Method for patterning devices
    1.
    发明授权
    Method for patterning devices 有权
    图案形成装置的方法

    公开(公告)号:US06677174B2

    公开(公告)日:2004-01-13

    申请号:US10100866

    申请日:2002-03-19

    IPC分类号: H01L2100

    摘要: The present invention relates to patterning methods for organic devices, and more particularly to patterning methods using a die. A first layer of organic materials is deposited over a substrate, followed by a first electrode layer. A first patterned die having a raised portion is then pressed onto the first electrode layer, such that the raised portion of the first patterned die contacts portions of the first electrode layer. The patterned die is removed, such that the portions of the first electrode layer in contact with the raised portions of the first patterned die are removed. In one embodiment of the invention, a second organic layer is then deposited over the first electrode layer, followed by a second electrode layer. A second patterned die having a raised portion is pressed onto the second electrode layer, such that the raised portion of the second patterned die contacts portions of the second electrode layer. The second patterned die is removed, such that the portions of the second electrode layer in contact with the raised portions of the second patterned die are removed. Preferably the patterned die is coated with an adhesive material such as a metal.

    摘要翻译: 本发明涉及有机器件的图案化方法,更具体地涉及使用模具的图案化方法。 第一层有机材料沉积在衬底上,随后是第一电极层。 然后将具有凸起部分的第一图案的模具压在第一电极层上,使得第一图案化裸片的凸起部分接触第一电极层的部分。 去除图案化的管芯,使得与第一图案化裸片的凸起部分接触的第一电极层的部分被去除。 在本发明的一个实施例中,然后在第一电极层上沉积第二有机层,随后沉积第二电极层。 具有凸起部分的第二图案的模具被压在第二电极层上,使得第二图案化芯片的凸起部分接触第二电极层的部分。 去除第二图案的芯片,使得与第二图案化芯片的凸起部分接触的第二电极层的部分被去除。 优选地,图案化的模具用诸如金属的粘合材料涂覆。

    Method for patterning organic thin film devices using a die
    2.
    发明授权
    Method for patterning organic thin film devices using a die 有权
    使用模具图案化有机薄膜器件的方法

    公开(公告)号:US06468819B1

    公开(公告)日:2002-10-22

    申请号:US09718215

    申请日:2000-11-21

    IPC分类号: H01L2100

    摘要: The present invention relates to patterning methods for organic devices, and more particularly to patterning methods using a die. A first layer of organic materials is deposited over a substrate, followed by a first electrode layer. A first patterned die having a raised portion is then pressed onto the first electrode layer, such that the raised portion of the first patterned die contacts portions of the first electrode layer. The patterned die is removed, such that the portions of the first electrode layer in contact with the raised portions of the first patterned die are removed. In one embodiment of the invention, a second organic layer is then deposited over the first electrode layer, followed by a second electrode layer. A second patterned die having a raised portion is pressed onto the second electrode layer, such that the raised portion of the second patterned die contacts portions of the second electrode layer. The second patterned die is removed, such that the portions of the second electrode layer in contact with the raised portions of the second patterned die are removed. Preferably the patterned die is coated with an adhesive material such as a metal.

    摘要翻译: 本发明涉及有机器件的图案化方法,更具体地涉及使用模具的图案化方法。 第一层有机材料沉积在衬底上,随后是第一电极层。 然后将具有凸起部分的第一图案的模具压在第一电极层上,使得第一图案化裸片的凸起部分接触第一电极层的部分。 去除图案化的管芯,使得与第一图案化裸片的凸起部分接触的第一电极层的部分被去除。 在本发明的一个实施例中,然后在第一电极层上沉积第二有机层,随后沉积第二电极层。 具有凸起部分的第二图案的模具被压在第二电极层上,使得第二图案化芯片的凸起部分接触第二电极层的部分。 去除第二图案的芯片,使得与第二图案化芯片的凸起部分接触的第二电极层的部分被去除。 优选地,图案化的模具用诸如金属的粘合材料涂覆。

    Transfer of patterned metal by cold-welding
    3.
    发明授权
    Transfer of patterned metal by cold-welding 有权
    通过冷焊转移图案金属

    公开(公告)号:US06895667B2

    公开(公告)日:2005-05-24

    申请号:US09833695

    申请日:2001-04-13

    摘要: Methods for patterning a metal over a substrate and devices formed using the methods are disclosed. A patterned die having at least one raised portion and having a metal layer over the die is pressed onto a thin metal film over a substrate, such that the metal layer over the raised portion of the patterned die contacts portions of the thin metal film. Pressure is then applied such that the metal layer and the thin metal film cold-weld to one another. The patterned die is removed, such that the portions of the metal layer cold-welded to the thin metal film break away from the die and remain cold-welded to the thin metal film over the substrate, in substantially the same pattern as the patterned die.

    摘要翻译: 公开了在衬底上图案化金属的方法和使用该方法形成的器件。 具有至少一个凸起部分并且在模具上方具有金属层的图案模具被压在衬底上的薄金属膜上,使得图案化模具的凸起部分上方的金属层接触薄金属膜的部分。 然后施加压力,使得金属层和薄金属膜彼此冷焊。 图案化的模具被去除,使得冷焊到薄金属膜上的金属层的部分远离模具脱落并且保持冷焊接到衬底上的薄金属膜上,与图案化模具基本相同的图案 。

    Method for patterning devices
    4.
    发明授权
    Method for patterning devices 有权
    图案形成装置的方法

    公开(公告)号:US06294398B1

    公开(公告)日:2001-09-25

    申请号:US09447793

    申请日:1999-11-23

    IPC分类号: H01L1200

    摘要: The present invention relates to patterning methods for organic devices, and more particularly to patterning methods using a die. The method includes depositing a first layer of organic materials over a substrate; depositing a second layer of an electrode material over the first layer of organic materials; pressing a patterned die having a raised portion onto the second layer; and removing the patterned die. Preferably the patterned die is coated with a metal. Optionally the method includes depositing additional layers over the substrate prior to pressing the patterned die.

    摘要翻译: 本发明涉及有机器件的图案化方法,更具体地涉及使用模具的图案化方法。 该方法包括在衬底上沉积第一层有机材料; 在所述第一有机材料层上沉积第二层电极材料; 将具有凸起部分的图案化模具压到第二层上; 并去除图案的模具。 优选地,图案化的模具被金属涂覆。 可选地,该方法包括在压制图案化的模具之前在衬底上沉积附加层。

    Methods of fabricating devices by low pressure cold welding
    5.
    发明授权
    Methods of fabricating devices by low pressure cold welding 有权
    低压冷焊制造装置的方法

    公开(公告)号:US08637345B2

    公开(公告)日:2014-01-28

    申请号:US13525539

    申请日:2012-06-18

    IPC分类号: H01L51/40

    摘要: Methods of transferring a metal and/or organic layer from a patterned stamp, preferably a soft, elastomeric stamp, to a substrate are provided. The patterned metal or organic layer may be used for example, in a wide range of electronic devices. The present methods are particularly suitable for nanoscale patterning of organic electronic components.

    摘要翻译: 提供了将金属和/或有机层从图案化的印模,优选软的弹性体印模转移到基底的方法。 图案化的金属或有机层可以用于例如广泛的电子器件中。 本发明的方法特别适用于有机电子元件的纳米尺度图案化。

    Methods of fabricating devices by low pressure cold welding
    6.
    发明授权
    Methods of fabricating devices by low pressure cold welding 有权
    低压冷焊制造装置的方法

    公开(公告)号:US08222072B2

    公开(公告)日:2012-07-17

    申请号:US10387925

    申请日:2003-03-13

    IPC分类号: H01L51/40

    摘要: Methods of transferring a metal and/or organic layer from a patterned stamp, preferably a soft, elastomeric stamp, to a substrate are provided. The patterned metal or organic layer may be used for example, in a wide range of electronic devices. The present methods are particularly suitable for nanoscale patterning of organic electronic components.

    摘要翻译: 提供了将金属和/或有机层从图案化的印模,优选软的弹性体印模转移到基底的方法。 图案化的金属或有机层可以用于例如广泛的电子器件中。 本发明的方法特别适用于有机电子元件的纳米尺度图案化。

    Top-gate bottom-contact organic transistor
    8.
    发明授权
    Top-gate bottom-contact organic transistor 有权
    顶栅底接触有机晶体管

    公开(公告)号:US09496315B2

    公开(公告)日:2016-11-15

    申请号:US12859496

    申请日:2010-08-19

    摘要: Top-gate, bottom-contact organic thin film transistors are provided. The transistors may include metal bilayer electrodes to aid in charge movement within the device. In an embodiment, an organic transistor includes a drain electrode and a source electrode disposed over a first region of a substrate, a transition metal oxide layer disposed over and in direct physical contact with the drain electrode and the source electrode, an organic preferentially hole conducting channel layer disposed over the metal oxide and between the drain electrode and the source electrode, and a gate electrode disposed over the channel.

    摘要翻译: 提供了顶栅,底接触有机薄膜晶体管。 晶体管可以包括金属双层电极,以帮助器件内的电荷移动。 在一个实施例中,有机晶体管包括设置在衬底的第一区域上的漏电极和源电极,设置在漏电极和源电极上并与漏电极和源电极直接物理接触的过渡金属氧化物层,有机优先导孔 沟道层设置在金属氧化物之上,并且在漏电极和源电极之间,以及设置在沟道上的栅电极。

    Architectures and criteria for the design of high efficiency organic photovoltaic cells
    10.
    发明授权
    Architectures and criteria for the design of high efficiency organic photovoltaic cells 有权
    高效有机光伏电池设计的架构和标准

    公开(公告)号:US08987589B2

    公开(公告)日:2015-03-24

    申请号:US11486163

    申请日:2006-07-14

    摘要: An organic photovoltaic cell includes an anode and a cathode, and a plurality of organic semiconductor layers between the anode and the cathode. At least one of the anode and the cathode is transparent. Each two adjacent layers of the plurality of organic semiconductor layers are in direct contact. The plurality of organic semiconductor layers includes an intermediate layer consisting essentially of a photoconductive material, and two sets of at least three layers. A first set of at least three layers is between the intermediate layer and the anode. Each layer of the first set consists essentially of a different organic semiconductor material having a higher LUMO and a higher HOMO, relative to the material of an adjacent layer of the plurality of organic semiconductor layers closer to the cathode. A second set of at least three layers is between the intermediate layer and the cathode. Each layer of the second set consists essentially of a different organic semiconductor material having a lower LUMO and a lower HOMO, relative to the material of an adjacent layer of the plurality of organic semiconductor layers closer to the anode.

    摘要翻译: 有机光伏电池包括阳极和阴极,以及在阳极和阴极之间的多个有机半导体层。 阳极和阴极中的至少一个是透明的。 多个有机半导体层中的每两相邻层直接接触。 多个有机半导体层包括基本上由光电导材料组成的中间层和两组至少三层。 中间层和阳极之间至少有三层的第一组。 相对于更靠近阴极的多个有机半导体层的相邻层的材料,第一组的每个层基本上由具有较高LUMO和较高HOMO的不同有机半导体材料组成。 第二组至少三层在中间层和阴极之间。 相对于更靠近阳极的多个有机半导体层的相邻层的材料,第二组的每个层基本上由具有较低LUMO和较低HOMO的不同有机半导体材料组成。