公开(公告)号：US20150315436A1

公开(公告)日：2015-11-05

申请号：US14647178

申请日：2013-12-04

Applicant: TORAY INDUSTRIES, INC.

Inventor： Koichi FUJIMARU ,  Toshihisa NONAKA

IPC: C09J179/08 ,  H01L23/00

CPC classification number: H05K3/323 ,  C08K3/013 ,  C08L63/00 ,  C08L79/08 ,  C08L93/04 ,  C09J163/00 ,  C09J179/08 ,  C09J193/04 ,  C09J2479/083 ,  H01L21/6836 ,  H01L24/13 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L24/94 ,  H01L2221/68327 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/27003 ,  H01L2224/27334 ,  H01L2224/27436 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29387 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/81191 ,  H01L2224/81203 ,  H01L2224/81907 ,  H01L2224/83132 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83193 ,  H01L2224/83203 ,  H01L2224/8385 ,  H01L2224/83862 ,  H01L2224/83907 ,  H01L2224/83948 ,  H01L2224/9211 ,  H01L2224/94 ,  H01L2924/01008 ,  H01L2924/01014 ,  H01L2924/0665 ,  H01L2924/07025 ,  H01L2924/15787 ,  H01L2924/15788 ,  H05K3/305 ,  H05K3/3436 ,  H05K3/3489 ,  H05K2201/0154 ,  H05K2201/10977 ,  Y02P70/613 ,  C08K3/0033 ,  H01L2924/05432 ,  H01L2924/05442 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2224/27 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00

Abstract: The present invention relates to an adhesive agent which can be used in the mounting of a semiconductor chip on a circuit board or the like. The present invention addresses the problem of providing an adhesive agent having both excellent storage stability and excellent connection reliability. A means for solving the problem is an adhesive agent comprising (a) a polyamide, (b) an epoxy compound and (c) an acid-modified rosin.

Abstract translation: 本发明涉及可用于将半导体芯片安装在电路板等上的粘合剂。 本发明解决了提供具有优异的储存稳定性和优异的连接可靠性的粘合剂的问题。 解决问题的手段是粘合剂，其包含（a）聚酰胺，（b）环氧化合物和（c）酸改性的松香。

公开(公告)号：US20200010701A1

公开(公告)日：2020-01-09

申请号：US16490404

申请日：2018-02-28

Applicant: TORAY INDUSTRIES, INC.

Inventor： Yuichi TSUJI ,  Hironobu SADAKUNI ,  Noboru KOSHIMIZU ,  Koichi FUJIMARU ,  Takejiro INOUE

IPC: C09D11/101 ,  C09D11/107 ,  B41M7/00 ,  B41M1/30

Abstract: Provided is active energy ray-curable ink for offset printing which has marked curability and toning resistance during printing, exhibits good transferability and adhesiveness to plastic films having low wettability, and imparts high hiding power to printed matter. The active energy ray-curable ink for offset printing includes a pigment, a polyfunctional (meth)acrylate having a hydroxyl group, and a resin having an ethylenic unsaturated group and a hydrophilic group.