ADJUSTING STRUCTURE AND STAND FOR PHOTOGRAPHIC APPARATUS

    公开(公告)号:US20240052967A1

    公开(公告)日:2024-02-15

    申请号:US17983667

    申请日:2022-11-09

    IPC分类号: F16M11/04 F16M11/32 G03B17/56

    摘要: The invention discloses an adjusting structure and a stand for photographic apparatus. The adjusting structure includes a first adjusting rod, a first connecting member, a second connecting member, a second adjusting rod, a first locking member and a supporting member. The first connecting member is fixedly connected with the first adjusting rod, the second connecting member is rotationally connected with the first connecting member and is provided with a first mounting hole, wherein the second connecting member can be rotated relative to the first connecting member to adjust an included angle with the first connecting member, the second adjusting rod is penetrated through the first mounting hole and movablely connected with the first adjusting rod, and can be moved relative to the first adjusting rod along a straight direction.

    METHOD AND APPARATUS FOR WITHIN-WAFER PROFILE LOCALIZED TUNING

    公开(公告)号:US20180226263A1

    公开(公告)日:2018-08-09

    申请号:US15941839

    申请日:2018-03-30

    申请人: Jun Yang

    发明人: Jun Yang

    摘要: A method and apparatus for within-wafer profile localized tuning is disclosed. In one aspect, the method includes providing a wafer attached to a rotating vacuum stage front side up, the wafer including a surface film with an incoming film thickness profile, providing a pad attached to a rotating head front side down, the head configured to sweep along a path, computing a film thickness removal amount based upon the incoming film thickness profile, and removing at least a portion of the surface film of the wafer based on the computed film thickness removal amount via a plurality of steps.