Abstract:
Microelectromechanical (MEMS) structures and switches employing movable actuators wherein particular ones of which move perpendicular to an underlying substrate and particular others move in a direction substantially parallel to the underlying substrate thereby providing more positive actuation.
Abstract:
The micro-electromechanical (MEMS) switch comprises a first double-sided cantilever MEMS actuator attached to a substrate and movable in two opposite directions, and a second cantilever MEMS actuator attached to the substrate. In use, the first MEMS actuator is moved in either directions to distribute the stress more uniformly, thereby reducing the mechanical creep and improving its reliability as well as its operation life.
Abstract:
Microelectromechanical (MEMS) structures and switches employing movable actuators wherein particular ones of which move perpendicular to an underlying substrate and particular others move in a direction substantially parallel to the underlying substrate thereby providing more positive actuation.
Abstract:
The micro-electromechanical (MEMS) actuator comprises a hot arm member and a cold arm member. The cold arm member comprises at least two longitudinally spaced-apart flexors. The actuators may also be constructed with at least one among the hot arm member and the cold arm member comprising at least one spring section. The stress in this improved MEMS actuator is more uniformly distributed, thereby reducing the mechanical creep and improving its reliability as well as its operation life.
Abstract:
Micro-electromechanical systems (MEMS) actuators and switches exhibiting geometries and configurations providing superior operating characteristics and longer lifetimes.
Abstract:
The invention relates to a method of assessing the risk of whiskers appearing on the surface of a metallic deposit, a pure metal deposit or an alloy deposit on a substrate, using a measurement of the electrochemical impedance of the metallic deposit.
Abstract:
The present invention provides methods for the use of copper electroplating compositions. Electroplating compositions of the invention contain an increased brightener concentration that can provide effective copper plate on difficult-to-plate aperture walls, including high aspect ratio, small diameter microvias.
Abstract:
The present invention relates to a method of electrodepositing metal onto a substrate, which comprises applying a pulsed periodic reverse current across the electrodes of a plating cell utilizing a peak reverse current density and peak forward current density; and varying the ratio of peak reverse current density to peak forward current density in periodic cycles to provide metal deposits of uniform thickness and appearance upon the substrate. The invention also relates to a process for improving the properties of an electrodeposit, particularly on substrates having uneven surfaces or apertures, by using programmed pulse periodic reverse current modulation. More particularly, it involves varying the anodic to cathodic current density ratio, in order to improve the surface uniformity appearance, grain structure and levelling of the deposit while maintaining high current density throwing power.
Abstract:
A multi-point to multi-point intercom system, formed by at least one intercom server and a plurality of intercom terminals, the intercom terminals registered as talking or listening intercom terminals in an intercom session table. The intercom server sends to listening intercom terminals some or all of the unmixed audio packets received by talking intercom terminals according to the intensity signal value found in the header of the unmixed audio packets.
Abstract:
A multi-point to multi-point intercom system, formed by at least one intercom server and a plurality of intercom terminals, the intercom terminals registered as talking or listening intercom terminals in an intercom session table. The intercom server sends to listening intercom terminals some or all of the unmixed audio packets received by talking intercom terminals according to the intensity signal value found in the header of the unmixed audio packets.