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1.发明授权公开(公告)号：US08512504B2
公开(公告)日：2013-08-20
申请号：US12436260
申请日：2009-05-06
申请人： Steven A. Castaldi , Kesheng Feng
发明人： Steven A. Castaldi , Kesheng Feng
IPC分类号： B29C65/00
CPC分类号： C23C22/52 , B05D3/102 , B05D2202/45 , C23C22/83 , C23F1/18 , H05K3/383 , H05K2203/0796 , H05K2203/124 , Y10T156/10
摘要： A process for treating metal surfaces that includes first contacting the metal surface with a particular acidic peroxide adhesion promoting composition, followed by contacting that metal surface with an aqueous acid post-dip composition to provide a micro-roughened surface. This treatment is particularly suitable for treating metal surfaces used in printed circuit multilayer construction.
摘要翻译： 一种用于处理金属表面的方法，其包括首先使金属表面与特定的酸性过氧化物粘附促进组合物接触，然后使该金属表面与酸性浸渍后组合物接触以提供微粗糙表面。 这种处理特别适用于处理印刷电路多层结构中使用的金属表面。
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公开(公告)号：US08308893B2
公开(公告)日：2012-11-13
申请号：US12697425
申请日：2010-02-01
申请人： Ming De Wang , Steven A. Castaldi , Kesheng Feng
发明人： Ming De Wang , Steven A. Castaldi , Kesheng Feng
CPC分类号： B32B7/12 , B32B7/04 , B32B15/08 , B32B15/20 , B32B27/06 , B32B2255/06 , B32B2255/205 , B32B2255/24 , B32B2307/50 , B32B2307/732 , B32B2457/08 , C23C22/63 , C23C22/78 , C23C22/83 , H05K3/385 , H05K3/388 , H05K2203/0315
摘要： A method of increasing adhesion between a copper or copper alloy layer and a polymeric resin. The method includes the steps of a) applying a pre-dip composition to the copper layer; b) applying a nano-oxide composition to the treated copper layer, c) applying a post-dip composition to the nano-oxide treated surface, and d) bonding a resin to the treated copper surface. The nano-oxide composition comprises (i) a chlorite; (ii) a caustic; (iii) a phosphate salt; (iv) an organic nitro compound; and (v) a thio compound. The post-dip composition is an alkaline solution that comprises (i) a phosphate salt; (ii) a source of molybdenum ions; and (iii) a thiazole. The process of the invention is useful for improving the bond between copper and a resin, including high Tg resins, halogen-free resins, and high speed/lost resins.
摘要翻译： 提高铜或铜合金层与聚合物树脂之间粘合力的方法。 该方法包括以下步骤：a）将预浸组合物施加到铜层; b）向经处理的铜层施加纳米氧化物组合物，c）将浸渍后组合物施加到纳米氧化物处理的表面上，以及d）将树脂粘合到经处理的铜表面。 纳米氧化物组合物包含（i）亚氯酸盐; （ii）苛性碱; （iii）磷酸盐; （iv）有机硝基化合物; 和（v）硫代化合物。 浸渍后组合物是碱性溶液，其包含（i）磷酸盐; （ii）钼离子源; 和（iii）噻唑。 本发明的方法可用于改善铜和树脂之间的键合，包括高Tg树脂，无卤素树脂和高速/失去树脂。
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公开(公告)号：US07875558B2
公开(公告)日：2011-01-25
申请号：US11893068
申请日：2007-08-14
申请人： Kesheng Feng , Nilesh Kapadia , Steven A. Castaldi
发明人： Kesheng Feng , Nilesh Kapadia , Steven A. Castaldi
CPC分类号： C23F1/18 , H05K3/383 , H05K2203/122
摘要： The present invention is directed to a microetching composition comprising a source of cupric ions, acid, a nitrile compound, and a source of halide ions. Other additive, including organic solvents, a source of molybdenum ions, amines, polyamines, and acrylamides may also be included in the composition of the invention. The present invention is also directed to a method of microetching copper or copper alloy surfaces to increase the adhesion of the copper surface to a polymeric material, comprising the steps of contacting a copper or copper alloy surface with the composition of the invention, and thereafter bonding the polymeric material to the copper or copper alloy surface.
摘要翻译： 本发明涉及包含铜离子源，酸，腈化合物和卤素离子源的微蚀刻组合物。 其它添加剂，包括有机溶剂，钼离子源，胺，多胺和丙烯酰胺也可以包括在本发明的组合物中。 本发明还涉及一种使铜或铜合金表面微蚀以增加铜表面与聚合物材料的粘附性的方法，包括以下步骤：使铜或铜合金表面与本发明的组合物接触，然后粘合 聚合物材料到铜或铜合金表面。
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公开(公告)号：US20110186221A1
公开(公告)日：2011-08-04
申请号：US12697425
申请日：2010-02-01
申请人： Ming De Wang , Steven A. Castaldi , Kesheng Feng
发明人： Ming De Wang , Steven A. Castaldi , Kesheng Feng
CPC分类号： B32B7/12 , B32B7/04 , B32B15/08 , B32B15/20 , B32B27/06 , B32B2255/06 , B32B2255/205 , B32B2255/24 , B32B2307/50 , B32B2307/732 , B32B2457/08 , C23C22/63 , C23C22/78 , C23C22/83 , H05K3/385 , H05K3/388 , H05K2203/0315
摘要： A method of increasing adhesion between a copper or copper alloy layer and a polymeric resin. The method includes the steps of a) applying a pre-dip composition to the copper layer; b) applying a nano-oxide composition to the treated copper layer, c) applying a post-dip composition to the nano-oxide treated surface, and d) bonding a resin to the treated copper surface. The nano-oxide composition comprises (i) a chlorite; (ii) a caustic; (iii) a phosphate salt; (iv) an organic nitro compound; and (v) a thio compound. The post-dip composition is an alkaline solution that comprises (i) a phosphate salt; (ii) a source of molybdenum ions; and (iii) a thiazole. The process of the invention is useful for improving the bond between copper and a resin, including high Tg resins, halogen-free resins, and high speed/lost resins.
摘要翻译： 提高铜或铜合金层与聚合物树脂之间粘合力的方法。 该方法包括以下步骤：a）将预浸组合物施加到铜层; b）向经处理的铜层施加纳米氧化物组合物，c）将浸渍后组合物施加到纳米氧化物处理的表面上，以及d）将树脂粘合到经处理的铜表面。 纳米氧化物组合物包含（i）亚氯酸盐; （ii）苛性碱; （iii）磷酸盐; （iv）有机硝基化合物; 和（v）硫代化合物。 浸渍后组合物是碱性溶液，其包含（i）磷酸盐; （ii）钼离子源; 和（iii）噻唑。 本发明的方法可用于改善铜和树脂之间的键合，包括高Tg树脂，无卤素树脂和高速/失去树脂。
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公开(公告)号：US20090294294A1
公开(公告)日：2009-12-03
申请号：US12156613
申请日：2008-06-03
IPC分类号： C25D5/02
CPC分类号： H05K3/383 , C23F1/18 , C23F11/184 , H05K3/385 , H05K2203/0796 , H05K2203/124
摘要： A composition for providing acid resistance to copper surfaces in the production of multilayered printed circuit boards. The composition comprises an acid, an oxidizer, a five-membered heterocyclic compound and a thiophosphate or a phosphorous sulfide compound. In a preferred embodiment, the phosphorous compound is phosphorus pentasulfide. The composition is applied to a copper or copper alloy substrate and the copper substrate is thereafter bonded to a polymeric material.
摘要翻译： 一种用于在制造多层印刷电路板中提供对铜表面的耐酸性的组合物。 组合物包含酸，氧化剂，五元杂环化合物和硫代磷酸酯或硫化磷化合物。 在优选的实施方案中，磷化合物是五硫化二磷。 将组合物施加到铜或铜合金基底上，然后将铜基底结合到聚合物材料上。
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公开(公告)号：US20080264900A1
公开(公告)日：2008-10-30
申请号：US11796660
申请日：2007-04-27
申请人： Kesheng Feng , Ming De Wang , Steven A. Castaldi
发明人： Kesheng Feng , Ming De Wang , Steven A. Castaldi
CPC分类号： C09J5/02 , C09J2400/163 , C09J2400/166 , C09J2400/226 , C23C22/40 , C23C22/52 , C23F1/18 , H05K3/383 , H05K2203/0796 , H05K2203/124
摘要： A process is described for treating metal surfaces with roughening compositions that use poly(ethyleneamino propionitrile)polymer as an additive in the composition to improve adhesion of polymeric materials to the metal surfaces and to improve peel strength for thermal stability. The polymer of the invention may be added to compositions containing for example, cupric chloride and hydrochloric acid and is also usable in compositions containing an oxidizer/acid/azole mixture. Other additives, such as adiponitrile may also be beneficially added to compositions of the invention.
摘要翻译： 描述了一种用于使用聚（乙烯基氨基丙腈）聚合物作为组合物中的添加剂的粗糙化组合物处理金属表面以改善聚合物材料与金属表面的粘合性并提高热稳定性的剥离强度的方法。 本发明的聚合物可以加入含有例如氯化铜和盐酸的组合物中，也可用于含有氧化剂/酸/唑混合物的组合物中。 其它添加剂，例如己二腈也可有利地加入到本发明的组合物中。
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公开(公告)号：US08486281B2
公开(公告)日：2013-07-16
申请号：US12573298
申请日：2009-10-05
申请人： Kesheng Feng , Nilesh Kapadia , Steven A. Castaldi , John Ganjei
发明人： Kesheng Feng , Nilesh Kapadia , Steven A. Castaldi , John Ganjei
IPC分类号： H01B13/00
摘要： A nickel-chromium alloy etching composition comprising sulfuric acid, a source of chloride ions, including hydrochloric acid or sodium, potassium or ammonium chloride, and a sulfur compound comprising a sulfur atom with an oxidation state between −2 to +5, such as thiosulfate, sulfide, sulfite, bisulfite, metabisulfite and phosphorus pentasulfide that can efficiently remove nickel-chromium alloy in the presence of copper circuits is disclosed.
摘要翻译： 一种镍铬合金蚀刻组合物，其包含硫酸，氯离子源，包括盐酸或钠，氯化钾或氯化铵，以及包含氧化态在-2至+5之间的硫原子的硫化合物，例如硫代硫酸盐 ，在铜电路的存在下可以有效去除镍铬合金的硫化物，亚硫酸盐，亚硫酸氢盐，偏亚硫酸氢盐和五硫化磷。
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公开(公告)号：US07645393B2
公开(公告)日：2010-01-12
申请号：US11796660
申请日：2007-04-27
申请人： Kesheng Feng , Ming De Wang , Steven A. Castaldi
发明人： Kesheng Feng , Ming De Wang , Steven A. Castaldi
CPC分类号： C09J5/02 , C09J2400/163 , C09J2400/166 , C09J2400/226 , C23C22/40 , C23C22/52 , C23F1/18 , H05K3/383 , H05K2203/0796 , H05K2203/124
摘要： A process is described for treating metal surfaces with roughening compositions that use poly(ethyleneamino propionitrile) polymer as an additive in the composition to improve adhesion of polymeric materials to the metal surfaces and to improve peel strength for thermal stability. The polymer of the invention may be added to compositions containing for example, cupric chloride and hydrochloric acid and is also usable in compositions containing an oxidizer/acid/azole mixture. Other additives, such as adiponitrile may also be beneficially added to compositions of the invention.
摘要翻译： 描述了一种用于使用聚（乙烯基氨基丙腈）聚合物作为组合物中的添加剂的粗糙化组合物处理金属表面以改善聚合物材料与金属表面的粘合性并提高热稳定性的剥离强度的方法。 本发明的聚合物可以加入含有例如氯化铜和盐酸的组合物中，也可用于含有氧化剂/酸/唑混合物的组合物中。 其它添加剂，例如己二腈也可有利地加入到本发明的组合物中。
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公开(公告)号：US08518281B2
公开(公告)日：2013-08-27
申请号：US12156613
申请日：2008-06-03
IPC分类号： C03C15/00
CPC分类号： H05K3/383 , C23F1/18 , C23F11/184 , H05K3/385 , H05K2203/0796 , H05K2203/124
摘要： A composition for providing acid resistance to copper surfaces in the production of multilayered printed circuit boards. The composition comprises an acid, an oxidizer, a five-membered heterocyclic compound and a thiophosphate or a phosphorous sulfide compound. In a preferred embodiment, the phosphorous compound is phosphorus pentasulfide. The composition is applied to a copper or copper alloy substrate and the copper substrate is thereafter bonded to a polymeric material.
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10.发明授权公开(公告)号：US08088246B2
公开(公告)日：2012-01-03
申请号：US12350380
申请日：2009-01-08
CPC分类号： H05K3/383 , B32B2305/076 , B32B2311/12 , B32B2457/08 , C23F1/18 , H05K2203/122
摘要： An adhesion promoting composition and a process for treating metal surfaces with the adhesion promoting composition is described. The adhesion promoting composition comprises an oxidizer, an acid, a corrosion inhibitor, a source of halide ions and a material selected from a mercapto propane sulfonate, mercapto propane sulfonic acid, and bis-sodium sulfopropyl disulfide. The adhesion promoting composition increases the adhesion of polymeric materials to the metal surfaces and also provides increased acid resistance.
摘要翻译： 本发明描述了粘合促进组合物和用粘合促进组合物处理金属表面的方法。 粘合促进组合物包含氧化剂，酸，腐蚀抑制剂，卤离子源和选自巯基丙磺酸盐，巯基丙磺酸和二磺酸二磺酸二磺酸盐的材料。 粘合促进组合物增加了聚合材料对金属表面的粘附性，并且还提供增加的耐酸性。
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