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公开(公告)号：US08587114B2
公开(公告)日：2013-11-19
申请号：US12897933
申请日：2010-10-05
IPC分类号： H01L23/12
CPC分类号： H01L21/50 , H01L23/04 , H01L23/10 , H01L23/433 , H01L23/4338 , H01L2924/0002 , H01L2924/00
摘要： A multi-chip electronic package and methods of manufacture are provided. The multi-chip package includes a plurality of chips mounted on a chip carrier. The multi-chip package further includes a lid mounted on the chip carrier using a bonding material or compression seal, and at least one single piston extending from the lid. Each piston covers an entirety of multiple chips of the plurality of chips.
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公开(公告)号：US08445331B2
公开(公告)日：2013-05-21
申请号：US13433468
申请日：2012-03-29
IPC分类号： H01L21/44
CPC分类号： H01L21/50 , H01L23/04 , H01L23/10 , H01L23/433 , H01L23/4338 , H01L2924/0002 , H01L2924/00
摘要： A multi-chip electronic package and methods of manufacture are provided. The multi-chip package includes a plurality of chips mounted on a chip carrier. The multi-chip package further includes a lid mounted on the chip carrier using a bonding material or compression seal, and at least one single piston extending from the lid. Each piston covers an entirety of multiple chips of the plurality of chips.
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公开(公告)号：US20120080784A1
公开(公告)日：2012-04-05
申请号：US12897933
申请日：2010-10-05
CPC分类号： H01L21/50 , H01L23/04 , H01L23/10 , H01L23/433 , H01L23/4338 , H01L2924/0002 , H01L2924/00
摘要： A multi-chip electronic package and methods of manufacture are provided. The multi-chip package includes a plurality of chips mounted on a chip carrier. The multi-chip package further includes a lid mounted on the chip carrier using a bonding material or compression seal, and at least one single piston extending from the lid. Each piston covers an entirety of multiple chips of the plurality of chips.
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公开(公告)号：US20120326294A1
公开(公告)日：2012-12-27
申请号：US13169394
申请日：2011-06-27
CPC分类号： H01L23/04 , H01L21/50 , H01L23/10 , H01L23/562 , H01L24/32 , H01L24/83 , H01L2224/32245 , H01L2224/83191 , H01L2924/01322 , H01L2924/16251 , H01L2924/164 , H01L2924/166 , H01L2924/00
摘要： A multi-chip electronic package and methods of manufacture are provided. The method comprises adjusting a piston position of one or more pistons with respect to one or more chips on a chip carrier. The adjusting comprises placing a chip shim on the chips and placing a seal shim between a lid and the chip carrier. The seal shim is thicker than the chip shim. The adjusting further comprise lowering the lid until the pistons contact the chip shim. The method further comprises separating the lid and the chip carrier and removing the chip shim and the seal shim. The method further comprises dispensing thermal interface material on the chips and lowering the lid until a gap filled with the thermal interface material is about a particle size of the thermal interface material. The method further comprises sealing the lid to the chip carrier with sealant.
摘要翻译： 提供了一种多芯片电子封装及其制造方法。 该方法包括相对于芯片载体上的一个或多个芯片来调节一个或多个活塞的活塞位置。 该调整包括将芯片垫片放置在芯片上并将密封垫片放置在盖子和芯片载体之间。 密封垫片比芯片垫片厚。 调节还包括降低盖直到活塞接触芯片垫片。 该方法还包括分离盖子和芯片载体并移除芯片垫片和密封垫片。 该方法还包括将热界面材料分配在芯片上并降低盖子，直到填充有热界面材料的间隙大约为热界面材料的粒度。 该方法还包括用密封剂将盖子密封到芯片载体上。
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公开(公告)号：US08906809B2
公开(公告)日：2014-12-09
申请号：US13491174
申请日：2012-06-07
IPC分类号： H01L21/302 , H01L21/461 , H01L23/42 , H01L23/10 , H01L23/433
CPC分类号： H01L23/4338 , H01L23/10 , H01L23/42 , H01L2924/0002 , Y10T29/49826 , H01L2924/00
摘要： A multi-chip electronic package and methods of manufacture are provided. The structure includes a lid encapsulating at least one chip mounted on a chip carrier; at least one seal shim fixed between the lid and the chip carrier, the at least one seal shim forming a gap between pistons of the lid and respective ones of the chips; and thermal interface material within the gap and contacting the pistons of the lid and respective ones of the chips.
摘要翻译： 提供了一种多芯片电子封装及其制造方法。 该结构包括封装安装在芯片载体上的至少一个芯片的盖子; 固定在所述盖和所述芯片载体之间的至少一个密封垫片，所述至少一个密封垫片在所述盖子的活塞和所述芯片的相应的芯片之间形成间隙; 和间隙内的热界面材料，并与盖子的活塞和各个芯片接触。
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公开(公告)号：US08900927B2
公开(公告)日：2014-12-02
申请号：US12856699
申请日：2010-08-16
CPC分类号： H01L23/4338 , H01L23/10 , H01L23/42 , H01L2924/0002 , Y10T29/49826 , H01L2924/00
摘要： A multi-chip electronic package and methods of manufacture are provided. The method includes contacting pistons of a lid with respective ones of chips on a chip carrier. The method further includes separating the lid and the chip carrier and placing at least one seal shim on one of the lid and chip carrier. The at least one seal shim has a thickness that results in a gap between the pistons with the respective ones of the chips on the chip carrier. The method further includes dispensing thermal interface material within the gap and in contact with the chips. The method further includes sealing the lid to the chip carrier with the at least one seal shim between the lid and the chip carrier.
摘要翻译： 提供了一种多芯片电子封装及其制造方法。 该方法包括将盖的活塞与芯片载体上的各个芯片接触。 该方法还包括分离盖子和芯片载体并将至少一个密封垫片放置在盖子和芯片载体之一上。 至少一个密封垫片具有导致活塞与芯片载体上的相应芯片之间的间隙的厚度。 该方法还包括在间隙内分配热界面材料并与芯片接触。 该方法还包括将盖子密封到芯片载体上，其中至少一个密封垫片位于盖子和芯片载体之间。
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公开(公告)号：US08592970B2
公开(公告)日：2013-11-26
申请号：US13169394
申请日：2011-06-27
IPC分类号： H01L23/12
CPC分类号： H01L23/04 , H01L21/50 , H01L23/10 , H01L23/562 , H01L24/32 , H01L24/83 , H01L2224/32245 , H01L2224/83191 , H01L2924/01322 , H01L2924/16251 , H01L2924/164 , H01L2924/166 , H01L2924/00
摘要： A multi-chip electronic package and methods of manufacture are provided. The method comprises adjusting a piston position of one or more pistons with respect to one or more chips on a chip carrier. The adjusting comprises placing a chip shim on the chips and placing a seal shim between a lid and the chip carrier. The seal shim is thicker than the chip shim. The adjusting further comprise lowering the lid until the pistons contact the chip shim. The method further comprises separating the lid and the chip carrier and removing the chip shim and the seal shim. The method further comprises dispensing thermal interface material on the chips and lowering the lid until a gap filled with the thermal interface material is about a particle size of the thermal interface material. The method further comprises sealing the lid to the chip carrier with sealant.
摘要翻译： 提供了一种多芯片电子封装及其制造方法。 该方法包括相对于芯片载体上的一个或多个芯片来调节一个或多个活塞的活塞位置。 该调整包括将芯片垫片放置在芯片上并将密封垫片放置在盖子和芯片载体之间。 密封垫片比芯片垫片厚。 调节还包括降低盖直到活塞接触芯片垫片。 该方法还包括分离盖子和芯片载体并移除芯片垫片和密封垫片。 该方法还包括将热界面材料分配在芯片上并降低盖子，直到填充有热界面材料的间隙大约为热界面材料的粒度。 该方法还包括用密封剂将盖子密封到芯片载体上。
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公开(公告)号：US08037594B2
公开(公告)日：2011-10-18
申请号：US12116655
申请日：2008-05-07
申请人： Jeffrey T. Coffin , Michael A. Gaynes , David L. Questad , Kamal K. Sikka , Hilton T. Toy , Jamil A. Wakil
发明人： Jeffrey T. Coffin , Michael A. Gaynes , David L. Questad , Kamal K. Sikka , Hilton T. Toy , Jamil A. Wakil
IPC分类号： H05B3/00
CPC分类号： H01L23/34 , H01L23/3735 , H01L23/42 , H01L2224/73204 , H01L2224/73253 , H01L2924/3511 , Y10T29/49004 , Y10T29/49083 , Y10T29/49117 , Y10T29/49124 , Y10T29/4913 , Y10T29/49135 , Y10T29/4935
摘要： Disclosed are thermally conductive plates. Each plate is configured such that a uniform adhesive-filled gap may be achieved between the plate and a heat generating structure when the plate is bonded to the heat generating structure and subjected to a temperature within a predetermined temperature range that causes the heat generating structure to warp. Additionally, this disclosure presents the associated methods of forming the plates and of bonding the plates to a heat generating structure. In one embodiment the plate is curved and modeled to match the curved surface of a heat generating structure within the predetermined temperature range. In another embodiment the plate is a multi-layer conductive structure that is configured to undergo the same warpage under a thermal load as the heat generating structure. Thus, when the plate is bonded with the heat generating structure it is able to achieve and maintain a uniform adhesive-filled gap at any temperature.
摘要翻译： 披露的是导热板。 每个板被构造成使得当板结合到发热结构并经受使得发热结构的预定温度范围内的温度时，板和发热结构之间可以实现均匀的粘合剂填充的间隙 经。 另外，本公开提供了形成板并将板结合到发热结构的相关方法。 在一个实施例中，板是弯曲的并被建模以使发热结构的弯曲表面在预定温度范围内匹配。 在另一个实施例中，板是多层导电结构，其被配置为在与热产生结构相关的热负荷下经历相同的翘曲。 因此，当板与发热结构接合时，能够在任何温度下实现和保持均匀的粘合剂填充间隙。
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公开(公告)号：US07516776B2
公开(公告)日：2009-04-14
申请号：US10908622
申请日：2005-05-19
IPC分类号： H05K7/20
CPC分类号： H01L23/4735 , H01L2924/0002 , H01L2924/09701 , Y10S165/908 , H01L2924/00
摘要： Low-pressure drop thermal assemblies, systems and methods of making low-pressure drop thermal assemblies for use in high power flux situations. A manifold body is attached to a distributor to form a subassembly. This subassembly is in communication with a substrate surface, which has a semiconductor device in need of thermal management thereon. An enclosed cavity is formed between the target substrate surface and the subassembly, and a seal of the cavity protects critical components residing on the active surface of the semiconductor device. The distributor includes a distributed liquid impingement microjet inlet array isolated from and parallel with a distributed microjet drain array for impinging cooling fluid and removing spent heated fluid in a direction orthogonal to a target surface for maximizing the heat transfer rate, and thereby providing high cooling flux capabilities while enabling low-pressure drops.
摘要翻译： 低压降热组件，制造用于高功率通量情况的低压降热组件的系统和方法。 歧管主体连接到分配器以形成子组件。 该子组件与衬底表面连通，衬底表面具有需要对其进行热管理的半导体器件。 在目标衬底表面和子组件之间形成封闭空腔，并且空腔的密封件保护驻留在半导体器件的有源表面上的关键部件。 分配器包括与分布式微喷射排放阵列隔离并平行的分布式液体冲击微喷射入口阵列，用于冲击冷却流体并在与目标表面正交的方向上去除用过的热的流体，以最大化传热速率，从而提供高冷却通量 同时实现低压降。
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公开(公告)号：US20090095444A1
公开(公告)日：2009-04-16
申请号：US12338092
申请日：2008-12-18
IPC分类号： F28F7/00
CPC分类号： H01L23/4735 , H01L2924/0002 , H01L2924/09701 , Y10S165/908 , H01L2924/00
摘要： Low-pressure drop thermal assemblies, systems and methods of making low-pressure drop thermal assemblies for use in high power flux situations. A manifold body is attached to a distributor to form a subassembly. This subassembly is in communication with a substrate surface, which has a semiconductor device in need of thermal management thereon. An enclosed cavity is formed between the target substrate surface and the subassembly, and a seal of the cavity protects critical components residing on the active surface of the semiconductor device. The distributor includes a distributed liquid impingement microjet inlet array isolated from and parallel with a distributed microjet drain array for impinging cooling fluid and removing spent heated fluid in a direction orthogonal to a target surface for maximizing the heat transfer rate, and thereby providing high cooling flux capabilities while enabling low-pressure drops.
摘要翻译： 低压降热组件，制造用于高功率通量情况的低压降热组件的系统和方法。 歧管主体连接到分配器以形成子组件。 该子组件与衬底表面连通，衬底表面具有需要对其进行热管理的半导体器件。 在目标衬底表面和子组件之间形成封闭空腔，并且空腔的密封件保护驻留在半导体器件的有源表面上的关键部件。 分配器包括与分布式微喷射排放阵列隔离并平行的分布式液体冲击微喷射入口阵列，用于冲击冷却流体，并在垂直于目标表面的方向上去除废热流体，以最大化传热速率，从而提供高冷却通量 同时实现低压降。
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