Abstract:
The present invention relates to an adhesive agent which can be used in the mounting of a semiconductor chip on a circuit board or the like. The present invention addresses the problem of providing an adhesive agent having both excellent storage stability and excellent connection reliability. A means for solving the problem is an adhesive agent comprising (a) a polyamide, (b) an epoxy compound and (c) an acid-modified rosin.
Abstract:
Provided is active energy ray-curable ink for offset printing which has marked curability and toning resistance during printing, exhibits good transferability and adhesiveness to plastic films having low wettability, and imparts high hiding power to printed matter. The active energy ray-curable ink for offset printing includes a pigment, a polyfunctional (meth)acrylate having a hydroxyl group, and a resin having an ethylenic unsaturated group and a hydrophilic group.