摘要:
A voltage controlled oscillator (VCO) has a plurality of series-connected inverters. Within each inverter a first transistor has a first current electrode coupled to a first power supply voltage terminal, a second current electrode, a first control electrode coupled to an output terminal of another inverter of the plurality of series-connected inverters, and a second control electrode for receiving a first bias signal. A second transistor has a first current electrode coupled to the second current electrode of the first transistor, a second current electrode coupled to a second power supply voltage terminal, and a first control electrode coupled to the first control electrode of the first transistor. The second control electrode of the first transistor of each inverter receives a same or separate analog control signal to adjust the threshold voltage of the first transistors thereof to affect frequency and phase of the VCO's signal.
摘要:
A voltage controlled oscillator (VCO) has a plurality of series-connected inverters. Within each inverter a first transistor has a first current electrode coupled to a first power supply voltage terminal, a second current electrode, a first control electrode coupled to an output terminal of another inverter of the plurality of series-connected inverters, and a second control electrode for receiving a first bias signal. A second transistor has a first current electrode coupled to the second current electrode of the first transistor, a second current electrode coupled to a second power supply voltage terminal, and a first control electrode coupled to the first control electrode of the first transistor. The second control electrode of the first transistor of each inverter receives a same or separate analog control signal to adjust the threshold voltage of the first transistors thereof to affect frequency and phase of the VCO's signal.
摘要:
In accordance with at least one embodiment, an improved voltage headroom self-biased receiver is provided. In accordance with at least one embodiment, tail current sources are biased so as to be cross-coupled with respect to each other. In accordance with at least one embodiment, startup control is provided to counter defect-induced current and to ensure the circuit can function properly even with large amounts of defect current. In accordance with at least one embodiment, a positive type (p type) channel metal oxide semiconductor (PMOS) tail current transistor is modulated by a negative type (n type) channel metal oxide semiconductor (NMOS) differential pair virtual negative supply voltage and a NMOS tail current transistor is modulated by a PMOS differential pair virtual positive supply voltage. The amplifier's output common mode is thus self correcting to p type to n type transistor strength differences.
摘要:
A voltage regulator regulates voltage at a node and has circuitry coupled to the node for providing a current to the node. A regulating transistor coupled between the node and a first power supply voltage terminal has a disabling transistor coupled in parallel and is selectively disabled by directly connecting the first power supply voltage terminal to the node. An inverting stage has an output connected to the regulating transistor. A load transistor has a first current electrode coupled to a second power supply voltage terminal, and a control electrode and second current electrode connected together and coupled to an input of the inverting stage. A sensing transistor has a first current electrode coupled to the second current electrode of the load transistor, a control electrode connected directly to the node and a second current electrode coupled to the first power supply voltage terminal.
摘要:
A phase-locked loop (PLL) system including a phase-frequency detector for generating an up signal or a down signal based on a phase difference between a reference clock and a feedback clock is provided. The PLL system further includes a phase-error spreading circuit for generating phase-spread pulses based on a relationship between a first time attribute of the up signal or the down signal and a second time attribute of the phase-spread pulses. The PLL system further includes a voltage-controlled oscillator (VCO) for generating a VCO clock based on the phase-spread pulses. The PLL system may also include a charge pump that generates a pumping signal based on the phase-spread pulses.
摘要:
A voltage translator having an input which receives an input signal and an output which provides a level shifted output signal includes a first inverter having an input coupled to receive the input signal, a second inverter having an input coupled to an output of the first inverter, a third inverter having an input coupled to an output of the second inverter, a fourth inverter having an input coupled to receive the input signal and an output coupled to an output of the third inverter, a fifth inverter having an input coupled to an output of the fourth inverter and having an output coupled to the input of the third inverter, and a sixth inverter having an input coupled to the output of the fifth inverter and an output coupled to the output of the voltage translator. The second and fourth inverters are coupled to a calibration voltage supply terminal.
摘要:
A conductive line varies in thickness to assist in overcoming RC delays and noise coupling. By varying line thickness, variation in conductor width is avoided if necessary to maintain a specified minimum pitch between conductors while maintaining predetermined desired RC parameters and noise characteristics of the conductive line. Conductor depth variation is achieved by etching a dielectric layer to different thicknesses. A subsequent conductive fill over the dielectric layer and in the differing thicknesses results in a conductive line that varies in thickness. Different conductive line thicknesses available at a particular metal level can additionally be used for semiconductor structures other than a signal or a power supply conductive line, such as a contact, a via or an electrode of a device. The thickness analysis required to determine how interconnect thickness is varied in order to meet a desired design criteria may be automated and provided as a CAD tool.
摘要:
A high speed output buffer including an input circuit providing first and second signals within a first voltage range having a first common mode voltage, an AC interface receiving the first and second signals and providing first and second preliminary drive signals, a detection and correction circuit that corrects a state of the first preliminary drive signal AC coupled to the first signal, first and second drive circuits receiving the preliminary drive signals and providing first and second drive signals, where the first drive circuit operates within a second voltage range having a greater common mode voltage and where the second drive circuit operates within a third voltage range, and an output that switches an output node within a voltage range that is greater than a maximum voltage range. The first, second and third voltage ranges are each within the maximum voltage range suitable for thin-gate devices.
摘要:
A back side body contact for a transistor that extends through an opening in an insulating layer located adjacent to the backside of the body. The backside contact is coupled to an interconnect on the backside. In some examples, the interconnect is coupled to an interconnect located with respect the other side of an active layer which is coupled to a body voltage bias source.
摘要:
A semiconductor (10) has an active device, such as a transistor, with a directly underlying passive device, such as a capacitor (75, 77, 79), that are connected by a via or conductive region (52) and interconnect (68, 99). The via or conductive region (52) contacts a bottom surface of a diffusion or source region (22) of the transistor and contacts a first (75) of the capacitor electrodes. A laterally positioned vertical via (32, 54, 68) and interconnect (99) contacts a second (79) of the capacitor electrodes. A metal interconnect or conductive material (68) may be used as a power plane that saves circuit area by implementing the power plane underneath the transistor rather than adjacent the transistor.