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    Method for producing comb-shaped electrode
    1.
    发明授权
    Method for producing comb-shaped electrode 有权
    梳状电极的制造方法

    公开(公告)号：US08389204B2

    公开(公告)日：2013-03-05

    申请号：US13085336

    申请日：2011-04-12

    申请人： Takahiro Asai ,  Koichi Misumi ,  Takashi Ono ,  Kiyoshi Kanamura ,  Hirokazu Munakata

    发明人： Takahiro Asai ,  Koichi Misumi ,  Takashi Ono ,  Kiyoshi Kanamura ,  Hirokazu Munakata

    IPC分类号： G03F7/26

    CPC分类号： H01M4/0457 ,  C25D3/60 ,  C25D13/02 ,  G03F7/023 ,  G03F7/027 ,  G03F7/038 ,  G03F7/0392 ,  H01M4/0452 ,  H01M4/13 ,  H01M4/626 ,  H01M4/78 ,  H01M2004/025

    摘要： To provide a method for producing a comb-shaped electrode capable of precisely carrying a large amount of active materials on a surface of current collectors with a fine shape. The method for producing comb-shaped electrodes 1a, 1b of the present invention includes a current collector forming step of forming a pair of comb-shaped current collectors 2a, 2b on a surface of a substrate 4, a resist coating step of forming a resist layer 6 on the surface of the substrate 4, and a guide hole forming step of forming guide holes 7a, 7b for forming a positive electrode 1a or a negative electrode 1b, in which a cationic polymerization type resist composition (i), a novolak type resist composition (ii), a chemically-amplified type resist composition (iii), or a radical polymerization type resist composition (iv), is used as a resist composition for forming the resist layer 6.

    摘要翻译： 提供一种能够在精细形状的集电体的表面上精确地携带大量活性物质的梳状电极的制造方法。 本发明的梳状电极1a，1b的制造方法包括在基板4的表面上形成一对梳状集电体2a，2b的集电体形成工序，形成抗蚀剂的抗蚀剂涂布工序 以及导向孔形成步骤，形成用于形成阳极聚合型抗蚀剂组合物（i）的酚醛清漆型的正极1a或负极1b的导向孔7a，7b， 抗蚀剂组合物（ii），化学增幅型抗蚀剂组合物（iii）或自由基聚合型抗蚀剂组合物（iv））用作形成抗蚀剂层6的抗蚀剂组合物。

    Adhesive composition and adhesive film
    2.
    发明授权
    Adhesive composition and adhesive film 有权
    粘合剂组合物和粘合剂膜

    公开(公告)号：US08426543B2

    公开(公告)日：2013-04-23

    申请号：US12516363

    申请日：2007-09-27

    申请人： Takahiro Asai ,  Koichi Misumi ,  Atsushi Miyanari ,  Yoshihiro Inao ,  Akihiko Nakamura

    发明人： Takahiro Asai ,  Koichi Misumi ,  Atsushi Miyanari ,  Yoshihiro Inao ,  Akihiko Nakamura

    IPC分类号： C08F20/10

    CPC分类号： C09J133/04 ,  C09J7/381 ,  C09J125/14 ,  C09J135/06 ,  C09J2203/326 ,  C09J2205/114 ,  C09J2425/00 ,  C09J2433/00 ,  H01L21/6835 ,  H01L2221/6834 ,  H01L2924/30105 ,  Y10T428/2852 ,  Y10T428/2891

    摘要： An adhesive composition of the present invention includes, as a main component, a polymer produced by copolymerization of a monomer composition including: styrene; a (meth)acrylic acid alkyl ester having a chain structure; a (meth)acrylic acid ester having an aliphatic ring; and a (meth)acrylic acid ester having an aromatic ring, wherein: the styrene is contained in a range of 40 to 69 parts by mass; the (meth)acrylic acid alkyl ester having the chain structure is contained in a range of 20 to 30 parts by mass; the (meth)acrylic acid ester having the aliphatic ring is contained in a range of 10 to 25 parts by mass; and the (meth)acrylic acid ester having the aromatic ring is contained in a range of 1 to 5 parts by mass, where the total amount of the above components is 100 parts by mass. This allows for provision of an adhesive composition having high adhesive strength under high-temperature environment, as well as high heat resistance, high alkali resistance, and easiness in stripping from semiconductor wafers and the like even after high-temperature processing.

    摘要翻译： 作为主要成分，本发明的粘合剂组合物包含通过使包含苯乙烯的单体组合物共聚而制造的聚合物， 具有链结构的（甲基）丙烯酸烷基酯; 具有脂肪族环的（甲基）丙烯酸酯; 和具有芳香环的（甲基）丙烯酸酯，其中：所述苯乙烯的含量为40〜69质量份; 具有链结构的（甲基）丙烯酸烷基酯的含量为20〜30质量份; 具有脂肪族环的（甲基）丙烯酸酯的含量为10〜25质量份; 具有芳环的（甲基）丙烯酸酯的含量为1〜5质量份，上述成分的总量为100质量份。 这允许在高温环境下提供具有高粘合强度的粘合剂组合物，以及即使在高温处理之后也具有高耐热性，高耐碱性和从半导体晶片等剥离的容易性。

    Adhesive composition and adhesive film
    3.
    发明申请
    Adhesive composition and adhesive film 审中-公开
    粘合剂组合物和粘合剂膜

    公开(公告)号：US20110065858A1

    公开(公告)日：2011-03-17

    申请号：US12924583

    申请日：2010-09-29

    申请人： Takahiro Asai ,  Koichi Misumi ,  Toshiyuki Ogata ,  Motoki Takahashi ,  Hirofumi Imai

    发明人： Takahiro Asai ,  Koichi Misumi ,  Toshiyuki Ogata ,  Motoki Takahashi ,  Hirofumi Imai

    IPC分类号： C09J133/24

    CPC分类号： C09J133/064

    摘要： An adhesive composition of the present invention includes a polymer as a main component. The polymer is produced by copolymerization of a monomer composition which includes chain-structured alkyl (meth)acrylate and a monomer containing a maleimide group. This makes it possible to provide an adhesive composition used for forming an adhesive layer in which adhesive strength is kept in a high temperature environment. That is, it becomes possible to provide an adhesive composition that allows forming an adhesive layer which has high adhesive strength in a high temperature environment (particularly at 200° C. to 250° C.).

    摘要翻译： 本发明的粘合剂组合物包括聚合物作为主要成分。 聚合物通过包含链状结构的（甲基）丙烯酸烷基酯和含有马来酰亚胺基团的单体的单体组合物的共聚来制备。 这使得可以提供用于形成粘合剂层的粘合剂组合物，其中粘合强度保持在高温环境中。 也就是说，可以提供一种粘合剂组合物，其可以在高温环境（特别是在200℃至250℃）下形成具有高粘合强度的粘合剂层。

    ADHESIVE COMPOSITION, FILM ADHESIVE, AND PROCESS FOR PRODUCTION OF THE COMPOSITION
    6.
    发明申请
    ADHESIVE COMPOSITION, FILM ADHESIVE, AND PROCESS FOR PRODUCTION OF THE COMPOSITION 审中-公开
    胶粘组合物，胶粘剂和组合物的生产方法

    公开(公告)号：US20100178497A1

    公开(公告)日：2010-07-15

    申请号：US12377155

    申请日：2007-08-03

    申请人： Takahiro Asai ,  Koichi Misumi ,  Atsushi Miyanari ,  Yoshihiro Inao ,  Akihiko Nakamura ,  Koji Saito

    发明人： Takahiro Asai ,  Koichi Misumi ,  Atsushi Miyanari ,  Yoshihiro Inao ,  Akihiko Nakamura ,  Koji Saito

    IPC分类号： C08F120/18 ,  B32B27/36 ,  B32B27/32

    CPC分类号： C09J133/10 ,  C09J7/381 ,  C09J125/14 ,  C09J2425/00 ,  C09J2433/00 ,  Y10T428/2891

    摘要： Disclosed is an adhesive composition which is mainly composed of a polymer obtained by copolymerizing a monomer composition containing styrene, (meth)acrylic acid ester having a cyclic structure and alkyl (meth)acrylate having a chain structure. The monomer composition may additionally contain a bifunctional monomer, thereby improving heat resistance, adhesive strength under high temperature conditions, and alkali resistance, and easiness in stripping of an adhesive composition that has been processed at a high temperature. Consequently, there can be obtained an adhesive composition which has high heat resistance, adhesion strength under high temperature conditions, and alkali resistance, and which can be easily stripped off after the adhesive composition is processed at a high temperature.

    摘要翻译： 公开了主要由通过共聚包含苯乙烯的单体组合物，具有环状结构的（甲基）丙烯酸酯和具有链结构的（甲基）丙烯酸烷基酯）而得到的聚合物的粘合剂组合物。 单体组合物可以另外含有双官能单体，从而提高耐热性，高温条件下的粘合强度和耐碱性，以及在高温下处理的粘合剂组合物的剥离容易性。 因此，可以获得在高温条件下具有高耐热性，粘合强度和耐碱性的粘合剂组合物，并且在粘合剂组合物在高温下加工后可以容易地剥离。

    ADHESIVE COMPOSITION AND ADHESIVE FILM
    7.
    发明申请
    ADHESIVE COMPOSITION AND ADHESIVE FILM 有权
    胶粘组合物和粘合膜

    公开(公告)号：US20100069593A1

    公开(公告)日：2010-03-18

    申请号：US12516363

    申请日：2007-09-27

    申请人： Takahiro Asai ,  Koichi Misumi ,  Atsushi Miyanari ,  Yoshihiro Inao ,  Akihiko Nakamura

    发明人： Takahiro Asai ,  Koichi Misumi ,  Atsushi Miyanari ,  Yoshihiro Inao ,  Akihiko Nakamura

    IPC分类号： C08F18/02

    CPC分类号： C09J133/04 ,  C09J7/381 ,  C09J125/14 ,  C09J135/06 ,  C09J2203/326 ,  C09J2205/114 ,  C09J2425/00 ,  C09J2433/00 ,  H01L21/6835 ,  H01L2221/6834 ,  H01L2924/30105 ,  Y10T428/2852 ,  Y10T428/2891

    摘要： An adhesive composition of the present invention includes, as a main component, a polymer produced by copolymerization of a monomer composition including: styrene; a (meth)acrylic acid alkyl ester having a chain structure; a (meth)acrylic acid ester having an aliphatic ring; and a (meth)acrylic acid ester having an aromatic ring, wherein: the styrene is contained in a range of 40 to 69 parts by mass; the (meth)acrylic acid alkyl ester having the chain structure is contained in a range of 20 to 30 parts by mass; the (meth)acrylic acid ester having the aliphatic ring is contained in a range of 10 to 25 parts by mass; and the (meth)acrylic acid ester having the aromatic ring is contained in a range of 1 to 5 parts by mass, where the total amount of the above components is 100 parts by mass. This allows for provision of an adhesive composition having high adhesive strength under high-temperature environment, as well as high heat resistance, high alkali resistance, and easiness in stripping from semiconductor wafers and the like even after high-temperature processing.

    摘要翻译： 作为主要成分，本发明的粘合剂组合物包含通过使包含苯乙烯的单体组合物共聚而制造的聚合物， 具有链结构的（甲基）丙烯酸烷基酯; 具有脂肪族环的（甲基）丙烯酸酯; 和具有芳香环的（甲基）丙烯酸酯，其中：所述苯乙烯的含量为40〜69质量份; 具有链结构的（甲基）丙烯酸烷基酯的含量为20〜30质量份; 具有脂肪族环的（甲基）丙烯酸酯的含量为10〜25质量份; 具有芳环的（甲基）丙烯酸酯的含量为1〜5质量份，上述成分的总量为100质量份。 这允许在高温环境下提供具有高粘合强度的粘合剂组合物，以及即使在高温处理之后也具有高耐热性，高耐碱性和从半导体晶片等剥离的容易性。

    METHOD FOR PRODUCING PROCESSED GLASS SUBSTRATE
    8.
    发明申请
    METHOD FOR PRODUCING PROCESSED GLASS SUBSTRATE 审中-公开
    生产加工玻璃基板的方法

    公开(公告)号：US20100068453A1

    公开(公告)日：2010-03-18

    申请号：US12558850

    申请日：2009-09-14

    申请人： Hirofumi IMAI ,  Koichi Misumi ,  Takahiro Asai

    发明人： Hirofumi IMAI ,  Koichi Misumi ,  Takahiro Asai

    IPC分类号： B32B3/24 ,  C03C19/00 ,  C03C15/00 ,  G03F7/20

    CPC分类号： G03F7/2022 ,  C03C15/00 ,  C03C19/00 ,  C03C2218/34 ,  Y10T428/24273

    摘要： A processed substrate of the present invention includes a translucent substrate having a plurality of through-holes, in each of which there is a gap from 0 to 5 μm between (a) a straight line which passes through a central point of an opening plane of the each of the plurality of through-holes and which is perpendicular to the opening plane and (b) a straight line which passes through a central point of the other opening plane of the each of the plurality of through-holes and which is perpendicular to the other opening plane, thereby making it possible to provide (i) a processed substrate having through-holes in each of which central axes are aligned, which can be easily produced with high productivity, and (ii) a production method thereof. Further, a production method of the present invention of a processed glass substrate includes: (a) forming photosensitive resin layers on surfaces of a glass substrate; (b) forming a through-hole in the glass substrate; and (c) immersing the glass substrate in acid, with the photosensitive resin layers remaining on the both surfaces. Accordingly, it is unnecessary to perform smoothing the surfaces of the glass substrate after the step (c), thereby successfully producing a processed glass substrate having a through-hole with high productivity.

    摘要翻译： 本发明的处理衬底包括具有多个通孔的透光性衬底，每个通孔在（a）穿过开口平面的中心点的直线之间存在0至5μm的间隙 所述多个通孔中的每一个并且垂直于所述开口平面，并且（b）直线，其穿过所述多个通孔中的每一个的另一开口平面的中心点并且垂直于 从而能够提供（i）具有通孔的处理基板，其中每个中心轴对准，其可以容易地以高生产率生产，和（ii）其制造方法。 此外，本发明的加工玻璃基板的制造方法包括：（a）在玻璃基板的表面上形成感光性树脂层; （b）在玻璃基板中形成通孔; 和（c）将玻璃基板浸入酸中，其中感光性树脂层保留在两面上。 因此，不需要在步骤（c）之后对玻璃基板的表面进行平滑化，从而以高生产率成功制造具有通孔的加工玻璃基板。