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公开(公告)号：US4362463A
公开(公告)日：1982-12-07
申请号：US231342
申请日：1981-02-04
申请人： Sumio Sudo , Hiromichi Anan , Masayuki Yamada
发明人： Sumio Sudo , Hiromichi Anan , Masayuki Yamada
CPC分类号： F04D15/0055
摘要： A movable blade pump including an actuating mechanism for imparting rotational movement to blades which mechanism is contained in an impeller boss sealed against the outside and filled with hydraulic fluid and is driven by a hydraulic cylinder device secured to a suction casing below the impeller boss. Feed and discharge of hydraulic fluid into and from the hydraulic piston device are effected through fluid passages formed in the suction casing and a fixed mounting for the hydraulic fluid device, and the blades are set at any angular positions within the range of the stroke of the piston.
摘要翻译： 一种可移动叶片泵，包括用于向叶片旋转运动的致动机构，该机构包含在密封在外部并填充有液压流体的叶轮凸台中，并且由固定到叶轮凸起下方的抽吸壳体的液压缸装置驱动。 通过在吸入壳体中形成的流体通道和用于液压流体装置的固定安装件来实现液压流体进入液压活塞装置和从液压活塞装置的进料和排放，并且叶片被设置在任何角度位置， 活塞。
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公开(公告)号：US06873045B2
公开(公告)日：2005-03-29
申请号：US10610822
申请日：2003-07-02
IPC分类号： H01L23/051 , H01L23/36 , H01L25/07 , H01L25/18 , H02M1/00 , H02M7/48 , H01L23/52 , H01L29/40 , H01L23/48
CPC分类号： H01L25/072 , H01L23/051 , H01L23/36 , H01L24/48 , H01L2224/05599 , H01L2224/48091 , H01L2224/48095 , H01L2224/48247 , H01L2224/484 , H01L2224/85399 , H01L2924/00014 , H01L2924/01004 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01023 , H01L2924/01029 , H01L2924/01047 , H01L2924/01074 , H01L2924/014 , H01L2924/10253 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/3011 , H01L2924/351 , H01L2224/45099 , H01L2924/00
摘要： One method of achieving the above subjects is by connecting one of electroconductive members 12, which are pre-connected to the top and bottom of a semiconductor chip 11 and have thermal conductivity, to an electroconductive member 13, which is used with the semiconductor chip 11 to constitute a laminated structure, in electrically insulated form on the same surface as the installation surface of the electroconductive member 13 so as to straddle the laminated structure constituted by the semiconductor chip 11 and the electroconductive member 13.
摘要翻译： 实现上述目的的一种方法是将预先连接到半导体芯片11的顶部和底部并具有导热性的导电构件12之一连接到与半导体芯片11一起使用的导电构件13 以与导电构件13的安装表面相同的表面上形成电绝缘形式的层叠结构，以跨越由半导体芯片11和导电构件13构成的叠层结构。
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公开(公告)号：US20070159864A1
公开(公告)日：2007-07-12
申请号：US11670365
申请日：2007-02-01
IPC分类号： H02M7/04
CPC分类号： H01L23/3675 , H01L23/051 , H01L25/072 , H01L2224/32225 , H01L2224/33181 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/3011 , H01L2924/00
摘要： One method of achieving the above subjects is by connecting a block member 14, which is connected to the side opposite to that of a semiconductor chip 11 having insulating substrates 12 and 13 connected to the top and bottom of the semiconductor chip 11, to a block member 15 across an laminated structure constituted by the semiconductor chip 11 and the insulating substrates 12 and 13.
摘要翻译： 实现上述目的的一种方法是通过将连接到具有连接到半导体芯片11的顶部和底部的具有绝缘基板12和13的半导体芯片11的相反侧的块的连接件块连接到块 构件15跨越由半导体芯片11和绝缘基板12和13构成的层叠结构。
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公开(公告)号：US06943445B2
公开(公告)日：2005-09-13
申请号：US10468038
申请日：2002-03-29
申请人： Shinji Shirakawa , Akira Mishima , Keiichi Mashino , Toshiyuki Innami , Shinichi Fujino , Hiromichi Anan , Yoshitaka Ochiai
发明人： Shinji Shirakawa , Akira Mishima , Keiichi Mashino , Toshiyuki Innami , Shinichi Fujino , Hiromichi Anan , Yoshitaka Ochiai
IPC分类号： H01L23/538 , H01L25/07 , H02M7/00 , H01L23/34
CPC分类号： H02M7/003 , H01L23/5383 , H01L23/645 , H01L24/48 , H01L24/49 , H01L25/072 , H01L25/18 , H01L2224/32225 , H01L2224/40225 , H01L2224/48091 , H01L2224/48111 , H01L2224/48227 , H01L2224/48472 , H01L2224/49111 , H01L2224/49175 , H01L2224/73265 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01023 , H01L2924/01029 , H01L2924/01074 , H01L2924/014 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/19041 , H01L2924/19043 , H01L2924/19107 , H01L2924/30105 , H01L2924/30107 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/05599
摘要： The present invention provides a semiconductor device which reduces an inductance of wiring for bridge-connecting semiconductor switches and realizes a reduction in size. Within the semiconductor device formed are two controllable bridge-connected semiconductor switches 13a and 13b, an output terminal, positive/negative polarity DC terminals 2 and 3, and an insulating substrate 15a in which conductor layers 12, 17 and 19 having a conductor section and in an inner layer for bridge-connecting the semiconductor switches to the DC terminals on a surface thereof and insulating layers 16 and 18 are alternately laminated. The surface and inner-layer conductor layers 12 and 17 which interpose the insulating layer 16 therebetween are electrically connected by a conductor 20 passing through the insulating layer 16 interposed between the conductor layers 12 and 17. A current path (dotted line) is so provided as to allow current flowing through a bridge circuit for mounting the two semiconductor switches on the insulating substrate to flow in opposite directions between the conductor layers 12 and 17 which interpose the insulating layer 16 therebetween.
摘要翻译： 本发明提供一种降低用于桥接半导体开关的布线的电感的半导体器件，并且实现了尺寸的减小。 在形成的半导体器件内部有两个可控制的桥接半导体开关13a和13b，一个输出端子，正/负极性DC端子2和3以及绝缘基板15a，其中导体层12,17和19具有 导体部分和用于将半导体开关桥接到其表面上的DC端子的内层中，并且绝缘层16和18交替层叠。 其间插入绝缘层16的表面和内层导体层12和17通过插在导体层12和17之间的绝缘层16的导体20电连接。 提供电流路径（虚线），以允许电流流过用于将绝缘基板上的两个半导体开关安装在绝缘基板上的电桥流动，以在导体层12和17之间的相反方向流动，其间插入绝缘层16。
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公开(公告)号：US07508068B2
公开(公告)日：2009-03-24
申请号：US11670365
申请日：2007-02-01
IPC分类号： H01L23/34
CPC分类号： H01L23/3675 , H01L23/051 , H01L25/072 , H01L2224/32225 , H01L2224/33181 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/3011 , H01L2924/00
摘要： One method of achieving the above subjects is by connecting a block member 14, which is connected to the side opposite to that of a semiconductor chip 11 having insulating substrates 12 and 13 connected to the top and bottom of the semiconductor chip 11, to a block member 15 across an laminated structure constituted by the semiconductor chip 11 and the insulating substrates 12 and 13.
摘要翻译： 实现上述目的的一种方法是通过将连接到具有连接到半导体芯片11的顶部和底部的具有绝缘基板12和13的半导体芯片11的相反侧的块的连接件块连接到块 构件15跨越由半导体芯片11和绝缘基板12和13构成的层叠结构。
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公开(公告)号：US07193317B2
公开(公告)日：2007-03-20
申请号：US10610816
申请日：2003-07-02
IPC分类号： H01L23/367
CPC分类号： H01L23/3675 , H01L23/051 , H01L25/072 , H01L2224/32225 , H01L2224/33181 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/3011 , H01L2924/00
摘要： One method of achieving the above subjects is by connecting a block member 14, which is connected to the side opposite to that of a semiconductor chip 11 having insulating substrates 12 and 13 connected to the top and bottom of the semiconductor chip 11, to a block member 15 across an laminated structure constituted by the semiconductor chip 11 and the insulating substrates 12 and 13.
摘要翻译： 实现上述目的的一种方法是通过将连接到具有连接到半导体芯片11的顶部和底部的具有绝缘基板12和13的半导体芯片11的相反侧的块的连接件块连接到块 构件15跨越由半导体芯片11和绝缘基板12和13构成的层叠结构。
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公开(公告)号：US06843335B2
公开(公告)日：2005-01-18
申请号：US10024338
申请日：2001-12-21
申请人： Shinji Shirakawa , Akira Mishima , Keiichi Mashino , Toshiyuki Innami , Shinichi Fujino , Hiromichi Anan , Yoshitaka Ochiai
发明人： Shinji Shirakawa , Akira Mishima , Keiichi Mashino , Toshiyuki Innami , Shinichi Fujino , Hiromichi Anan , Yoshitaka Ochiai
IPC分类号： H02M7/04 , B60L11/14 , B60L11/18 , H01L23/50 , H01L25/16 , H02M7/00 , H02M7/5387 , H02P27/06 , H05K7/14 , B60K1/00
CPC分类号： B60L15/007 , B60L11/1803 , H01L23/50 , H01L24/48 , H01L24/49 , H01L25/162 , H01L25/165 , H01L2224/0603 , H01L2224/48091 , H01L2224/48472 , H01L2224/4903 , H01L2224/49051 , H01L2224/49111 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/01074 , H01L2924/014 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/19041 , H01L2924/19043 , H01L2924/30105 , H01L2924/30107 , H02M7/003 , H05K7/1432 , Y02T10/645 , Y02T10/7005 , H01L2924/00 , H01L2224/45099 , H01L2224/05599
摘要： A positive side conductor and a negative side conductor of an input terminal electrically connected to semiconductor elements, are electrically insulated from each other, and are laminated with each other, and the input terminal having such a laminated structure, an output terminal and substrates mounted thereon the semiconductor elements are arranged in a checkered pattern in a container. Further, the semiconductor elements mounted on the substrates, the input terminal and the output terminal are electrically connected to one another so as to obtain a loop-like electric path on a conductive member, thereby it is possible to aim at miniaturizing the power conversion apparatus and lowering the inductance thereof.
摘要翻译： 与半导体元件电连接的输入端子的正侧导体和负极导体彼此电绝缘，并且彼此层叠，并且具有这种层叠结构的输入端子，安装在其上的输出端子和基板 半导体元件以容器中的方格布置。 此外，安装在基板，输入端子和输出端子上的半导体元件彼此电连接，以便在导电构件上获得环状电路，从而可以将电力转换装置 并降低其电感。
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公开(公告)号：US06618278B2
公开(公告)日：2003-09-09
申请号：US09810259
申请日：2001-03-19
申请人： Osamu Suzuki , Shinji Shirakawa , Akira Mishima , Toshiyuki Innami , Shinichi Fujino , Hideaki Mori , Kenji Takahashi , Keiichi Mashino , Hiromichi Anan
发明人： Osamu Suzuki , Shinji Shirakawa , Akira Mishima , Toshiyuki Innami , Shinichi Fujino , Hideaki Mori , Kenji Takahashi , Keiichi Mashino , Hiromichi Anan
IPC分类号： H01L2340
CPC分类号： H02M7/003 , H01L2224/32245 , H01L2224/33181 , H01L2924/13055 , H01L2924/13091 , H01L2924/00
摘要： In an electric power conversion/inversion apparatus, including, such as an inverter therein, for obtaining reduction in circuit inductance and wiring resistance therein by bringing small as a whole, having good installability and high reliability and efficiency of electric power conversion, as well, semiconductor chips 1 are disposed, being put between a positive input bus bar 14p and a negative input bus bar 14n and plural output bus bars 18 at crossing positions thereof, and are connected electrically and thermally, to the positive input bus bar 14p in a pole direction consistent therewith while to the negative input bus bar 14n in a pole direction consistent therewith, and further to the common output bus bars 18 in pole directions being different from side by side.
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公开(公告)号：US06548933B2
公开(公告)日：2003-04-15
申请号：US09774093
申请日：2001-01-31
申请人： Takashi Yasuhara , Suetarou Shibukawa , Osamu Koizumi , Hiromichi Anan , Syuichi Hara , Toshiaki Ueda , Yasuhiko Kimura , Takefumi Oowada , Hidemitsu Kobayashi , Hisashi Kondo
发明人： Takashi Yasuhara , Suetarou Shibukawa , Osamu Koizumi , Hiromichi Anan , Syuichi Hara , Toshiaki Ueda , Yasuhiko Kimura , Takefumi Oowada , Hidemitsu Kobayashi , Hisashi Kondo
IPC分类号： H02K300
CPC分类号： H02K3/12 , H02K3/505 , H02K2203/09
摘要： A linear shape straight angle line is transformed to form U-shape configuration in advance and by sandwiching a stator tooth portion to adjacent slots linear shape two sides are inserted and using a thin plate rod shape chip between both ends of U-shape side of the above stated coil is connected and then the coil is formed to have one winding close circuit. The plural coils are inserted and as stated in above between the both ends of an anti-U-shape side is connected, and a stator coil for forming a predetermined winding turn number is obtained. When an end face of the anti-U-shape side and the thin plate shape chip are overlapped and connected, a plate thickness of a portion in which they are overlapped is reduced by half respectively, and when they are overlapped, it becomes the plate thickness which corresponds to a plate thickness of the above stated straight angle line coil. A length of a coil end portion can be shortened widely.
摘要翻译： 直线形直角线被预先转换成U形构造，并且通过将定子齿部分夹在相邻的狭槽上而形成直线形两端插入，并且在U形侧的两端之间使用薄板棒形芯片 上述线圈连接，然后线圈形成为具有一个绕组闭合电路。 插入多个线圈，如上所述，在防U形侧的两端之间连接，并且获得用于形成预定的绕组匝数的定子线圈。 当反U型侧和薄板形芯片的端面重叠连接时，它们重叠的部分的板厚分别减半，当它们重叠时，它成为板 对应于上述直线线圈的板厚度的厚度。 线圈端部的长度可以被广泛地缩短。
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