公开(公告)号：US10793756B2

公开(公告)日：2020-10-06

申请号：US16141696

申请日：2018-09-25

申请人： Tokyo Ohka Kogyo Co., Ltd.

发明人： Koki Tamura ,  Hirofumi Imai ,  Toshiyuki Ogata ,  Atsushi Kubo ,  Takahiro Yoshioka

IPC分类号： C09J153/00 ,  C09J7/38 ,  C09J7/20 ,  C09J5/00 ,  C09J153/02 ,  H01L21/683

摘要： An adhesive composition contains (a) a resin consisting of (i) a block copolymer or (ii) 35% by weight or greater and less than 100% of the block copolymer and 65% by weight or less of a random copolymer, the block copolymer having a weight average molecular weight in a range of 50,000 to 150,000, wherein the block copolymer is a diblock copolymer, a triblock copolymer, or a combination thereof, and includes a styrene group, both terminals of a main chain of the triblock copolymer are styrene groups; (b) a solvent which includes a condensed polycyclic hydrocarbon, wherein an adhesive layer formed by using the adhesive composition has a Young's modulus of 0.1 GPa or greater at 23° C., a storage modulus (G′) of 1.5×105 Pa or less at 220° C., and a loss factor (tan σ) of 1.3 or less at 220° C.; and (c) a thermal polymerization inhibitor.

公开(公告)号：US20190091979A1

公开(公告)日：2019-03-28

申请号：US16200215

申请日：2018-11-26

申请人： Tokyo Ohka Kogyo Co., Ltd.

发明人： Takahiro Yoshioka ,  Koki Tamura ,  Hirofumi Imai ,  Atsushi Kubo

IPC分类号： B32B27/28 ,  B32B27/06 ,  H01L21/02 ,  C09J181/06 ,  B32B37/12 ,  B32B27/00 ,  H01L21/683

摘要： A method of producing a laminate including a substrate and a light-transmitting support plate that are laminated each other via an adhesive layer and a release layer that is altered through absorption of light, the method including coating a reactive polysilsesquioxane on a surface of the support plate, the surface being opposed to the substrate, and heating the reactive polysilsesquioxane to perform polymerization, thereby forming the release layer.

公开(公告)号：US08809457B2

公开(公告)日：2014-08-19

申请号：US13628989

申请日：2012-09-27

申请人： Tokyo Ohka Kogyo Co., Ltd.

发明人： Hirofumi Imai ,  Koki Tamura ,  Atsushi Kubo ,  Takahiro Yoshioka

IPC分类号： C08L53/00 ,  C09B67/00 ,  C09J7/02 ,  C09J153/02

CPC分类号： C09J7/0221 ,  C09J7/20 ,  C09J7/387 ,  C09J153/02 ,  C09J153/025 ,  Y10T428/2852

摘要： An adhesive composition including a hydrocarbon resin, a modified elastomer that is bonded with at least one functional group-containing atom group, and a solvent.

摘要翻译： 一种粘合剂组合物，其包含烃树脂，与至少一个含官能团的原子基团键合的改性弹性体和溶剂。

公开(公告)号：US20140166209A1

公开(公告)日：2014-06-19

申请号：US14183988

申请日：2014-02-19

申请人： Tokyo Ohka Kogyo Co., Ltd.

发明人： Hirofumi Imai ,  Koki Tamura ,  Atsushi Kubo ,  Takahiro Yoshioka ,  Yasushi Fujii ,  Yoshihiro Inao

IPC分类号： B32B43/00

CPC分类号： B32B43/006 ,  B32B38/10 ,  B32B2310/0825 ,  B32B2457/14 ,  C08G77/14 ,  H01L21/6835 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/68381 ,  Y10T156/1158 ,  Y10T156/1195 ,  Y10T428/31663

摘要： A laminate including a supporter which transmits infrared; a substrate supported by the supporter; an adhesive layer via which the supporter and the substrate are attached to each other; and a separation layer positioned on a surface of the supporter to which surface the substrate is attached, and which is made of a compound having an infrared-absorbing structure. A target is tightly attached and supported in the laminate while securing easy separation of a supporter from the target.

摘要翻译： 包括透射红外线的支撑体的层压体; 由支撑体支撑的基板; 粘合层，支撑体和基板通过该粘合层彼此附接; 以及分离层，其位于所述支撑体的与所述基板的表面相连的表面上，并且由具有红外线吸收结构的化合物制成。 目标物紧密地附着并支撑在层压板中，同时确保支撑物与目标的容易分离。

公开(公告)号：US09944049B2

公开(公告)日：2018-04-17

申请号：US15139920

申请日：2016-04-27

申请人： Tokyo Ohka Kogyo Co., Ltd.

发明人： Takahiro Yoshioka ,  Koki Tamura ,  Hirofumi Imai ,  Atsushi Kubo

IPC分类号： B32B7/06 ,  B32B7/12 ,  C09J7/02 ,  C09D183/00 ,  H01L21/683 ,  B32B9/04 ,  C09D183/06 ,  C08L83/04 ,  B32B27/28 ,  C08L83/06

CPC分类号： B32B7/06 ,  B32B7/12 ,  B32B9/04 ,  B32B27/283 ,  B32B2250/02 ,  B32B2255/26 ,  B32B2307/542 ,  B32B2307/748 ,  B32B2457/14 ,  C08G77/28 ,  C08L83/04 ,  C08L83/06 ,  C09D183/00 ,  C09D183/06 ,  C09D183/08 ,  C09J7/40 ,  C09J7/401 ,  C09J2483/005 ,  H01L21/6835 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381

摘要： A laminate is formed by laminating a substrate and a support plate through an adhesive layer and a release layer. The release layer is formed by applying a composition containing a reactive polysilsesquioxane and a crosslinkable group-containing siloxane onto the surface of the support plate or the surface of the substrate and heating the composition to polymerize the reactive polysilsesquioxane and the crosslinkable group-containing siloxane.

公开(公告)号：US09607875B2

公开(公告)日：2017-03-28

申请号：US14691262

申请日：2015-04-20

申请人： Tokyo Ohka Kogyo Co., Ltd.

发明人： Takahiro Yoshioka ,  Koki Tamura ,  Hirofumi Imai ,  Atsushi Kubo ,  Yasumasa Iwata ,  Shingo Ishida

IPC分类号： C09J125/06 ,  C09J153/00 ,  B32B7/12 ,  B32B38/00 ,  H01L21/683 ,  C09J145/00 ,  B32B7/06 ,  B32B9/00 ,  B32B9/04 ,  B32B27/16 ,  B32B27/20 ,  B32B27/22 ,  B32B27/28 ,  B32B27/30 ,  C09J153/02

CPC分类号： H01L21/6836 ,  B32B7/06 ,  B32B7/12 ,  B32B9/005 ,  B32B9/045 ,  B32B27/16 ,  B32B27/20 ,  B32B27/22 ,  B32B27/281 ,  B32B27/283 ,  B32B27/302 ,  B32B27/308 ,  B32B38/10 ,  B32B2255/20 ,  B32B2307/306 ,  B32B2307/714 ,  B32B2310/08 ,  B32B2457/14 ,  C09J11/08 ,  C09J125/06 ,  C09J145/00 ,  C09J153/025 ,  H01L21/6835 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381

摘要： An adhesive composition for temporarily attaching a substrate to a support plate which supports the substrate, and includes a thermoplastic resin and a release agent.

公开(公告)号：US20150299534A1

公开(公告)日：2015-10-22

申请号：US14691262

申请日：2015-04-20

申请人： Tokyo Ohka Kogyo Co., Ltd.

发明人： Takahiro Yoshioka ,  Koki Tamura ,  Hirofumi Imai ,  Atsushi Kubo ,  Yasumasa Iwata ,  Shingo Ishida

IPC分类号： C09J153/00 ,  C09J145/00 ,  C09J125/14 ,  B32B38/00 ,  B32B7/06 ,  H01L21/683 ,  B32B43/00 ,  C09J125/06 ,  B32B7/12

CPC分类号： H01L21/6836 ,  B32B7/06 ,  B32B7/12 ,  B32B9/005 ,  B32B9/045 ,  B32B27/16 ,  B32B27/20 ,  B32B27/22 ,  B32B27/281 ,  B32B27/283 ,  B32B27/302 ,  B32B27/308 ,  B32B38/10 ,  B32B2255/20 ,  B32B2307/306 ,  B32B2307/714 ,  B32B2310/08 ,  B32B2457/14 ,  C09J11/08 ,  C09J125/06 ,  C09J145/00 ,  C09J153/025 ,  H01L21/6835 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381

摘要： An adhesive composition for temporarily attaching a substrate to a support plate which supports the substrate, and includes a thermoplastic resin and a release agent.

摘要翻译： 一种用于将基板临时附接到支撑基板的支撑板的粘合剂组合物，并且包括热塑性树脂和脱模剂。

公开(公告)号：US20130081760A1

公开(公告)日：2013-04-04

申请号：US13628989

申请日：2012-09-27

申请人： TOKYO OHKA KOGYO CO., LTD.

发明人： Hirofumi Imai ,  Koki Tamura ,  Atsushi Kubo ,  Takahiro Yoshioka

IPC分类号： C09J153/02 ,  B32B37/12 ,  B32B37/06 ,  C09J7/02

CPC分类号： C09J7/0221 ,  C09J7/20 ,  C09J7/387 ,  C09J153/02 ,  C09J153/025 ,  Y10T428/2852

摘要： An adhesive composition including a hydrocarbon resin, a modified elastomer that is bonded with at least one functional group-containing atom group, and a solvent.

摘要翻译： 一种粘合剂组合物，其包含烃树脂，与至少一个含官能团的原子基团键合的改性弹性体和溶剂。

公开(公告)号：US20190023953A1

公开(公告)日：2019-01-24

申请号：US16141696

申请日：2018-09-25

申请人： Tokyo Ohka Kogyo Co., Ltd.

发明人： Koki Tamura ,  Hirofumi Imai ,  Toshiyuki Ogata ,  Atsushi Kubo ,  Takahiro Yoshioka

IPC分类号： C09J153/00 ,  C09J7/38 ,  C09J7/20 ,  C09J5/00 ,  H01L21/683 ,  C09J153/02

CPC分类号： C09J153/00 ,  C09J5/00 ,  C09J7/20 ,  C09J7/387 ,  C09J153/025 ,  C09J2203/326 ,  C09J2453/00 ,  H01L21/6835 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381 ,  Y10T428/2883

摘要： An adhesive composition contains (a) a resin consisting of (i) a block copolymer or (ii) 35% by weight or greater and less than 100% of the block copolymer and 65% by weight or less of a random copolymer, the block copolymer having a weight average molecular weight in a range of 50,000 to 150,000, wherein the block copolymer is a diblock copolymer, a triblock copolymer, or a combination thereof, and includes a styrene group, both terminals of a main chain of the triblock copolymer are styrene groups; (b) a solvent which includes a condensed polycyclic hydrocarbon, wherein an adhesive layer formed by using the adhesive composition has a Young's modulus of 0.1 GPa or greater at 23° C., a storage modulus (G′) of 1.5×105 Pa or less at 220° C., and a loss factor (tan σ) of 1.3 or less at 220° C.; and (c) a thermal polymerization inhibitor.

公开(公告)号：US09881829B2

公开(公告)日：2018-01-30

申请号：US15425706

申请日：2017-02-06

申请人： Tokyo Ohka Kogyo Co., Ltd.

发明人： Takahiro Yoshioka ,  Koki Tamura ,  Hirofumi Imai ,  Atsushi Kubo ,  Yasumasa Iwata ,  Shingo Ishida

IPC分类号： C09J125/06 ,  B32B7/12 ,  H01L21/683 ,  C09J145/00 ,  B32B7/06 ,  B32B9/00 ,  B32B9/04 ,  B32B27/16 ,  B32B27/20 ,  B32B27/22 ,  B32B27/28 ,  B32B27/30 ,  C09J153/02 ,  B32B38/10 ,  C09J11/08

CPC分类号： H01L21/6836 ,  B32B7/06 ,  B32B7/12 ,  B32B9/005 ,  B32B9/045 ,  B32B27/16 ,  B32B27/20 ,  B32B27/22 ,  B32B27/281 ,  B32B27/283 ,  B32B27/302 ,  B32B27/308 ,  B32B38/10 ,  B32B2255/20 ,  B32B2307/306 ,  B32B2307/714 ,  B32B2310/08 ,  B32B2457/14 ,  C09J11/08 ,  C09J125/06 ,  C09J145/00 ,  C09J153/025 ,  H01L21/6835 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381

摘要： An adhesive composition for temporarily attaching a substrate to a support plate which supports the substrate, including a thermoplastic resin and a release agent.