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    Method for forming a circuit pattern on a substrate
    1.
    发明申请
    Method for forming a circuit pattern on a substrate 审中-公开
    在基板上形成电路图案的方法

    公开(公告)号：US20160186327A1

    公开(公告)日：2016-06-30

    申请号：US14757611

    申请日：2015-12-23

    Applicant: Taiwan Green Point Enterprises Co., Ltd.

    Inventor： Sheng-Hung Yi ,  Pen-Yi Liao

    IPC: C23C18/31 ,  C23C18/16 ,  B05D1/02

    CPC classification number: C23C18/31 ,  C23C18/161 ,  C23C18/1653 ,  C23C18/1689 ,  C23C18/206 ,  C23C18/30 ,  C25D5/02 ,  H05K3/182 ,  H05K3/241 ,  H05K2201/09363 ,  H05K2203/0709 ,  H05K2203/107

    Abstract: A method for forming a circuit pattern on a substrate may include the steps of: providing a substrate having an insulating surface including a pattern-forming region; printing only on a portion of the insulating surface, including the pattern-forming region, with an activation ink so as to form an activation layer on the portion of the insulating surface; forming a first metal layer on the activation layer by electroless plating; and isolating a patterned portion of the first metal layer, which is formed on the pattern-forming region, from a remaining portion of the first metal layer.

    Abstract translation: 在基板上形成电路图案的方法可以包括以下步骤：提供具有包括图案形成区域的绝缘表面的基板; 在绝缘表面的一部分（包括图案形成区域）上用活化油墨印刷，以在绝缘表面的部分上形成活化层; 通过化学镀在活化层上形成第一金属层; 并且从所述第一金属层的剩余部分分离形成在所述图案形成区域上的所述第一金属层的图案化部分。

    NON-DELETERIOUS TECHNIQUE FOR CREATING CONTINUOUS CONDUCTIVE CIRCUITS UPON THE SURFACES OF A NON-CONDUCTIVE SUBSTRATE
    2.
    发明申请
    NON-DELETERIOUS TECHNIQUE FOR CREATING CONTINUOUS CONDUCTIVE CIRCUITS UPON THE SURFACES OF A NON-CONDUCTIVE SUBSTRATE 审中-公开
    用于在非导电基板的表面上创建连续导电电路的非永久性技术

    公开(公告)号：US20140116885A1

    公开(公告)日：2014-05-01

    申请号：US14149457

    申请日：2014-01-07

    Applicant: Taiwan Green Point Enterprises Co., Ltd.

    Inventor： Sheng-Hung Yi ,  Pen-Yi Liao

    IPC: H05K3/18

    CPC classification number: H05K3/188 ,  C25D5/02 ,  C25D5/10 ,  H05K3/027 ,  H05K3/185 ,  H05K3/24 ,  H05K2203/107 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49156

    Abstract: A non-deleterious method for producing a continuous conductive circuit upon a non-conductive substrate can begin with the application of a metallic base layer upon a surface of a non-conductive substrate. A circuit pattern can be created within the metallic base layer based upon a circuit design. The metallic base layer comprising the circuit pattern can be physically separated from the remainder of the metallic base layer on the non-conductive substrate. The region of the non-conductive substrate surface that encloses the circuit pattern can be called the plating region. The remainder of the non-conductive substrate surface can be called the non-plating region. A first metal layer can be added upon the metallic base layer. A second metal layer can be added upon the first metal layer of the plating region. The second metal layer can be electrically conductive and restricted from forming on the first metal layer of the non-plating region.

    Abstract translation: 在非导电衬底上制造连续导电电路的非有害方法可以开始于在非导电衬底的表面上施加金属基底层。 可以基于电路设计在金属基底层内形成电路图案。 包括电路图案的金属基层可以与非导电基底上的金属基底层的其余部分物理分离。 包围电路图案的非导电性基板表面的区域可以称为电镀区域。 非导电性基板表面的其余部分可以称为非电镀区域。 可以在金属基底层上添加第一金属层。 可以在电镀区域的第一金属层上添加第二金属层。 第二金属层可以导电并限制在非电镀区域的第一金属层上的形成。

    Conformal array antenna
    3.
    发明授权
    Conformal array antenna 有权

    公开(公告)号：US11349224B2

    公开(公告)日：2022-05-31

    申请号：US16742327

    申请日：2020-01-14

    Applicant: Taiwan Green Point Enterprises Co., Ltd.

    Inventor： Sheng-Hung Yi ,  Pen-Yi Liao ,  Tsung-Han Wu ,  Po-Cheng Huang

    IPC: H01Q21/20 ,  H01Q1/12 ,  H01Q1/52 ,  H01Q1/38 ,  H01Q21/00 ,  H01Q9/42

    Abstract: A conformal array antenna includes a substrate and a conductive circuit. The substrate has a non-conductive roughened curved surface formed with a plurality of hook-shaped structures that are formed by blasting a plurality of particles on the substrate. The non-conductive roughened curved surface defines a plurality of spaced-apart antenna pattern regions. The conductive circuit is located in the antenna pattern regions, and includes an activation layer formed on the roughened curved surface and containing an active metal, and a first metal layer formed on the activation layer.

    Method of making a conformal array antenna
    4.
    发明授权
    Method of making a conformal array antenna 有权

    公开(公告)号：US10573975B2

    公开(公告)日：2020-02-25

    申请号：US15866907

    申请日：2018-01-10

    Applicant: TAIWAN GREEN POINT ENTERPRISES CO., LTD.

    Inventor： Sheng-Hung Yi ,  Pen-Yi Liao ,  Tsung-Han Wu ,  Po-Cheng Huang

    IPC: H01Q21/20 ,  H01Q1/12 ,  H01Q1/52 ,  H01Q1/38 ,  H01Q21/00 ,  H01Q9/42

    Abstract: A method for making a conformal array antenna includes: providing a substrate having a non-conductive curved surface; roughening the curved surface; forming an activation layer containing an active metal on the roughened curved surface; forming a first metal layer on the activation layer by chemical plating process; and defining a plurality of spaced-apart antenna pattern regions on the first metal layer, by forming a gap along an outer periphery of each of the antenna pattern regions to isolate the antenna pattern regions from a remainder of the first metal layer. The curved surface is roughened by blasting a plurality of particles thereonto, or the spaced-apart antenna pattern regions are substantially evenly distributed.

    Capacitive touch sensitive housing and method for making the same
    8.
    发明授权
    Capacitive touch sensitive housing and method for making the same 有权
    电容式触控式外壳及其制作方法

    公开(公告)号：US08952919B2

    公开(公告)日：2015-02-10

    申请号：US14196107

    申请日：2014-03-04

    Applicant: Taiwan Green Point Enterprises Co., Ltd.

    Inventor： Sheng-Hung Yi ,  Pen-Yi Liao

    IPC: G06F3/041 ,  H03K17/96 ,  G06F3/044 ,  G06F3/0354

    CPC classification number: G06F1/16 ,  C23C18/1689 ,  C23C18/31 ,  C23C26/00 ,  C25D5/02 ,  G06F1/1626 ,  G06F1/1637 ,  G06F1/1656 ,  G06F1/169 ,  G06F1/1692 ,  G06F3/03547 ,  G06F3/044 ,  G06F2203/0339 ,  G06F2203/04103 ,  H03K17/9622 ,  H03K2217/960755 ,  Y10T29/49155

    Abstract: A method for making a capacitive touch sensitive housing, comprises: forming a non-patterned active metal layer on a housing wall; patterning the non-patterned active metal layer on the housing wall by laser ablation such that the non-patterned active metal layer is formed into a patterned active metal layer including a plurality of plating portions separated from each other, and a plurality of non-plating portions separated from the plating portions; and forming a metal layer on the patterned active metal layer such that the metal layer has first portions formed on the plating portions of the patterned active metal layer, and second portions formed on the non-plating portions of the patterned active metal layer.

    Abstract translation: 一种用于制造电容式触敏外壳的方法，包括：在外壳壁上形成非图案化的有源金属层; 通过激光烧蚀将壳体壁上的未图案化的有源金属层图案化，使得非图案化的有源金属层形成为包括彼此分离的多个电镀部分的图案化的有源金属层，以及多个非电镀 与电镀部分分离的部分; 以及在所述图案化的有源金属层上形成金属层，使得所述金属层具有形成在所述图案化的有源金属层的电镀部分上的第一部分，以及形成在所述图案化的有源金属层的非镀覆部分上的第二部分。

    FABRICATING A CONDUCTIVE TRACE STRUCTURE AND SUBSTRATE HAVING THE STRUCTURE
    9.
    发明申请
    FABRICATING A CONDUCTIVE TRACE STRUCTURE AND SUBSTRATE HAVING THE STRUCTURE 有权
    制造具有结构的导电跟踪结构和基底

    公开(公告)号：US20140374141A1

    公开(公告)日：2014-12-25

    申请号：US14345352

    申请日：2012-11-27

    Applicant: Taiwan Green Point Enterprises Co., Ltd. ,  Jabil Circuit Inc.

    Inventor： Sheng-Hung Yi ,  Pen-Yi Liao ,  Min-Hsiang Chen

    IPC: H05K3/02 ,  H05K3/18 ,  H05K1/02

    CPC classification number: H05K1/09 ,  H05K1/0296 ,  H05K3/027 ,  H05K3/182 ,  H05K3/188 ,  H05K3/242 ,  H05K3/243 ,  H05K3/381 ,  H05K2201/0116 ,  H05K2203/0723 ,  H05K2203/107 ,  H05K2203/108 ,  H05K2203/175

    Abstract: A method for fabricating a conductive trace structure includes the steps: forming a first metal layer on a non-conductive substrate; removing a part of the first metal layer to expose the non-conductive substrate so as to form the first metal layer into a plating region and a non-plating region, the plating region being divided into at least two trace-forming portions and at least one bridge portion; forming a second metal layer on the plating region by electroplating the plating region using one of the trace-forming portions and the bridge portion as an electrode; and removing the bridge portion and the second metal layer formed on the bridge portion.

    Abstract translation: 制造导电迹线结构的方法包括以下步骤：在非导电衬底上形成第一金属层; 去除所述第一金属层的一部分以暴露所述非导电基板，以便将所述第一金属层形成为电镀区域和非电镀区域，所述电镀区域被划分为至少两个迹线形成部分和至少 一个桥梁部分; 通过使用所述迹线形成部分和所述桥接部分之一通过电镀所述电镀区域作为电极在所述电镀区域上形成第二金属层; 以及去除桥接部分上形成的桥接部分和第二金属层。

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