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    Printed circuit board using paste bump and manufacturing method thereof
    3.
    发明申请
    Printed circuit board using paste bump and manufacturing method thereof 有权
    使用糊状凸块的印刷电路板及其制造方法

    公开(公告)号：US20080283288A1

    公开(公告)日：2008-11-20

    申请号：US12219381

    申请日：2008-07-21

    申请人： Jee-Soo Mok ,  Chang-Sup Ryu ,  Eung-Suek Lee ,  Youn-Soo Seo ,  Hee-Bum Shin ,  Yoong Oh ,  Byung-Bae Seo ,  Tae-Kyoung Kim ,  Dong-Jin Park

    发明人： Jee-Soo Mok ,  Chang-Sup Ryu ,  Eung-Suek Lee ,  Youn-Soo Seo ,  Hee-Bum Shin ,  Yoong Oh ,  Byung-Bae Seo ,  Tae-Kyoung Kim ,  Dong-Jin Park

    IPC分类号： H05K1/11

    CPC分类号： H05K3/462 ,  H01R12/523 ,  H05K3/4069 ,  H05K3/4647 ,  H05K3/4652 ,  H05K2201/0355 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/096 ,  H05K2203/0353 ,  Y10T29/49155

    摘要： A printed circuit board using paste bumps and manufacturing method thereof are disclosed. The method of manufacturing a printed circuit board using paste bumps, includes: (a) perforating a core board to form at least one via hole, (b) filling the at least one via hole by fill-plating and forming a circuit pattern on at least one surface of the core board, (c) stacking a paste bump board on at least one surface of the core board, and (d) forming an outer layer circuit on a surface of the paste bump board, a structurally stable all-layer IVH structure can be implemented due to increased strength in the BVH's of the plated core boards, the manufacture time can be reduced due to parallel processes and collective stacking, implementing micro circuits can be made easy due to the copper foils of the paste bump boards stacked on the outermost layers, the manufacture costs can be reduced as certain plating and drilling processes may be omitted, the interlayer connection area is increased between circuit patterns for improved connection reliability, and dimple coverage can be obtained.

    摘要翻译： 公开了一种使用糊状凸块的印刷电路板及其制造方法。 使用糊状凸块制造印刷电路板的方法包括：（a）穿孔芯板以形成至少一个通孔，（b）通过填充电镀填充至少一个通孔并在其上形成电路图案 芯板的至少一个表面，（c）在芯板的至少一个表面上堆叠焊料凸块，以及（d）在焊料凸块的表面上形成外层电路，结构稳定的全层 由于镀层芯板的BVH的强度增加，可以实现IVH结构，由于并行处理和集体堆叠，制造时间可以减少，由于糊状凸块的铜箔堆叠而实现微电路变得容易 在最外层，可以减少制造成本，因为可以省略某些电镀和钻孔工艺，在电路图案之间增加层间连接面积以提高连接可靠性，并且可以获得凹坑覆盖 d。

    Printed circuit board using paste bump and manufacturing method thereof
    5.
    发明授权
    Printed circuit board using paste bump and manufacturing method thereof 有权
    使用糊状凸块的印刷电路板及其制造方法

    公开(公告)号：US07973248B2

    公开(公告)日：2011-07-05

    申请号：US12219381

    申请日：2008-07-21

    申请人： Jee-Soo Mok ,  Chang-Sup Ryu ,  Eung-Suek Lee ,  Youn-Soo Seo ,  Hee-Bum Shin ,  Yoong Oh ,  Byung-Bae Seo ,  Tae-Kyoung Kim ,  Dong-Jin Park

    发明人： Jee-Soo Mok ,  Chang-Sup Ryu ,  Eung-Suek Lee ,  Youn-Soo Seo ,  Hee-Bum Shin ,  Yoong Oh ,  Byung-Bae Seo ,  Tae-Kyoung Kim ,  Dong-Jin Park

    IPC分类号： H01R12/04 ,  H05K1/11

    CPC分类号： H05K3/462 ,  H01R12/523 ,  H05K3/4069 ,  H05K3/4647 ,  H05K3/4652 ,  H05K2201/0355 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/096 ,  H05K2203/0353 ,  Y10T29/49155

    摘要： A printed circuit board using paste bumps and manufacturing method thereof are disclosed. The method of manufacturing a printed circuit board using paste bumps, includes: (a) perforating a core board to form at least one via hole, (b) filling the at least one via hole by fill-plating and forming a circuit pattern on at least one surface of the core board, (c) stacking a paste bump board on at least one surface of the core board, and (d) forming an outer layer circuit on a surface of the paste bump board, a structurally stable all-layer IVH structure can be implemented due to increased strength in the BVH's of the plated core boards, the manufacture time can be reduced due to parallel processes and collective stacking, implementing micro circuits can be made easy due to the copper foils of the paste bump boards stacked on the outermost layers, the manufacture costs can be reduced as certain plating and drilling processes may be omitted, the interlayer connection area is increased between circuit patterns for improved connection reliability, and dimple coverage can be obtained.

    摘要翻译： 公开了一种使用糊状凸块的印刷电路板及其制造方法。 使用糊状凸块制造印刷电路板的方法包括：（a）穿孔芯板以形成至少一个通孔，（b）通过填充电镀填充至少一个通孔并在其上形成电路图案 芯板的至少一个表面，（c）在芯板的至少一个表面上堆叠焊料凸块，以及（d）在焊料凸块的表面上形成外层电路，结构稳定的全层 由于镀层芯板的BVH的强度增加，可以实现IVH结构，由于并行处理和集体堆叠，制造时间可以减少，由于粘贴凸块的铜箔堆叠而实现微电路变得容易 在最外层，可以减少制造成本，因为可以省略某些电镀和钻孔工艺，在电路图案之间增加层间连接面积以提高连接可靠性，并且可以获得凹坑覆盖 d。

    Wafer holder and wafer conveyor equipped with the same
    6.
    发明授权
    Wafer holder and wafer conveyor equipped with the same 失效
    晶圆架和晶圆输送机配备相同

    公开(公告)号：US07666069B2

    公开(公告)日：2010-02-23

    申请号：US11783534

    申请日：2007-04-10

    申请人： Tae-Kyoung Kim ,  Yun-Jung Jee ,  Kyoung-Su Shin ,  Chung-Sam Jun

    发明人： Tae-Kyoung Kim ,  Yun-Jung Jee ,  Kyoung-Su Shin ,  Chung-Sam Jun

    IPC分类号： B24B47/02

    CPC分类号： H01L21/68785 ,  H01L21/6776

    摘要： The present invention is directed to a wafer holder and a related wafer conveyor system. The wafer holder holds a wafer and moves horizontally within a chamber. A contact area between the wafer and the wafer holder is reduced, and potential contaminants generated by ear between components of the wafer holder are trapped by an airtight cover. Since the wafer holder moves horizontally while being fixed to a guide rail, the wafer conveyor system reduces friction between the guide rail and the wafer holder.

    摘要翻译： 本发明涉及晶片保持器和相关的晶片输送系统。 晶片保持器保持晶片并且在腔室内水平移动。 晶片和晶片保持架之间的接触面积减小，并且由晶片保持器的部件之间的耳朵产生的潜在的污染物被气密的盖子所困住。 由于晶片保持架在固定到导轨的同时水平移动，所以晶片传送系统减小了导轨和晶片保持器之间的摩擦。

    Wafer holder and wafer conveyor system equipped with the same
    7.
    发明申请
    Wafer holder and wafer conveyor system equipped with the same 失效
    晶圆架和晶圆输送系统配备相同

    公开(公告)号：US20050221740A1

    公开(公告)日：2005-10-06

    申请号：US11016247

    申请日：2004-12-20

    申请人： Tae-Kyoung Kim ,  Yun-Jung Jee ,  Kyoung-Su Shin ,  Chung-Sam Jun

    发明人： Tae-Kyoung Kim ,  Yun-Jung Jee ,  Kyoung-Su Shin ,  Chung-Sam Jun

    IPC分类号： H01L21/68 ,  B24B5/00 ,  H01L21/677 ,  H01L21/683 ,  H01L21/687

    CPC分类号： H01L21/68785 ,  H01L21/6776

    摘要： The present invention is directed to a wafer holder and a related wafer conveyor system. The wafer holder holds a wafer and moves horizontally within a chamber. A contact area between the wafer and the wafer holder is reduced, and potential contaminants generated by ear between components of the wafer holder are trapped by an airtight cover. Since the wafer holder moves horizontally while being fixed to a guide rail, the wafer conveyor system reduces friction between the guide rail and the wafer holder.

    摘要翻译： 本发明涉及晶片保持器和相关的晶片输送系统。 晶片保持器保持晶片并且在腔室内水平移动。 晶片和晶片保持架之间的接触面积减小，并且由晶片保持器的部件之间的耳朵产生的潜在的污染物被气密的盖子所困住。 由于晶片保持架在固定到导轨的同时水平移动，所以晶片传送系统减小了导轨和晶片保持器之间的摩擦。

    Method and apparatus for detecting laundry weight of washing machine
    10.
    发明授权
    Method and apparatus for detecting laundry weight of washing machine 有权
    用于检测洗衣机衣物重量的方法和装置

    公开(公告)号：US07484258B2

    公开(公告)日：2009-02-03

    申请号：US10896078

    申请日：2004-07-22

    申请人： Tae-Kyoung Kim ,  Soon-Bae Yang ,  Kwan-Yuhl Cho

    发明人： Tae-Kyoung Kim ,  Soon-Bae Yang ,  Kwan-Yuhl Cho

    IPC分类号： D06F35/00

    CPC分类号： D06F33/02 ,  D06F39/003 ,  D06F2202/065 ,  D06F2202/12

    摘要： A method and an apparatus for detecting a laundry weight of a washing machine can correctly detect a laundry weight of a washing machine. To this end, a motor of a washing machine is driven at a first speed and then at a second speed, and a laundry weight is detected on the basis of a value of a first current for driving the motor at the first speed and a value of a second current for driving the motor at the second speed.

    摘要翻译： 用于检测洗衣机的衣物重量的方法和装置可以正确地检测洗衣机的衣物重量。 为此，洗衣机的电动机以第一速度然后以第二速度被驱动，并且基于用于以第一速度驱动电动机的第一电流的值和值的值检测衣物重量 用于以第二速度驱动电动机的第二电流。