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    Heat sinks and semiconductor cooling device using the heat sinks
    1.
    发明授权
    Heat sinks and semiconductor cooling device using the heat sinks 失效
    散热片和使用散热片的半导体冷却装置

    公开(公告)号：US5365400A

    公开(公告)日：1994-11-15

    申请号：US771777

    申请日：1991-10-04

    申请人： Noriyuki Ashiwake ,  Takahiro Daikoku ,  Toshio Hatsuda ,  Shizuo Zushi ,  Satomi Kobayashi

    发明人： Noriyuki Ashiwake ,  Takahiro Daikoku ,  Toshio Hatsuda ,  Shizuo Zushi ,  Satomi Kobayashi

    IPC分类号： H01L23/433 ,  H01L23/473 ,  H01L25/065 ,  H05K7/20

    CPC分类号： H01L23/433 ,  H01L23/4735 ,  H01L25/0655 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/01014 ,  H01L2924/15312 ,  H01L2924/16152 ,  Y10S165/908

    摘要： Disclosed are heat sinks particularly effective in cooling semiconductors of a high heat dissipating density and including a multiplicity of tabular fins laminated via spacers and having through-holes pierced in their central parts, the holes admitting introduction of cooling fluids which radially flow in between the fins. The cooling fluids are supplied to the respective heat sinks attached to the multiplicity of semiconductors mounted on a board. In a specific form of the invention, the semiconductor cooling device has a heat sink provided with parallel tabular internal fins and a cooling fluid nozzle having an elongated opening substantially orthogonal to the fins, the nozzle being disposed to span over the parallel tabular fins substantially at longitudinal mid portions of these fins, so that the cooling fluid is evenly distributed from the mid portions of the fins to both longitudinal ends of the fins.

    摘要翻译： 公开了散热器在散热密度高的冷却半导体中特别有效，并且包括通过间隔件层叠的多个片状翅片，并且在其中心部分中穿透通孔，允许在散热片之间径向流动的冷却流体的引入 。 冷却流体被供应到附接到安装在板上的多个半导体的各个散热器。 在本发明的具体形式中，半导体冷却装置具有设置有平行的片状内部散热片的散热器和具有与散热片基本正交的细长开口的冷却流体喷嘴，该喷嘴设置成跨越平行板状翅片， 这些翅片的纵向中间部分，使得冷却流体从翼片的中部均匀地分布到翅片的两个纵向端部。

    Semiconductor module
    2.
    发明授权
    Semiconductor module 失效
    半导体模块

    公开(公告)号：US5089936A

    公开(公告)日：1992-02-18

    申请号：US404341

    申请日：1989-09-07

    申请人： Hiroyuki Kojima ,  Toshio Hatsuda ,  Takahiro Daikoku ,  Shizuo Zushi ,  Fumiyuki Kobayashi

    发明人： Hiroyuki Kojima ,  Toshio Hatsuda ,  Takahiro Daikoku ,  Shizuo Zushi ,  Fumiyuki Kobayashi

    IPC分类号： H01L23/40 ,  H01L23/473

    CPC分类号： H01L23/473 ,  H01L23/4006 ,  H01L2023/4043 ,  H01L2023/4062 ,  H01L2023/4081 ,  H01L2224/16225 ,  H01L2224/73253

    摘要： In a semiconductor module including a wiring substrate having one or a plurality of semiconductor devices electrically connected thereon, a housing constituted of a sealing frame and a ceiling board to enclose the semiconductor devices therein, and a cooling jacket to cool the semiconductor devices. The semiconductor module comprises an elastic arm placed on the cooling jacket for exerting pressure to cause the cooling jacket to be uniformly contacted with the housing ceiling board, and clamping jigs press the cooling jacket and the ceiling board through the elastic arm, so that the clamping jigs may serve to press the respective intermediate positions of the four sides of the cooling jacket through the elastic arm, or screw fasteners may be provided on the elastic arm for controlling the displacements and pressing force.

    摘要翻译： 在包括具有电连接在其上的一个或多个半导体器件的布线基板的半导体模块中，由密封框架和顶板组成的壳体以封装其中的半导体器件，以及用于冷却半导体器件的冷却套。 半导体模块包括放置在冷却套上的弹性臂，用于施加压力以使冷却套与壳体天花板均匀地接触，并且夹具通过弹性臂挤压冷却套和顶板，使得夹紧 夹具可以用于通过弹性臂挤压冷却套的四个侧面的相应中间位置，或者可以在弹性臂上设置螺钉紧固件以控制位移和按压力。