公开(公告)号：US20190210044A1

公开(公告)日：2019-07-11

申请号：US16358338

申请日：2019-03-19

Applicant: Stamford Devices Limited

Inventor： Brendan Hogan ,  Hong Xu

IPC: B05B1/02 ,  B05B17/06 ,  B05B17/00 ,  C25D7/04 ,  C25D1/08

CPC classification number: B05B1/02 ,  A61M11/005 ,  A61M15/0085 ,  A61M2207/00 ,  B05B17/0638 ,  B05B17/0653 ,  C25D1/08 ,  C25D7/04

Abstract: An aperture plate is manufactured by plating metal around a mask of resist columns having a desired size, pitch, and profile, which yields a wafer about 60 μm thickness. This is approximately the full desired target aperture plate thickness. The plating is continued so that the metal overlies the top surfaces of the columns until the desired apertures are achieved. This needs only one masking/plating cycle to achieve the desired plate thickness. Also, the plate has passageways formed beneath the apertures, formed as an integral part of the method, by mask material removal. These are suitable for entrainment of aerosolized droplets exiting the apertures.

公开(公告)号：US11905615B2

公开(公告)日：2024-02-20

申请号：US17808432

申请日：2022-06-23

Applicant: Stamford Devices Limited

Inventor： Hong Xu

IPC: C25D7/00 ,  B41J2/16 ,  C25D5/02 ,  C25D5/10 ,  C25D1/00 ,  C25D5/00 ,  A61M11/00 ,  C25D5/54 ,  B05B17/00 ,  C25D3/38 ,  C25D3/46 ,  C25D3/48 ,  C25D3/54 ,  C25D5/34 ,  C25D5/48

CPC classification number: C25D7/00 ,  A61M11/005 ,  B05B17/0646 ,  B41J2/162 ,  B41J2/1625 ,  B41J2/1629 ,  B41J2/1631 ,  C25D1/003 ,  C25D3/38 ,  C25D3/46 ,  C25D3/48 ,  C25D3/54 ,  C25D5/022 ,  C25D5/10 ,  C25D5/34 ,  C25D5/48 ,  C25D5/54 ,  C25D5/611

Abstract: In one embodiment, a method for manufacturing an aperture plate includes depositing a releasable seed layer above a substrate, applying a first patterned photolithography mask above the releasable seed layer, the first patterned photolithography mask having a negative pattern to a desired aperture pattern, electroplating a first material above the exposed portions of the releasable seed layer and defined by the first mask, applying a second photolithography mask above the first material, the second photolithography mask having a negative pattern to a first cavity, electroplating a second material above the exposed portions of the first material and defined by the second mask, removing both masks, and etching the releasable seed layer to release the first material and the second material. The first and second material form an aperture plate for use in aerosolizing a liquid. Other aperture plates and methods of producing aperture plates are described according to other embodiments.

公开(公告)号：US11440030B2

公开(公告)日：2022-09-13

申请号：US16358338

申请日：2019-03-19

Applicant: Stamford Devices Limited

Inventor： Brendan Hogan ,  Hong Xu

IPC: B05B17/06 ,  B05B1/02 ,  C25D1/08 ,  C25D7/04 ,  B05B17/00 ,  A61M11/00 ,  A61M15/00

Abstract: An aperture plate is manufactured by plating metal around a mask of resist columns having a desired size, pitch, and profile, which yields a wafer about 60 μm thickness. This is approximately the full desired target aperture plate thickness. The plating is continued so that the metal overlies the top surfaces of the columns until the desired apertures are achieved. This needs only one masking/plating cycle to achieve the desired plate thickness. Also, the plate has passageways formed beneath the apertures, formed as an integral part of the method, by mask material removal. These are suitable for entrainment of aerosolized droplets exiting the apertures.

公开(公告)号：US10662543B2

公开(公告)日：2020-05-26

申请号：US15001551

申请日：2016-01-20

Applicant: Stamford Devices Limited

Inventor： Hong Xu

IPC: C25D7/00 ,  B41J2/16 ,  C25D5/02 ,  C25D5/10 ,  C25D1/00 ,  B05B17/00 ,  C25D3/38 ,  C25D3/46 ,  C25D3/48 ,  C25D3/54 ,  C25D5/34 ,  C25D5/48 ,  C25D5/54

Abstract: A method for manufacturing an aperture plate includes depositing a releasable seed layer above a substrate, applying a first patterned photolithography mask above the releasable seed layer, the first patterned photolithography mask having a negative pattern to a desired aperture pattern, electroplating a first material above the exposed portions of the releasable seed layer and defined by the first mask, applying a second photolithography mask above the first material, the second photolithography mask having a negative pattern to a first cavity, electroplating a second material above the exposed portions of the first material and defined by the second mask, removing both masks, and etching the releasable seed layer to release the first material and the second material. The first and second material form an aperture plate for use in aerosolizing a liquid. Other aperture plates and methods of producing aperture plates are described.

公开(公告)号：US11872573B2

公开(公告)日：2024-01-16

申请号：US17818484

申请日：2022-08-09

Applicant: Stamford Devices Limited

Inventor： Brendan Hogan ,  Hong Xu

IPC: B05B1/02 ,  B05B17/00 ,  B05B1/06 ,  C25D7/04 ,  C25D1/08 ,  B05B17/06 ,  A61M11/00 ,  A61M15/00

CPC classification number: B05B1/02 ,  B05B17/0638 ,  B05B17/0653 ,  C25D1/08 ,  C25D7/04 ,  A61M11/005 ,  A61M15/0085 ,  A61M2207/00

Abstract: An aperture plate is manufactured by plating metal around a mask of resist columns having a desired size, pitch, and profile, which yields a wafer about 60 μm thickness. This is approximately the full desired target aperture plate thickness. The plating is continued so that the metal overlies the top surfaces of the columns until the desired apertures are achieved. This needs only one masking/plating cycle to achieve the desired plate thickness. Also, the plate has passageways formed beneath the apertures, formed as an integral part of the method, by mask material removal. These are suitable for entrainment of aerosolized droplets exiting the apertures.

公开(公告)号：US10279357B2

公开(公告)日：2019-05-07

申请号：US14719036

申请日：2015-05-21

Applicant: Stamford Devices Limited

Inventor： Brendan Hogan ,  Hong Xu

IPC: C25D7/04 ,  B05B1/02 ,  B05B17/00 ,  C25D1/08 ,  B05B17/06 ,  A61M11/00 ,  A61M15/00

Abstract: An aperture plate is manufactured by plating metal around a mask of resist columns having a desired size, pitch, and profile, which yields a wafer about 60 μm thickness. This is approximately the full desired target aperture plate thickness. The plating is continued so that the metal overlies the top surfaces of the columns until the desired apertures are achieved. This needs only one masking/plating cycle to achieve the desired plate thickness. Also, the plate has passageways formed beneath the apertures, formed as an integral part of the method, by mask material removal. These are suitable for entrainment of aerosolized droplets exiting the apertures.