公开(公告)号：US20150315436A1

公开(公告)日：2015-11-05

申请号：US14647178

申请日：2013-12-04

Applicant: TORAY INDUSTRIES, INC.

Inventor： Koichi FUJIMARU ,  Toshihisa NONAKA

IPC: C09J179/08 ,  H01L23/00

CPC classification number: H05K3/323 ,  C08K3/013 ,  C08L63/00 ,  C08L79/08 ,  C08L93/04 ,  C09J163/00 ,  C09J179/08 ,  C09J193/04 ,  C09J2479/083 ,  H01L21/6836 ,  H01L24/13 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L24/94 ,  H01L2221/68327 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/27003 ,  H01L2224/27334 ,  H01L2224/27436 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29387 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/81191 ,  H01L2224/81203 ,  H01L2224/81907 ,  H01L2224/83132 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83193 ,  H01L2224/83203 ,  H01L2224/8385 ,  H01L2224/83862 ,  H01L2224/83907 ,  H01L2224/83948 ,  H01L2224/9211 ,  H01L2224/94 ,  H01L2924/01008 ,  H01L2924/01014 ,  H01L2924/0665 ,  H01L2924/07025 ,  H01L2924/15787 ,  H01L2924/15788 ,  H05K3/305 ,  H05K3/3436 ,  H05K3/3489 ,  H05K2201/0154 ,  H05K2201/10977 ,  Y02P70/613 ,  C08K3/0033 ,  H01L2924/05432 ,  H01L2924/05442 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2224/27 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00

Abstract: The present invention relates to an adhesive agent which can be used in the mounting of a semiconductor chip on a circuit board or the like. The present invention addresses the problem of providing an adhesive agent having both excellent storage stability and excellent connection reliability. A means for solving the problem is an adhesive agent comprising (a) a polyamide, (b) an epoxy compound and (c) an acid-modified rosin.

Abstract translation: 本发明涉及可用于将半导体芯片安装在电路板等上的粘合剂。 本发明解决了提供具有优异的储存稳定性和优异的连接可靠性的粘合剂的问题。 解决问题的手段是粘合剂，其包含（a）聚酰胺，（b）环氧化合物和（c）酸改性的松香。

公开(公告)号：US20160340558A1

公开(公告)日：2016-11-24

申请号：US15111265

申请日：2015-01-09

Applicant: TORAY INDUSTRIES, INC.

Inventor： Takuro ODA ,  Daisuke KANAMORI ,  Toshihisa NONAKA

IPC: C09J9/02 ,  C08G73/10 ,  H01L21/683 ,  H01L23/00 ,  H01L25/00 ,  H01L25/065 ,  C09J163/00 ,  C09J7/02

CPC classification number: C09J9/02 ,  C08G73/106 ,  C08G2170/00 ,  C09D163/00 ,  C09J7/20 ,  C09J163/00 ,  C09J179/08 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2463/00 ,  C09J2479/00 ,  C09J2479/08 ,  H01L21/6836 ,  H01L23/293 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L24/94 ,  H01L25/0657 ,  H01L25/50 ,  H01L2221/68327 ,  H01L2221/68377 ,  H01L2224/1134 ,  H01L2224/1146 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/27003 ,  H01L2224/271 ,  H01L2224/2731 ,  H01L2224/2732 ,  H01L2224/2741 ,  H01L2224/27416 ,  H01L2224/27436 ,  H01L2224/2929 ,  H01L2224/29294 ,  H01L2224/293 ,  H01L2224/29387 ,  H01L2224/29388 ,  H01L2224/2939 ,  H01L2224/29499 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81203 ,  H01L2224/81204 ,  H01L2224/81801 ,  H01L2224/81907 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83193 ,  H01L2224/83204 ,  H01L2224/83862 ,  H01L2224/83907 ,  H01L2224/83948 ,  H01L2224/9211 ,  H01L2224/94 ,  H01L2225/06513 ,  H05K3/321 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/05442 ,  H01L2924/00012 ,  H01L2224/27 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00 ,  C08L1/00 ,  H01L2924/07025 ,  H01L2924/05432 ,  H01L2924/05341 ,  H01L2924/05042 ,  H01L2924/0503 ,  H01L2924/01005 ,  H01L2924/05032 ,  H01L2924/0498 ,  H01L2924/01026 ,  H01L2924/053 ,  H01L2924/049 ,  H01L2924/0544 ,  H01L2924/01006

Abstract: The present invention provides an adhesive composition having excellent strength in a cracked state, and is an adhesive composition characterized by containing a polyimide (A), polyfunctional epoxy compound (B), an epoxy curing agent (C), and inorganic particles (D), the ratio of the polyimide (A) in a nonvolatile organic component being 3.0 wt % or more and 30 wt % or less, the ratio of the epoxy curing agent (C) in the nonvolatile organic component being 0.5 wt % or more and 10 wt % or less, and T/M being 400 or more and 8000 or less, where T is the total number of grams of the nonvolatile organic component, and M is the number of moles of epoxy groups in the nonvolatile organic component.

Abstract translation: 本发明提供一种具有优异的破裂强度的粘合剂组合物，其特征在于含有聚酰亚胺（A），多官能环氧化合物（B），环氧固化剂（C）和无机颗粒（D） ，非挥发性有机成分中的聚酰亚胺（A）的比例为3.0重量％以上且30重量％以下，非挥发性有机成分中的环氧固化剂（C）的比例为0.5重量％以上且10重量％以下 重量％以下，T / M为400以上且8000以下，其中，T为非挥发性有机成分的总克数，M为非挥发性有机成分中的环氧基的摩尔数。

公开(公告)号：US20160300810A1

公开(公告)日：2016-10-13

申请号：US15038266

申请日：2014-11-25

Applicant: TORAY INDUSTRIES, INC.

Inventor： Daisuke KANAMORI ,  Takuro ODA ,  Toshihisa NONAKA

IPC: H01L23/00 ,  C08G73/10 ,  C09J163/00 ,  C09J7/02 ,  H01L21/683 ,  C09J9/02

CPC classification number: H01L24/29 ,  C08G73/1017 ,  C08G73/1042 ,  C08G73/1046 ,  C08G73/106 ,  C08G73/1064 ,  C08G73/1071 ,  C08G73/1082 ,  C08K3/36 ,  C08L21/00 ,  C08L63/00 ,  C09D179/08 ,  C09J7/20 ,  C09J9/02 ,  C09J163/00 ,  C09J179/08 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2463/00 ,  C09J2479/00 ,  H01L21/6836 ,  H01L2221/68327 ,  H01L2224/2929

Abstract: The objective of the present invention is to obtain a semiconductor resin composition having a sufficiently low coefficient of linear expansion of the cured product thereof and a uniform distribution of inorganic particles in the direction of film thickness of a produced semi-cured film thereof. The semiconductor resin composition, which contains (a) an epoxy compound, (b) inorganic particles, (c) a polyimide, and (d) a solvent, is characterized by further containing (e) rubber particles and by the fraction of the (b) inorganic particles in the weight of the total solid fraction resulting from subtracting the weight of the (d) solvent from the total weight of the semiconductor resin composition being 60-92 wt % inclusive.

Abstract translation: 本发明的目的是获得具有足够低的固化产物线性膨胀系数以及无机颗粒沿其制备的半固化膜的膜厚方向的均匀分布的半导体树脂组合物。 包含（a）环氧化合物，（b）无机颗粒，（c）聚酰亚胺和（d）溶剂）的半导体树脂组合物的特征在于还含有（e）橡胶颗粒和（ b）由半导体树脂组合物的总重量减去（d）溶剂的重量而得到的总固体成分重量为60-92wt％的无机颗粒。

公开(公告)号：US20160083537A1

公开(公告)日：2016-03-24

申请号：US14783641

申请日：2014-05-30

Applicant: TORAY INDUSTRIES, INC.

Inventor： Yoichi SHIMBA ,  Kazuyuki MATSUMURA ,  Toshihisa NONAKA

IPC: C08J5/18 ,  C08K5/07 ,  B29C41/02 ,  C08K9/04 ,  H01L21/50 ,  H01L23/00

CPC classification number: C08J5/18 ,  B29C41/02 ,  B29K2063/00 ,  B29K2105/16 ,  B29K2509/00 ,  C08J2363/00 ,  C08K3/013 ,  C08K5/07 ,  C08K9/04 ,  H01L21/50 ,  H01L21/6836 ,  H01L23/49558 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L2021/603 ,  H01L2221/68327 ,  H01L2224/1134 ,  H01L2224/1146 ,  H01L2224/131 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/27003 ,  H01L2224/271 ,  H01L2224/27334 ,  H01L2224/2929 ,  H01L2224/29387 ,  H01L2224/29388 ,  H01L2224/29499 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81204 ,  H01L2224/81801 ,  H01L2224/81903 ,  H01L2224/83101 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83204 ,  H01L2224/83862 ,  H01L2224/83874 ,  H01L2224/9211 ,  H01L2225/06513 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/3512 ,  H05K3/305 ,  H01L2924/00014 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/05442 ,  H01L2924/0665 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2924/00 ,  C08K3/0033 ,  C08L63/00

Abstract: Provided is a resin sheet, wherein in a stress measurement in which a dynamic shear strain is applied in a direction parallel to a surface, the difference between a loss tangent as measured when a strain amplitude is 10% of the sheet thickness and a loss tangent as measured when the amplitude is 0.1% is equal to or greater than 1 at a temperature of 80° C. and a frequency of 0.5 Hz. The resin sheet of the present invention can provide a semiconductor device with excellent connection reliability, wherein air bubbles and cracks are less likely to occur in the resin sheet. In the resin composition of the present invention, aggregates are less likely to occur during storage. The resin sheet obtained by forming the resin composition into a sheet has good flatness. The hardened material thereof can provide a circuit board or a semiconductor device with high connection reliability.

Abstract translation: 提供一种树脂片，其中在应力测量中，在与表面平行的方向上施加动态剪切应变时，在应变幅度为板厚的10％时测量的损耗角正切与损耗角正切之间的差 当在80℃的温度和0.5Hz的频率下振幅为0.1％时测得的值等于或大于1。 本发明的树脂片可以提供具有良好的连接可靠性的半导体器件，其中在树脂片中不太可能发生气泡和裂纹。 在本发明的树脂组合物中，聚集体在储存期间不太可能发生。 通过将树脂组合物形成为片材而获得的树脂片具有良好的平坦度。 其硬化材料可以提供具有高连接可靠性的电路板或半导体器件。