PRESSURE-SENSITIVE ADHESIVE
    2.
    发明申请
    PRESSURE-SENSITIVE ADHESIVE 审中-公开
    压敏粘合剂

    公开(公告)号:US20150037559A1

    公开(公告)日:2015-02-05

    申请号:US14445151

    申请日:2014-07-29

    Applicant: tesa SE

    Abstract: Pressure-sensitive adhesive having high bond strengths to polar substrates as well as to non-polar substrates, comprising: a) 30-65 wt %, based on the total weight of the adhesive, of at least one poly(meth)acrylate; b) 5-20 wt %, based on the total weight of the adhesive, of at least one synthetic rubber; c) at least one tackifier compatible with the poly(meth)acrylate(s); and d) at least one hydrocarbon resin compatible with the synthetic rubber(s), and adhesive tape comprising at least one layer of the pressure-sensitive adhesive.

    Abstract translation: 包括:a)至少一种聚(甲基)丙烯酸酯,基于粘合剂的总重量的30-65重量%;和至少一种聚(甲基)丙烯酸酯; b)5-20重量%,基于粘合剂的总重量,至少一种合成橡胶; c)至少一种与聚(甲基)丙烯酸酯相容的增粘剂; 和d)至少一种与合成橡胶相容的烃树脂,以及包含至少一层压敏粘合剂的粘合带。

    REMOVABLE PRESSURE-SENSITIVE ADHESIVE STRIP
    4.
    发明申请

    公开(公告)号:US20190390087A1

    公开(公告)日:2019-12-26

    申请号:US16551109

    申请日:2019-08-26

    Applicant: tesa SE

    Abstract: Pressure-sensitive adhesive (PSA) strips, configured or adapted for the residue-free and non-destructive removal by which by substantially expanding it in the plane of adhesion, are provided. The PSA strips comprise at least one adhesive compound layer consisting of a PSA compound, constituted by vinyl aromatic block copolymers and one or more adhesive resins, at least 75 wt.-% (relative to the total amount of resin) of a resin being selected that has a DACP (diacetone alcohol cloud point) of greater than −20° C., and a softening point (ring & ball) of greater than or equal to 70° C., and the PSA compound has being foamed.

    WEB-SHAPED ADHESIVE COMPOUND CONTAINING A POLYURETHANE- AND/OR SILICONE-BASED FILLER

    公开(公告)号:US20250092287A1

    公开(公告)日:2025-03-20

    申请号:US18292249

    申请日:2022-07-22

    Applicant: TESA SE

    Abstract: The present invention relates to a web-shaped adhesive compound which contains at least one poly(meth)acrylate and optionally at least one synthetic rubber; and at least one polyurethane- and/or silicone-based filler. The invention also relates to a process for preparing such an adhesive compound and to the use thereof. The invention further relates to the use of polyurethane- and/or silicone-based fillers for increasing the adhesive power of adhesive compounds containing at least one poly(meth)acrylate and optionally at least one synthetic rubber and/or for increasing the shock performance of such adhesive compounds with respect to adhesive compounds which do not contain any polyurethane- and/or silicone-based filler.

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