Adhesive composition, adhesive film, and bonding method

    公开(公告)号:US10793756B2

    公开(公告)日:2020-10-06

    申请号:US16141696

    申请日:2018-09-25

    摘要: An adhesive composition contains (a) a resin consisting of (i) a block copolymer or (ii) 35% by weight or greater and less than 100% of the block copolymer and 65% by weight or less of a random copolymer, the block copolymer having a weight average molecular weight in a range of 50,000 to 150,000, wherein the block copolymer is a diblock copolymer, a triblock copolymer, or a combination thereof, and includes a styrene group, both terminals of a main chain of the triblock copolymer are styrene groups; (b) a solvent which includes a condensed polycyclic hydrocarbon, wherein an adhesive layer formed by using the adhesive composition has a Young's modulus of 0.1 GPa or greater at 23° C., a storage modulus (G′) of 1.5×105 Pa or less at 220° C., and a loss factor (tan σ) of 1.3 or less at 220° C.; and (c) a thermal polymerization inhibitor.

    NEGATIVE PHOTOSENSITIVE COMPOSITION AND PATTERN FORMATION METHOD

    公开(公告)号:US20240045330A1

    公开(公告)日:2024-02-08

    申请号:US18349825

    申请日:2023-07-10

    IPC分类号: G03F7/038 G03F7/031

    CPC分类号: G03F7/0385 G03F7/031

    摘要: A negative photosensitive composition including a novolak-type polyfunctional aromatic epoxy resin (Ap), a trifunctional epoxy monomer (Am), and a sulfonium salt represented by Formula (I0). A mass ratio of (Am)/(Ap) is 5/5 to 8/2. In Formula (I0), R1 and R2 represent an aryl group, a heterocyclic hydrocarbon group, or an alkyl group. R3 to R5 are an alkyl group, a hydroxy group, an alkoxy group, an alkylcarbonyl group, an arylcarbonyl group, an acyloxy group, an arylthio group, an alkylthio group, an aryl group, a heterocyclic hydrocarbon group, an aryloxy group, a hydroxy(poly)alkyleneoxy group, or a halogen atom; k is an integer of 0 to 4, m is an integer of 0 to 3, and n is an integer of 1 to 4; L is —S—, —O—, —SO—, —SO2—, or —CO— and X− represents a monovalent polyatomic anion