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公开(公告)号：US20240363609A1
公开(公告)日：2024-10-31
申请号：US18767970
申请日：2024-07-09
发明人： Feng-Wei Kuo , Chewn-Pu Jou
IPC分类号： H01L25/16 , H01L23/00 , H01L31/02 , H01L31/0232 , H01L31/18
CPC分类号： H01L25/167 , H01L24/08 , H01L24/80 , H01L31/02005 , H01L31/02327 , H01L31/1804 , H01L31/1892 , H01L2224/08146 , H01L2224/80001 , H01L2924/12043
摘要： A method of fabricating a package structure includes forming a photonic die, an electronic die and a gap filling layer. The photonic die includes a dielectric layer, a silicon layer, a reflector structure and connection pads. The silicon layer is disposed on the dielectric layer, wherein the silicon layer includes a grating coupler having a plurality of first trench patterns with a first depth and a plurality of second trench patterns with a second depth, wherein the first depth is different than the second depth. The reflector structure is embedded in the dielectric layer below the grating coupler. The connection pads are disposed over the dielectric layer. The electronic die is disposed on the photonic die, wherein the electronic die includes bonding pads bonded to the connection pads of the photonic die. The gap filling layer is disposed on the photonic die and surrounding the electronic die.
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公开(公告)号：US20240266296A1
公开(公告)日：2024-08-08
申请号：US18440297
申请日：2024-02-13
发明人： Feng Wei Kuo , Chewn-Pu Jou , Shuo-Mao Chen
IPC分类号： H01L23/538 , G02B6/42 , H01L21/48 , H01L21/56 , H01L21/683 , H01L23/00 , H01L23/31 , H01L23/498 , H01L25/00 , H01L25/18
CPC分类号： H01L23/5386 , G02B6/4202 , G02B6/4251 , G02B6/428 , H01L21/4857 , H01L21/486 , H01L21/565 , H01L21/568 , H01L21/6835 , H01L23/3128 , H01L23/49816 , H01L23/5384 , H01L23/5385 , H01L23/5389 , H01L24/16 , H01L24/19 , H01L24/24 , H01L24/73 , H01L25/18 , H01L25/50 , H01L2221/68359 , H01L2221/68372 , H01L2224/16146 , H01L2224/24137 , H01L2224/73259 , H01L2924/1431 , H01L2924/1434
摘要： An integrated circuit package integrates a photonic die (oDie) and an electronic die (eDie). More specifically, the integrated circuit package may include a plurality of redistribution layers communicatively coupled to at least one of the oDie and/or the eDie, where molded material at least partially surrounds the at least one of the oDie and/or the eDie.
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公开(公告)号：US12007611B2
公开(公告)日：2024-06-11
申请号：US17896089
申请日：2022-08-26
发明人： Feng-Wei Kuo , Chewn-Pu Jou , Hsing-Kuo Hsia , Chih-Wei Tseng
CPC分类号： G02B6/4215 , G02B6/29328 , G02B6/4206 , G02B6/4274
摘要： A package structure comprises photonic dies and an interposer structure. Each photonic die includes a dielectric layer and a first grating coupler embedded in the dielectric layer. The interposer structure is disposed below the photonic dies. The interposer structure includes an oxide layer and a second grating coupler embedded in the oxide layer. The photonic dies are optically coupled through the first grating couplers of the photonic dies and the second grating coupler of the interposer structure.
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公开(公告)号：US11953720B2
公开(公告)日：2024-04-09
申请号：US17674646
申请日：2022-02-17
发明人： Lan-Chou Cho , Chewn-Pu Jou , Cheng-Tse Tang , Stefan Rusu
CPC分类号： G02B6/12004 , G02F1/025 , G02B2006/12142
摘要： The present disclosure provides a semiconductor device, a photonic circuit, and a method for adjusting a resonant wavelength of an optical modulator. The semiconductor device includes a substrate, a first waveguide disposed on the substrate, and a second waveguide disposed on the substrate and spaced apart from the first waveguide with a first distance. In addition, the second waveguide includes a first electrical coupling portion having a first type doping, a second electrical coupling portion having a second type doping, and an optical coupling portion disposed between the first electrical coupling portion and the second electrical coupling portion, wherein the second waveguide is configured to receive a first voltage through the first electrical coupling portion and the second electrical coupling portion to decrease a resonant wavelength of the second waveguide.
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公开(公告)号：US11714239B2
公开(公告)日：2023-08-01
申请号：US17874228
申请日：2022-07-26
发明人： Chan-Hong Chern , Chih-Chang Lin , Chewn-Pu Jou , Chih-Tsung Shih , Feng-Wei Kuo , Lan-Chou Cho , Min-Hsiang Hsu , Weiwei Song
CPC分类号： G02B6/305 , G02B6/124 , G02B6/30 , G02B6/29317
摘要： An optical device for coupling light propagating between a waveguide and an optical transmission component is provided. The optical device includes a taper portion and a grating portion. The taper portion is disposed between the grating portion and the waveguide. The grating portion includes rows of grating patterns. A first size of a first grating pattern in a first row of grating patterns is larger than a second size of a second grating pattern in a second row of grating patterns. A first distance between the first row of grating patterns and the waveguide is less than a second distance between the second row of grating patterns and the waveguide.
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公开(公告)号：US11640935B2
公开(公告)日：2023-05-02
申请号：US17377395
申请日：2021-07-16
发明人： Chung-Ming Weng , Chen-Hua Yu , Chung-Shi Liu , Hao-Yi Tsai , Cheng-Chieh Hsieh , Hung-Yi Kuo , Tsung-Yuan Yu , Hua-Kuei Lin , Hsiu-Jen Lin , Ming-Che Ho , Yu-Hsiang Hu , Chewn-Pu Jou , Cheng-Tse Tang
IPC分类号： H01L29/22 , H01L23/498 , H01L21/768 , G02B6/42 , H01L23/00
摘要： A semiconductor package includes a redistribution structure, a supporting layer, a semiconductor device, and a transition waveguide structure. The redistribution structure includes a plurality of connectors. The supporting layer is formed over the redistribution structure and disposed beside and between the plurality of connectors. The semiconductor device is disposed on the supporting layer and bonded to the plurality of connectors, wherein the semiconductor device includes a device waveguide. The transition waveguide structure is disposed on the supporting layer adjacent to the semiconductor device, wherein the transition waveguide structure is optically coupled to the device waveguide.
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公开(公告)号：US20230018511A1
公开(公告)日：2023-01-19
申请号：US17377395
申请日：2021-07-16
发明人： Chung-Ming Weng , Chen-Hua Yu , Chung-Shi Liu , Hao-Yi Tsai , Cheng-Chieh Hsieh , Hung-Yi Kuo , Tsung-Yuan Yu , Hua-Kuei Lin , Hsiu-Jen Lin , Ming-Che Ho , Yu-Hsiang Hu , Chewn-Pu Jou , Cheng-Tse Tang
IPC分类号： H01L23/498 , H01L23/00 , H01L21/768 , G02B6/42
摘要： A semiconductor package includes a redistribution structure, a supporting layer, a semiconductor device, and a transition waveguide structure. The redistribution structure includes a plurality of connectors. The supporting layer is formed over the redistribution structure and disposed beside and between the plurality of connectors. The semiconductor device is disposed on the supporting layer and bonded to the plurality of connectors, wherein the semiconductor device includes a device waveguide. The transition waveguide structure is disposed on the supporting layer adjacent to the semiconductor device, wherein the transition waveguide structure is optically coupled to the device waveguide.
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公开(公告)号：US20220365286A1
公开(公告)日：2022-11-17
申请号：US17319103
申请日：2021-05-13
发明人： Chung-Ming Weng , Chen-Hua Yu , Chung-Shi Liu , Hao-Yi Tsai , Cheng-Chieh Hsieh , Hung-Yi Kuo , Che-Hsiang Hsu , Chewn-Pu Jou , Feng-Wei Kuo , Min-Hsiang Hsu
摘要： A semiconductor device including a singulated structure and an optical fiber assembly is provided. The singulated structure includes a photonic die, an electronic die connected to the photonic die and an optical element over the photonic die. The optical fiber assembly is disposed on a top of the singulated structure and includes a holder and an optical fiber structure. The holder keeps an air gap from the optical element. The optical fiber structure is carried by the holder and configured to be optically communicated with the photonic die through the optical element.
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公开(公告)号：US11448828B2
公开(公告)日：2022-09-20
申请号：US17180864
申请日：2021-02-22
发明人： Chan-Hong Chern , Chih-Chang Lin , Chewn-Pu Jou , Chih-Tsung Shih , Feng-Wei Kuo , Lan-Chou Cho , Min-Hsiang Hsu , Weiwei Song
摘要： An optical device for coupling light propagating between a waveguide and an optical transmission component is provided. The optical device includes a taper portion and a grating portion. The taper portion is disposed between the grating portion and the waveguide. The grating portion includes rows of grating patterns. A first size of a first grating pattern in a first row of grating patterns is larger than a second size of a second grating pattern in a second row of grating patterns. A first distance between the first row of grating patterns and the waveguide is less than a second distance between the second row of grating patterns and the waveguide.
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公开(公告)号：US20220137440A1
公开(公告)日：2022-05-05
申请号：US17577412
申请日：2022-01-18
发明人： Lan-Chou Cho , Chewn-Pu Jou , Feng-Wei Kuo , Huan-Neng Chen , Min-Hsiang Hsu
IPC分类号： G02F1/025
摘要： An optical modulator includes a dielectric layer and a waveguide. The waveguide is disposed on the dielectric layer. The waveguide includes an electrical coupling portion, a slab portion, and an optical coupling portion. The slab portion is directly in contact with both of the electrical coupling portion and the optical coupling portion. The slab portion has a first sub-portion and a second sub-portion connected to the first sub-portion. A top surface of the electrical coupling portion, a top surface of the first sub-portion, and a top surface of the second sub-portion are located at different level heights.
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