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公开(公告)号：US10747113B2
公开(公告)日：2020-08-18
申请号：US15855102
申请日：2017-12-27
发明人： Dai Shiota , Hiroki Chisaka , Kunihiro Noda , Kazuya Someya
IPC分类号： G03F7/11 , G03F7/075 , G03F7/30 , C07F7/08 , C09D183/06 , C08G77/18 , C09D183/10 , G03F7/32 , G03F7/20 , C08G77/42
摘要： A method of pattern formation. The method is capable of inhibiting a post-development residue from remaining on a support equipped with an electrode, and a method of producing a polysilane-polysiloxane resin precursor that is suitable for use in the method of pattern formation. The method of pattern formation includes forming a film of a silicon-containing composition on the support equipped with an electrode forming a film of a resin composition on the film of a silicon-containing composition, and forming the film of a resin composition into a pattern.
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公开(公告)号：US10364372B2
公开(公告)日：2019-07-30
申请号：US15856659
申请日：2017-12-28
发明人： Yasushi Fujii , Kunihiro Noda , Hiroki Chisaka , Kazuya Someya , Koichi Misumi , Dai Shiota
IPC分类号： C08G77/62 , C09D183/16 , H01L21/02 , C08L83/16
摘要： A composition capable of stably providing a high-quality siliceous film even under relatively low-temperature heating conditions, and a method of using the composition for forming a siliceous film. The composition includes a polysilazane and an imidazole group-containing compound represented by Formula (B).
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公开(公告)号：US10322989B2
公开(公告)日：2019-06-18
申请号：US15509168
申请日：2015-09-25
发明人： Dai Shiota , Kunihiro Noda , Hiroki Chisaka , Mayumi Kuroko
IPC分类号： C07C43/215 , C08F20/30 , C08F16/32 , C08F20/20 , C07C43/23 , C08F16/26 , C08F216/12 , C08F216/14 , C08F220/30 , C08F220/32 , C08F222/10
摘要： A transparent body production method that includes subjecting the compound represented by formula (1) to heating at a temperature equal to or greater than the melting point of said compound. In formula (1), each of W1 and W2 is the group represented by formula (2) in which the ring Z is an aromatic hydrocarbon ring, X is a single bond or —S—, R1 is a single bond or an alkylene group having 1-4 carbon atoms, R2 is a specific substituent, and m is an integer of 0 or higher, the group represented by formula (4) is —OH— or a (meth)acryloyloxy group, each of the rings Y1 and Y2 is an aromatic hydrocarbon ring, R is a single bond or a specific divalent group, each of R3a and R3b is —CN, a halogen group, or a monovalent hydrocarbon group, and each of n1 and n2 is an integer of 0-4.
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公开(公告)号：US20160046552A1
公开(公告)日：2016-02-18
申请号：US14780786
申请日：2014-03-28
发明人： Dai Shiota , Kunihiro Noda , Hiroki Chisaka
IPC分类号： C07C43/215 , C07C309/66 , C07C43/225 , G03F7/027 , C08F16/24 , C08F16/30 , C08F22/14 , C07C69/54 , C08F16/32
CPC分类号： C07C43/215 , C07C43/225 , C07C69/54 , C07C309/66 , C07C2603/18 , C08F16/12 , C08F16/24 , C08F16/30 , C08F16/32 , C08F22/14 , C08F222/10 , C08L33/14 , G03F7/0045 , G03F7/027 , G03F7/028 , G03F7/0382
摘要： A composition containing a novel vinyl-group-containing compound. This composition contains a vinyl-group-containing compound represented by general formula (1). In the formula: W1 and W2 represent a group represented by general formula (2) (where a ring (Z) is an aromatic hydrocarbon ring, X is a single bond or —S—, R1 is a single bond or a C1-4 alkylene group, R2 is a specific substituent group such as a monovalent hydrocarbon, and m is an integer equal to 0 or higher), a group represented by general formula (4) (where the ring (Z), X, R1, R2, and m are as previously stated), a hydroxyl group, or a (meth)acryloyloxy group; rings (Y1, Y2) are aromatic hydrocarbon rings; R represents a single bond or a specific divalent group; R3a and R3b represent a cyano group, a halogen atom, or a monovalent hydrocarbon group; and n1 and n2 are integers of 0-4.
摘要翻译： 含有新型含乙烯基的化合物的组合物。 该组合物含有由通式（1）表示的含有乙烯基的化合物。 式中，W 1，W 2表示通式（2）表示的基团（其中，环（Z）为芳香族烃环，X为单键或-S-，R1为单键或C1-4 亚烷基，R 2为特定的取代基，例如一价烃，m为0以上的整数），通式（4）表示的基团（其中，环（Z），X，R 1，R 2， 和m如前所述），羟基或（甲基）丙烯酰氧基; 环（Y1，Y2）是芳烃环; R表示单键或特定二价基团; R3a和R3b表示氰基，卤素原子或一价烃基; n1和n2为0-4的整数。
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公开(公告)号：US11718587B2
公开(公告)日：2023-08-08
申请号：US16648585
申请日：2018-09-26
发明人： Kunihiro Noda , Hiroki Chisaka , Issei Suzuki , Jiro Hikida , Dai Shiota , Kieko Hanano , Kyohei Ishida , Tsutomu Watanabe , Kazuhiro Uehara
IPC分类号： C07D233/60 , C07D233/58
CPC分类号： C07D233/60 , C07D233/58
摘要： A novel compound suitable as an epoxy curing catalyst; an epoxy curing catalyst using the compound; and a method for producing the compound. A compound represented by formula (1) in which Xm+ represents an m valent counter cation, R1 represents an aromatic group which may have a substituent; R2 represents an alkylene group which may have a substituent; R3 represents a halogen atom, a hydroxyl group, a mercapto group, a sulfide group, a silyl group, a silanol group, a nitro group, a nitroso group, a sulfonic acid ester group, a phosphino group, a phosphinyl group, a phosphonic acid ester group or an organic group; m represents an integer of 1 or more; n represents an integer of 0-3; and R2 may bond with R1 to form a cyclic structure.
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公开(公告)号：US11274245B2
公开(公告)日：2022-03-15
申请号：US16213040
申请日：2018-12-07
发明人： Hiroki Chisaka , Kunihiro Noda , Dai Shiota
摘要： To provide a curable composition which can easily form an optical film with good fluorescence efficiency and includes quantum dots (B), a film made of a cured product of the curable composition, an optical film for a light-emitting display element made of the film, a light-emitting display element panel including the optical film, and a light-emitting display equipped with the light-emitting display element panel. A film is formed by curing a curable composition which includes an epoxy compound (A) having two or more epoxy groups and including a cyclic structure other than an oxirane ring, quantum dots (B), and an acid generator (C).
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公开(公告)号：US09902675B2
公开(公告)日：2018-02-27
申请号：US14780760
申请日：2014-03-28
发明人： Dai Shiota , Kunihiro Noda , Hiroki Chisaka , Yasuyuki Akai , Ichiro Takase , Yoshiya Narasaki , Daisuke Tanida , Kyuhei Kitao
IPC分类号： C07C57/50 , C07C69/54 , G03F7/027 , C07C43/215 , C07C43/23 , C07C309/66 , C07C41/22 , C07C41/24 , C07C43/225 , C07C67/14 , C07C303/30
CPC分类号： C07C43/215 , C07C41/22 , C07C41/24 , C07C43/225 , C07C43/23 , C07C57/50 , C07C67/14 , C07C69/54 , C07C303/30 , C07C309/66 , C07C2603/18 , G03F7/027
摘要： A novel vinyl-group-containing fluorene compound and a method for producing the same, a polymerizable monomer and cross-linking agent including this compound, a leaving-group-containing fluorene compound, a monovinyl-group-containing fluorene compound, and methods for producing the same. This vinyl-group-containing fluorene compound is represented by formula (1). In the formula, W1 and W2 represent a group represented by formula (2), a group represented by formula (4), a hydroxyl group, or a (meth)acryloyloxy group, R3a and R3b represent a cyano group, a halogen atom, or a monovalent hydrocarbon, and n1 and n2 are integers of 0-4. In formulas (2) and (4), a ring (Z) is an aromatic hydrocarbon ring, X is a single bond or a group represented by —S—, R1 is a single bond or a C1-4 alkylene group, R2 is a specific substituent group such as a monovalent hydrocarbon, and m is an integer of 0 or greater.
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公开(公告)号：US20150338734A1
公开(公告)日：2015-11-26
申请号：US14758199
申请日：2013-12-25
发明人： Kunihiro Noda , Hiroki Chisaka , Dai Shiota , Kazuya Someya
CPC分类号： G03F7/0041 , C07C323/47 , C07D209/86 , C07D233/56 , C07D233/60 , C08G73/1042 , C08G73/105 , C08G73/1067 , C08G73/1071 , C08G73/1078 , C08K5/33 , C08K5/34 , C09D179/08 , G03F7/0045 , G03F7/0387 , G03F7/16 , G03F7/20 , G03F7/32 , G03F7/40 , C08K5/3445
摘要： The present invention provides an energy-sensitive resin composition, a method of manufacturing a polyimide film or a polyimide molded product in which said composition is used, and a method of forming a pattern in which said composition is used. The composition supplies a polyimide resin exhibiting exceptional thermal resistance and low permittivity even by a heat treatment at a low temperature. The composition contains polyamic acid obtained by reacting tetracarboxylic dianhydride and diamine, a solvent, and a compound (A) decomposing by the action of light and/or heat and generating a base and/or an acid. The method of manufacturing a polyimide film or a polyimide molded product includes forming a coating film or molded product comprising the composition and decomposing the compound (A) in the film or product through exposure or heating. The method of forming a pattern sequentially includes forming, selectively exposing, developing and heating the film or product.
摘要翻译： 本发明提供一种能量敏感性树脂组合物，其中使用所述组合物的聚酰亚胺薄膜或聚酰亚胺模塑制品的制造方法以及形成所述组合物的图案的方法。 该组合物即使通过在低温下进行热处理也提供具有优异的耐热性和低介电常数的聚酰亚胺树脂。 该组合物含有通过使四羧酸二酐和二胺，溶剂和通过光和/或热的作用分解并产生碱和/或酸的化合物（A）反应而获得的聚酰胺酸。 制造聚酰亚胺膜或聚酰亚胺模塑制品的方法包括形成包含该组合物的涂膜或模制品，并通过曝光或加热分解膜或产品中的化合物（A）。 顺序形成图案的方法包括成膜，选择性地曝光，显影和加热薄膜或产品。
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9.发明申请POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR FORMING POLYIMIDE RESIN PATTERNS, AND PATTERNED POLYIMIDE RESIN FILM 有权阳性感光树脂组合物，形成聚酰胺树脂图案的方法和图案化聚酰胺树脂薄膜公开(公告)号：US20150261086A1
公开(公告)日：2015-09-17
申请号：US14438182
申请日：2013-10-25
发明人： Kunihiro Noda , Hiroki Chisaka , Dai Shiota
CPC分类号： G03F7/039 , G03F7/0045 , G03F7/20 , G03F7/26
摘要： A positive photosensitive resin composition containing a polyimide resin that allows patterns to be satisfactorily formed by photolithography, and provides patterns with excellent heat resistance, and a method for forming polyimide resin patterns using the positive photosensitive resin composition. A patterned polyimide resin film formed by the method for forming polyimide resin patterns. To the photosensitive resin composition are added a polyimide resin, and a compound in which an imidazole compound having a specific structure is generated by the action of light.
摘要翻译： 含有通过光刻法令人满意地形成图案的聚酰亚胺树脂并提供耐热性优异的图案的正性感光性树脂组合物，以及使用正型感光性树脂组合物形成聚酰亚胺树脂图案的方法。 通过形成聚酰亚胺树脂图案的方法形成的图案化聚酰亚胺树脂膜。 向感光性树脂组合物中加入聚酰亚胺树脂，通过光的作用产生具有特定结构的咪唑化合物的化合物。
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10.发明授权公开(公告)号：US10767017B2
公开(公告)日：2020-09-08
申请号：US15855291
申请日：2017-12-27
发明人： Kunihiro Noda , Hiroki Chisaka , Kazuya Someya , Dai Shiota
IPC分类号： C08L83/14 , C08G77/18 , C09D183/06 , C08G77/08 , C08L83/10 , C08G77/42 , C08L83/16 , C08G77/60 , C07F7/21
摘要： A resin composition including a silicon-containing resin component and a solvent, the silicon-containing resin component including at least one of (I) and (II) mentioned below, the solvent including at least one of a terpene compound having at least one of a hydroxy group and an acetoxy group, and a cyclic skeleton-containing acetate compound (excluding the terpene compound): (I) a polysilane-polysiloxane resin having a polysilane structure and a polysiloxane structure, and (II) a mixture of a resin having a polysilane structure and a resin having a polysiloxane structure.
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