摘要:
A service platform utilizing an electronic paper device for financial institutions, comprising: an option input device, used for sensing an entry operation and outputting a financial business option signal accordingly; a control unit, having an option input interface, a display interface, a host interface, and a slips storage unit, wherein the option input interface is used to receive the financial business option signal, the host interface is used to communicate with a financial institution host, the slips storage unit is used to store financial business slips; and an electronic paper device, having a touch input function, coupled to the display interface to display one financial business slip for related information input by a touch pen, or transmit the related information through the control unit to the financial institution host, or display an informing message sent from the financial institution host through the control unit.
摘要:
A pixel driving circuit, a pixel driving method and a light emitting display device are provided in the present invention. The pixel driving circuit includes first through fifth transistors and a capacitor and is for driving a light emitting diode. The third transistor forms a diode connection to make information of the threshold voltages of both the third transistor and the light emitting diode be stored in the capacitor in a data writing period. In a light emitting period, the second transistor compensates drift variation of the threshold voltages of the third transistor and the light emitting diode according to the information stored in the capacitor to provide a stable driving current for driving the light emitting diode.
摘要:
The signal line structure is disposed between a gate driver and a display area of a display. The signal line structure includes a substrate, first metal layers, a first insulation layer, second metal layers, a second insulation layer and third metal layers. The first metal layers are arranged in parallel and toward a first direction in the substrate. The first insulation layer is disposed in the substrate and covers the first metal layers. The second metal layers are disposed on the positions of the first insulation layer corresponding to the first metal layers. The second insulation layer is disposed on the second metal layers and the first insulation layer. The third metal layers are disposed on the positions corresponding to the second metal layers in the second insulation layer. The distance between two adjacent second metal layers is less than that between two adjacent first metal layers.
摘要:
Disclosed herein is a method for patterning a metal layer, which includes the following steps. A substrate having a metal layer thereon is provided. A patterned conductive polymeric layer is formed on the metal layer, wherein a portion of the metal layer is exposed by the patterned conductive polymeric layer. The substrate having the patterned conductive polymer layer is disposed in an electrolytic cell, so that the exposed portion of the metal layer is immersed in the electrolytic solution of the electrolytic cell. The anode of the electrolytic cell is electrically coupled to the patterned conductive polymeric layer, while the cathode of the electrolytic cell is immersed in the electrolytic solution. Sequentially, an electrical potential is applied across the anode and the cathode to perform an electrolysis reaction so that the exposed portion of the metal layer is dissolved in the electrolytic solution.
摘要:
An electronic paper structure is disclosed, which includes a hard substrate, a flexible substrate, at least one magnetic device for fastening the flexible substrate on the hard substrate temporally, a drive substrate formed on the flexible substrate, an electronic paper display layer formed on the drive substrate, and a protect layer formed on the electronic paper display layer. An electronic paper fabricating method using the same is also disclosed.
摘要:
A transistor structure comprises a patterned N-type transparent oxide semiconductor formed over a substrate as a base, and a patterned p-type organic polymer semiconductor formed on the patterned N-type transparent oxide semiconductor comprising a first portion and a second portion so that the patterned N-type transparent oxide semiconductor and the first portion and the second portion of the patterned p-type organic polymer semiconductor form heterojunctions therebetween respectively, wherein the first portion of the patterned p-type organic polymer semiconductor is used as an emitter, and the second portion of the patterned p-type organic polymer semiconductor is used as a collector.
摘要:
A wire stretching device for applying a drag force onto a wire wound around an object is provided. The wire stretching device comprises a primary platform, a first sub-platform, a second sub-platform and a driving device. The primary platform comprises a plate, a fixed stick and a track, wherein the fixed stick and the track are disposed on a surface of the plate, and the fixed stick has a first fixing device for fixing a first end of the wire. The object is fixed on a first stage of the first sub-platform, and a second fixing device is disposed on a second stage of the second sub-platform for fixing the second end of the wire. The second sub-platform is moved by the driving device for adjusting the tension of the wire. The first sub-platform is passively moved along the track corresponding to the tension of the wire.
摘要:
A touch-sensitive display panel including a first substrate, a second substrate, a display layer and at least one touch-sensitive device is provided. The second substrate is disposed opposite to the first substrate. The display layer is disposed between the first substrate and the second substrate. The touch-sensitive device is disposed between the first substrate and the second substrate and located beside the display layer. The displaying brightness of the touch-sensitive display panel is not adversely affected by the touch-sensitive device. In addition, the thickness of the touch-sensitive display panel is relative small.
摘要:
A semiconductor structure includes a through-substrate-via (TSV) structure disposed in a substrate. A first etch stop layer is disposed over the TSV structure. A first dielectric layer is disposed in contact with the first etch stop layer. A first conductive structure is disposed through the first etch stop layer and the first dielectric layer. The first conductive structure is electrically coupled with the TSV structure. The TSV structure is substantially wider than the first conductive structure. A second etch stop layer is disposed in contact with the first dielectric layer. A metal-insulator-metal (MIM) capacitor structure is disposed in contact with the second etch stop layer.
摘要:
An integrated circuit includes a substrate and a first metal-insulator-metal (MIM) capacitor disposed over the substrate. The MIM capacitor includes a first metallic capacitor plate disposed over the substrate. At least one first insulator layer is disposed over the first metallic capacitor plate. A second metallic capacitor plate is disposed over the at least one first insulator layer. At least one first dielectric layer is disposed over the substrate. At least a portion of the at least one first dielectric layer is disposed between the first metallic capacitor plate and the at least one first insulator layer.