摘要:
A deposition mask includes a mask main body and a coating layer. The mask main body includes a plurality of slits penetrating the mask main body. The coating layer is coated on an entire surface of the mask main body. The coating layer is made of a material different from a material of the main body, and it has a magnetic force stronger than that of the main body. Each of the slits has an open area, and a thickness of the coating layer controls a width of the open area. A photolithography process is used to form the plurality of slits.
摘要:
A vapor deposition apparatus in which a deposition process is performed by moving a substrate, the vapor deposition apparatus including a supply unit that injects at least one raw material gas towards the substrate, and a blocking gas flow generation unit that is disposed corresponding to the supply unit and generates a gas-flow that blocks a flow of the raw material gas.
摘要:
A vapor deposition apparatus for depositing a thin film on a substrate includes a cover having an accommodation portion and a communicated portion, which communicated portion is connected to the accommodation portion and faces a direction of the substrate, and includes a body in the accommodation portion, which body includes a first portion and a second portion. The first portion is disposed at a first location of the body and connected to a first injection portion for injecting a first material onto the substrate, the second portion is disposed at a second location of the body and connected to a second injection portion for injecting a second material onto the substrate, and the body rotates in at least one direction so that the first portion and the second portion are alternately connected to each other with respect to the communicated portion.
摘要:
A vapor deposition apparatus includes at least one first region and at least one second region. A first blocking unit is arranged between a first exhausting unit and a first injecting unit and between the first exhausting unit and a first purging unit in the first region so as to avoid any common region between the first exhausting unit and the first injecting unit and to avoid any common region between the first exhausting unit and the first purging unit. The vapor deposition apparatus also includes another first blocking unit arranged between a second exhausting unit and a second injecting unit and between the second exhausting unit and a second purging unit in the second region so as to avoid any common region between the second exhausting unit and the second injecting unit and to avoid any common region between the second exhausting unit and the second purging unit.