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing apparatus comprises a turntable having a polishing surface, a top ring for holding a workpiece and pressing the workpiece against the polishing surface, a holding surface of the top ring for holding the workpiece, and a retainer ring for retaining the workpiece within the holding surface of the top ring. The holding surface is deformable by fluid having variable pressure, and the retainer ring presses the polishing surface under a variable pressing force.

摘要翻译： 抛光装置用于将诸如半导体晶片的工件抛光到平面镜面。 抛光装置包括具有抛光表面的转台，用于保持工件的顶环和将工件压靠在抛光表面上的压板，用于保持工件的顶环的保持表面和用于将工件保持在保持件内的保持环 顶环的表面。 保持表面由具有可变压力的流体变形，并且保持环以可变的压力按压抛光表面。

公开(公告)号：US07891337B2

公开(公告)日：2011-02-22

申请号：US12201488

申请日：2008-08-29

申请人： Katsuhiko Takeuchi ,  Kouji Ishizuka ,  Manabu Tsujimura

发明人： Katsuhiko Takeuchi ,  Kouji Ishizuka ,  Manabu Tsujimura

IPC分类号： F02M7/00 ,  F02M51/00 ,  B60T7/12

CPC分类号： F02D41/2467 ,  F02D41/1497 ,  F02D41/2438 ,  F02D2200/1012

摘要： A fuel injection system designed to learn the quantity of fuel sprayed actually from a fuel injector into an internal combustion engine. When the engine is placed in a given learning condition, the system works to spray different quantities of the fuel for different injection durations in sequence to the engine through the fuel injector to collect a plurality of data on the quantity of the fuel sprayed actually from the fuel injector. The system analyzes the corrected data to determine an injection characteristic of the fuel injector, which may have changed from a designer-defined basic injection characteristic of the fuel injector, and uses the injection characteristic in calculating an injection duration or on-duration for which the fuel injector is to be opened to spray a target quantity of fuel.

摘要翻译： 一种燃料喷射系统，用于了解实际从燃料喷射器喷射到内燃机中的燃料量。 当发动机处于给定的学习状态时，系统通过燃料喷射器依次向不同喷射持续时间喷射不同数量的燃料以收集关于实际从喷油器喷射的燃料量的多个数据 喷油器。 该系统分析校正的数据以确定燃料喷射器的喷射特性，该喷射特性可以从燃料喷射器的设计者定义的基本喷射特性改变，并且在计算喷射持续时间或喷射持续时间时使用喷射特性， 燃料喷射器打开以喷射目标量的燃料。

公开(公告)号：US20090209176A1

公开(公告)日：2009-08-20

申请号：US12320976

申请日：2009-02-10

申请人： Seiji Katsuoka ,  Manabu Tsujimura

发明人： Seiji Katsuoka ,  Manabu Tsujimura

IPC分类号： B24B49/00 ,  B24B49/10 ,  B24B49/16

CPC分类号： B24B37/042 ,  B24B49/10 ,  B24B49/16

摘要： A method can effectively eliminate a surface level difference (irregularities) in a film formed on an object without producing scratches in a surface of the film, and can polish and remove the film into a flat surface with greatly increased productivity. The method comprises carrying out a first polishing step by pressing a polishing pad of a polishing device, having a diameter which is smaller than the radius of the object, against the surface of the object at a first pressure while moving the polishing pad and the object relative to each other at a first relative speed. The first polishing step is terminated at a point in time when a surface level difference in the object is eliminated to a targeted level. The method further comprises carrying out a second polishing step by pressing a polishing pad of a polishing device, having a diameter which is larger than the diameter of the object, against the surface of the object at a second pressure while moving the polishing pad and the object relative to each other at a second relative speed.

摘要翻译： 一种方法可以有效地消除在物体上形成的膜中的表面水平差（不规则），而不会在膜的表面产生划痕，并且可以以大大提高的生产率将膜抛光和去除成平坦表面。 所述方法包括：在移动所述抛光垫和所述物体的同时，将具有小于所述物体的半径的直径的抛光装置的抛光垫以第一压力压在所述物体的表面上来进行第一抛光步骤 相对于彼此以第一相对速度。 第一抛光步骤在将物体的表面水平差消除到目标水平的时间点终止。 所述方法还包括：在移动所述抛光垫的同时，将具有大于所述物体直径的直径的抛光装置的抛光垫以第二压力压在所述物体的表面上，从而进行第二抛光步骤 物体相对于彼此以第二相对速度。

公开(公告)号：US20090063020A1

公开(公告)日：2009-03-05

申请号：US12230454

申请日：2008-08-28

申请人： Kouji Ishizuka ,  Kouichi Sugiyama ,  Manabu Tsujimura ,  Tetsuya Ohno

发明人： Kouji Ishizuka ,  Kouichi Sugiyama ,  Manabu Tsujimura ,  Tetsuya Ohno

IPC分类号： F02D41/30

CPC分类号： F02D41/2438 ,  F02D41/2467 ,  F02D41/40 ,  F02D41/402 ,  Y02T10/44

摘要： A fuel injection system designed to determine a correction value for correcting the quantity of fuel sprayed from a fuel injector into an internal combustion engine. The fuel injection system instructs the fuel injector to inject the fuel into the engine a plurality of times cyclically to learn an injection characteristic unique to the fuel injector and changes an injection duration for which the fuel is to be sprayed in each of injection events to disperse the injection durations evenly around a target injection quantity, thereby enabling the correction value to be determined in a decreased number of injections of fuel for a decreased amount of time.

摘要翻译： 一种燃料喷射系统，其被设计成确定用于校正从燃料喷射器喷射到内燃机中的燃料量的校正值。 燃料喷射系统指示燃料喷射器循环地将燃料喷射到发动机中多次，以了解燃料喷射器独有的喷射特性，并且在每个喷射事件中改变喷射燃料的喷射持续时间以分散 喷射持续时间均匀地围绕目标喷射量，从而能够以减少的时间量在减少的燃料喷射量中确定校正值。

公开(公告)号：US20070224916A1

公开(公告)日：2007-09-27

申请号：US11802353

申请日：2007-05-22

申请人： Kunihiko Sakurai ,  Tetsuji Togawa ,  Yoshihiro Mochizuki ,  Akira Fukuda ,  Hirokuni Hiyama ,  Kazuto Hirokawa ,  Manabu Tsujimura

发明人： Kunihiko Sakurai ,  Tetsuji Togawa ,  Yoshihiro Mochizuki ,  Akira Fukuda ,  Hirokuni Hiyama ,  Kazuto Hirokawa ,  Manabu Tsujimura

IPC分类号： B24B49/00

CPC分类号： B24B37/30 ,  B24B37/005 ,  B24B37/042 ,  B24B49/00

摘要： A polishing method can automatically reset polishing conditions according to a state of a polishing member based on data on a polishing profile changing with time, thereby extending life of the polishing member and obtaining flatness of a polished surface with higher accuracy. The polishing method, includes steps of: independently applying a desired pressure by each of pressing portions of a top ring on a polishing object; estimating a polishing profile of the polishing object based on set pressure values, and calculating a recommended polishing pressure value so that a difference between the polishing profile of the polishing object after it is polished under certain polishing conditions and a desired polishing profile becomes smaller; and polishing the polishing object with the recommended polishing pressure value.

公开(公告)号：US20070205112A1

公开(公告)日：2007-09-06

申请号：US11797480

申请日：2007-05-03

申请人： Masako Kodera ,  Yoshihiro Mochizuki ,  Akira Fukuda ,  Akira Kodera ,  Hirokuni Hiyama ,  Manabu Tsujimura ,  Kazuto Hirokawa ,  Akira Fukunaga

发明人： Masako Kodera ,  Yoshihiro Mochizuki ,  Akira Fukuda ,  Akira Kodera ,  Hirokuni Hiyama ,  Manabu Tsujimura ,  Kazuto Hirokawa ,  Akira Fukunaga

IPC分类号： B23H3/00

CPC分类号： B23H5/08 ,  B24B53/001 ,  B24B53/017 ,  C09G1/02 ,  C25F3/02 ,  C25F7/00 ,  H01L21/3212 ,  H01L21/32125 ,  H01L21/76814 ,  H01L21/76825 ,  H01L21/7684

摘要： A polishing apparatus (30) has a polishing surface (32), a top ring (36) for holding a wafer (W), motors (46, 56) to move the polishing surface (32) and the wafer (W) relative to each other at a relative speed, and a vertical movement mechanism (54) to press the wafer (W) against the polishing surface (32) under a pressing pressure. The polishing apparatus (30) also has a controller (44) to adjust a polishing condition in a non-Preston range in which a polishing rate is not proportional to a product of the pressing pressure and the relative speed. The polishing apparatus (30) can simultaneously achieve uniform supply of a chemical liquid to a surface of the wafer (W) and a uniform polishing rate within the surface of the wafer (W).

摘要翻译： 抛光装置（30）具有抛光面（32），用于保持晶片（W）的顶环（36），使抛光面（32）和晶片（W）相对于运动的电机（46,56）相对于 以及垂直移动机构（54），其在压制压力下将晶片（W）压靠在抛光表面（32）上。 抛光装置（30）还具有控制器（44），用于在抛光速率与按压压力与相对速度的乘积不成比例的非普雷斯顿范围内调节抛光状态。 抛光装置（30）可以同时实现向晶片（W）的表面均匀供应化学液体，并且在晶片表面（W）内均匀的研磨速率。

公开(公告)号：US07234999B2

公开(公告)日：2007-06-26

申请号：US11599351

申请日：2006-11-15

申请人： Kunihiko Sakurai ,  Tetsuji Togawa ,  Yoshihiro Mochizuki ,  Akira Fukuda ,  Hirokuni Hiyama ,  Kazuto Hirokawa ,  Manabu Tsujimura

发明人： Kunihiko Sakurai ,  Tetsuji Togawa ,  Yoshihiro Mochizuki ,  Akira Fukuda ,  Hirokuni Hiyama ,  Kazuto Hirokawa ,  Manabu Tsujimura

IPC分类号： B24B49/00 ,  G06F19/00

CPC分类号： B24B37/30 ,  B24B37/005 ,  B24B37/042 ,  B24B49/00

摘要： A polishing method can automatically reset polishing conditions according to a state of a polishing member based on data on a polishing profile changing with time, thereby extending life of the polishing member and obtaining flatness of a polished surface with higher accuracy. The polishing method, includes steps of: independently applying a desired pressure by each of pressing portions of a top ring on a polishing object; estimating a polishing profile of the polishing object based on set pressure values, and calculating a recommended polishing pressure value so that a difference between the polishing profile of the polishing object after it is polished under certain polishing conditions and a desired polishing profile becomes smaller; and polishing the polishing object with the recommended polishing pressure value.

公开(公告)号：US07198552B2

公开(公告)日：2007-04-03

申请号：US11294365

申请日：2005-12-06

申请人： Toyomi Nishi ,  Tetsuji Togawa ,  Harumitsu Saito ,  Manabu Tsujimura ,  Hiromi Yajima ,  Kazuaki Himukai ,  Shoichi Kodama ,  Yukio Imoto ,  Riichiro Aoki ,  Masako Watase ,  Atsushi Shigeta ,  Shiro Mishima ,  Gisuke Kouno

发明人： Toyomi Nishi ,  Tetsuji Togawa ,  Harumitsu Saito ,  Manabu Tsujimura ,  Hiromi Yajima ,  Kazuaki Himukai ,  Shoichi Kodama ,  Yukio Imoto ,  Riichiro Aoki ,  Masako Watase ,  Atsushi Shigeta ,  Shiro Mishima ,  Gisuke Kouno

IPC分类号： B24B1/00

CPC分类号： B24B37/345 ,  B08B1/04 ,  B08B15/02 ,  B24B27/0023 ,  B24B51/00 ,  B24B55/12 ,  F24F3/161 ,  H01L21/67017 ,  H01L21/67028 ,  H01L21/67057 ,  H01L21/67219

摘要： A polishing apparatus for polishing a surface of a workpiece includes a housing unit, a partition wall partitioning an interior of the housing unit into a first chamber and a second chamber, a polishing section disposed in the first chamber and having a turntable with an abrasive cloth mounted on an upper surface thereof and a top ring positioned above the turntable for supporting the workpiece to be polished and pressing the workpiece against the abrasive cloth, and a cleaning section disposed in the second chamber and cleaning the workpiece which has been polished. The polishing apparatus further includes a transferring device for transferring the workpiece which has been polished from the polishing section to the cleaning section through an opening and an exhaust system for exhausting ambient air from each of the polishing section and cleaning section separately and independently.

摘要翻译： 用于抛光工件表面的抛光装置包括壳体单元，将壳体单元的内部分隔成第一室和第二室的分隔壁，设置在第一室中的抛光部分，并且具有带有研磨布的转台 安装在其上表面和位于转台上方的顶环，用于支撑待抛光的工件并将工件压靠在研磨布上，以及设置在第二室中并清洁已经被抛光的工件的清洁部。 抛光装置还包括转印装置，用于通过用于从每个抛光部分和清洁部分分别且独立地排出周围空气的开口和排气系统将已经从抛光部分抛光的工件传送到清洁部分。

公开(公告)号：US20070061036A1

公开(公告)日：2007-03-15

申请号：US11599351

申请日：2006-11-15

申请人： Kunihiko Sakurai ,  Tetsuji Togawa ,  Yoshihiro Mochizuki ,  Akira Fukuda ,  Hirokuni Hiyama ,  Kazuto Hirokawa ,  Manabu Tsujimura

发明人： Kunihiko Sakurai ,  Tetsuji Togawa ,  Yoshihiro Mochizuki ,  Akira Fukuda ,  Hirokuni Hiyama ,  Kazuto Hirokawa ,  Manabu Tsujimura

IPC分类号： G06F19/00

CPC分类号： B24B37/30 ,  B24B37/005 ,  B24B37/042 ,  B24B49/00

摘要： A polishing method can automatically reset polishing conditions according to a state of a polishing member based on data on a polishing profile changing with time, thereby extending life of the polishing member and obtaining flatness of a polished surface with higher accuracy. The polishing method, includes steps of: independently applying a desired pressure by each of pressing portions of a top ring on a polishing object; estimating a polishing profile of the polishing object based on set pressure values, and calculating a recommended polishing pressure value so that a difference between the polishing profile of the polishing object after it is polished under certain polishing conditions and a desired polishing profile becomes smaller; and polishing the polishing object with the recommended polishing pressure value.

摘要翻译： 抛光方法可以根据抛光轮廓随着时间的变化的数据，根据研磨部件的状态自动复位抛光条件，从而延长抛光部件的使用寿命，并且以更高的精度获得抛光表面的平坦度。 抛光方法包括以下步骤：通过顶环的每个按压部分独立地施加所需的压力在抛光对象上; 基于设定压力值估计抛光对象的抛光轮廓，并且计算推荐的抛光压力值，使得在某些抛光条件下抛光抛光对象的抛光轮廓与期望的抛光轮廓之间的差异变小; 并用推荐的抛光压力值抛光抛光对象。