公开(公告)号：US20110061923A1

公开(公告)日：2011-03-17

申请号：US12736803

申请日：2009-04-24

申请人： Takahiro Nonaka ,  Noritsugu Daigaku ,  Masahiro Ooura

发明人： Takahiro Nonaka ,  Noritsugu Daigaku ,  Masahiro Ooura

IPC分类号： H05K1/02 ,  B32B7/12

CPC分类号： H05K3/0061 ,  C09J7/21 ,  C09J2201/128 ,  C09J2400/263 ,  H05K1/0393 ,  H05K3/386 ,  H05K2203/0191 ,  Y10T428/265

摘要： A double-sided pressure-sensitive adhesive tape includes a nonwoven fabric substrate and pressure-sensitive adhesive layers present on both sides of the substrate, in which the nonwoven fabric substrate contains at least Manila hemp, has a thickness of 18 μm or less, and has a tensile strength in a machine direction of 4 N/15 mm or more. The double-sided pressure-sensitive adhesive tape is thin and is effective for the reduction in size and thickness of products to be fixed through the tape. The tape has a high strength in the machine direction and does not break during production and processing processes. In addition, the tape has a nonwoven fabric substrate and thereby excels also in punching quality. The tape is therefore particularly useful as a double-sided pressure-sensitive adhesive tape for fixing a wiring circuit board.

摘要翻译： 双面压敏粘合带包括无纺布基材和存在于基材两侧的压敏粘合剂层，其中非织造织物基材至少含有马尼拉麻，厚度为18μm以下，和 在纵向的拉伸强度为4N / 15mm以上。 双面压敏粘合带薄，对于通过带固定的产品的尺寸和厚度的减小是有效的。 胶带在机器方向上具有高强度，在生产和加工过程中不会破裂。 此外，胶带具有非织造织物基材，从而在冲压质量上也优异。 因此，胶带作为用于固定布线电路板的双面压敏胶粘带是特别有用的。

公开(公告)号：US20100124627A1

公开(公告)日：2010-05-20

申请号：US12452734

申请日：2008-08-20

申请人： Takahiro Nonaka ,  Noritsugu Daigaku ,  Masahiro Ooura

发明人： Takahiro Nonaka ,  Noritsugu Daigaku ,  Masahiro Ooura

IPC分类号： C09J7/02 ,  B32B33/00

CPC分类号： C09D123/0815 ,  C08F2220/1825 ,  C08K5/0025 ,  C08L23/16 ,  C08L63/00 ,  C08L2666/16 ,  C09J7/385 ,  C09J133/066 ,  C09J2201/128 ,  C09J2201/606 ,  C09J2205/102 ,  Y10T428/1476 ,  C08L2666/06 ,  C08F220/06 ,  C08F2220/281

摘要： Disclosed is a double-coated pressure-sensitive adhesive sheet adopted to fix a hard disk drive component, which includes a pressure-sensitive adhesive unit including a plastic film base having a thickness of 20 μm or less and pressure-sensitive adhesive layers arranged on or above both sides of the plastic film base; and non-silicone release liners arranged on both surfaces of the pressure-sensitive adhesive unit. The pressure-sensitive adhesive unit has a thickness of 60 μm or less, and the double-coated pressure-sensitive adhesive sheet shows an outgassing of 1 μg/cm2 or less when the double-coated pressure-sensitive adhesive sheet is heated at a temperature of 120° C. for 10 minutes. The double-coated pressure-sensitive adhesive sheet is free from silicone, thereby causes less contamination, evolves less outgas, and is superior in workability. It has further improved followability to difference in level by controlling the thickness of the plastic film base to 13 μm or less. Additionally, it becomes resistant to “lifting” from an adherend even when subjected to a heating process after affixation, by specifying the gel fraction of the pressure-sensitive adhesive layer within a range of 10% to 60%.

摘要翻译： 公开了一种用于固定硬盘驱动部件的双面压敏粘合片，其包括具有厚度为20μm或更小的塑料膜基底的压敏粘合单元和布置在其上的压敏粘合剂层 塑料薄膜底座两侧; 以及布置在压敏粘合剂单元的两个表面上的非硅氧烷剥离衬垫。 压敏粘合剂单元的厚度为60μm以下，当双面压敏粘合片在温度加热时，双面压敏粘合片的脱气量为1μg/ cm 2以下 120℃下10分钟。 双面压敏粘合片不含有机硅，因此污染少，排出量少，加工性优异。 通过将塑料膜基材的厚度控制在13μm以下，进一步提高了水平差的追随性。 此外，即使在固定后进行加热处理，也可以通过将粘合剂层的凝胶分数规定在10〜60％的范围内，从被粘物“提升”。

公开(公告)号：US20100209649A1

公开(公告)日：2010-08-19

申请号：US12656802

申请日：2010-02-17

申请人： Rie Kuwahara ,  Takahiro Nonaka ,  Noritsugu Daigaku ,  Masahiro Oura

发明人： Rie Kuwahara ,  Takahiro Nonaka ,  Noritsugu Daigaku ,  Masahiro Oura

IPC分类号： B32B27/32 ,  B32B33/00

CPC分类号： C09J133/06 ,  B32B7/06 ,  B32B7/12 ,  B32B27/08 ,  B32B27/16 ,  B32B27/281 ,  B32B27/285 ,  B32B27/286 ,  B32B27/288 ,  B32B27/304 ,  B32B27/306 ,  B32B27/308 ,  B32B27/32 ,  B32B27/322 ,  B32B27/34 ,  B32B27/36 ,  B32B2250/24 ,  B32B2255/10 ,  B32B2255/26 ,  B32B2405/00 ,  B32B2457/00 ,  B32B2457/08 ,  C09J7/22 ,  C09J7/385 ,  C09J2201/128 ,  C09J2201/606 ,  C09J2203/326 ,  C09J2433/00 ,  H01L21/6835 ,  H05K3/0058 ,  Y10T428/14 ,  Y10T428/1452

摘要： Disclosed is a double-coated pressure-sensitive adhesive sheet which includes at least a pressure-sensitive adhesive unit including a plastic base film and, present on or above both surfaces thereof, pressure-sensitive adhesive layers; and non-silicone release liners present on both surfaces of the pressure-sensitive adhesive unit. The pressure-sensitive adhesive layers are each formed from an acrylic polymer containing, as essential monomer components, an alkyl (meth)acrylate whose alkyl moiety being a linear or branched-chain alkyl group having 2 to 14 carbon atoms and a polar-group-containing monomer. The pressure-sensitive adhesive unit has a thickness of 60 to 160 μm, and each of the two pressure-sensitive adhesive layers of the pressure-sensitive adhesive unit has a thickness of 20 μm or more. The adhesive sheet excels in processability and fittability around bumps and is usable for fixing a flexible printed circuit board or for fixing a hard disk drive component.

摘要翻译： 公开了一种双面压敏粘合片，其至少包括含有塑料基膜的压敏粘合剂单元，并且在其两面上存在压敏粘合剂层; 和存在于压敏粘合剂单元的两个表面上的非硅氧烷剥离衬垫。 压敏粘合剂层各自由丙烯酸类聚合物形成，所述丙烯酸类聚合物含有作为必需单体成分的烷基部分为碳原子数为2〜14的直链或支链烷基和极性基团的烷基（甲基）丙烯酸烷基酯， 含有单体。 压敏粘合剂单元具有60至160μm的厚度，并且压敏粘合单元的两个压敏粘合剂层中的每一个具有20μm以上的厚度。 粘合片在凸起附近的加工性和适配性优异，并且可用于固定柔性印刷电路板或固定硬盘驱动部件。

公开(公告)号：US20080248231A1

公开(公告)日：2008-10-09

申请号：US12100207

申请日：2008-04-09

申请人： Noritsugu Daigaku ,  Takahiro Nonaka ,  Masahiro Oura

发明人： Noritsugu Daigaku ,  Takahiro Nonaka ,  Masahiro Oura

IPC分类号： B32B33/00 ,  H05K1/02

CPC分类号： H05K3/0061 ,  C08L23/20 ,  C08L93/00 ,  C08L99/00 ,  C08L2666/26 ,  C09J7/10 ,  C09J7/21 ,  C09J7/38 ,  C09J11/08 ,  C09J133/04 ,  C09J2201/128 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2400/263 ,  C09J2433/00 ,  H05K1/0393 ,  H05K3/386 ,  H05K2203/0191 ,  Y10T428/1476

摘要： The present invention relates to a double-sided pressure-sensitive adhesive tape or sheet for use in a wiring circuit board, which includes a pressure-sensitive adhesive layer formed of a pressure-sensitive adhesive composition comprising an acrylic polymer and a tackifier resin containing a phenolic hydroxyl group; and a release liner comprising a releasing treatment layer formed of a silicone release agent. The double-sided pressure-sensitive adhesive tape or sheet of the invention has a good adhesiveness and, even after a high-temperature step, it is capable of exerting an excellent anti-repulsion property. Further, since the release liner can be easily peeled off even after the high-temperature step, the workability is excellent and the productivity is improved.

摘要翻译： 本发明涉及一种用于布线电路板的双面压敏粘合带或片，其包括由包含丙烯酸类聚合物和增粘树脂的压敏粘合剂组合物形成的压敏粘合剂层，所述粘合剂组合物含有 酚羟基; 以及包含由有机硅脱模剂形成的脱模处理层的剥离衬垫。 本发明的双面压敏粘合带或粘合带具有良好的粘合性，即使在高温阶段之后也能发挥优异的抗排斥性。 此外，由于即使在高温阶段之后剥离衬垫也能够容易地剥离，所以可加工性优异，生产率提高。

公开(公告)号：US20130004767A1

公开(公告)日：2013-01-03

申请号：US13581658

申请日：2011-02-28

申请人： Noritsugu Daigaku ,  Kota Nakao ,  Ai Murakami ,  Takahiro Nonaka ,  Hironori Tamai ,  Yasushi Buzoujima ,  Shinya Nakano ,  Shinatarou Taira ,  Tetsuya Otsuka

发明人： Noritsugu Daigaku ,  Kota Nakao ,  Ai Murakami ,  Takahiro Nonaka ,  Hironori Tamai ,  Yasushi Buzoujima ,  Shinya Nakano ,  Shinatarou Taira ,  Tetsuya Otsuka

IPC分类号： C09J7/02

CPC分类号： C09J7/28 ,  C09J2201/20 ,  C09J2201/606 ,  C09J2203/326 ,  Y10T428/2804

摘要： Provided is an electroconductive pressure-sensitive adhesive tape which can exhibit stable electrical conductivity even when used over a long duration and/or used under severe environmental conditions. The electroconductive pressure-sensitive adhesive tape has a metallic foil and, on one side thereof, a pressure-sensitive adhesive layer, in which the electroconductive pressure-sensitive adhesive tape has a maximum resistance in the first cycle of 1 Ω or less and has a maximum resistance in the 200th cycle being 5 times or less the maximum resistance in the first cycle, as measured in a thermo-cycle test.

摘要翻译： 提供一种即使在长时间使用和/或在恶劣的环境条件下使用也能够表现出稳定的导电性的导电粘合带。 导电性粘合带具有金属箔，并且在其一面上具有导电粘合带，其中导电粘合带在第一次循环中具有最大电阻1＆OHgr; 并且在第200次循环中的最大电阻值是在热循环试验中测定的第一次循环中的最大电阻的5倍以下。

公开(公告)号：US20120055700A1

公开(公告)日：2012-03-08

申请号：US13223509

申请日：2011-09-01

申请人： Hakaru Horiguchi ,  Noritsugu Daigaku ,  Takahiro Nonaka ,  Rie Kuwahara

发明人： Hakaru Horiguchi ,  Noritsugu Daigaku ,  Takahiro Nonaka ,  Rie Kuwahara

IPC分类号： H05K1/02 ,  B32B7/10

CPC分类号： C09J133/02 ,  C09J7/385 ,  C09J2201/128 ,  C09J2203/326 ,  Y10T428/2848

摘要： Provided is a double-sided pressure-sensitive adhesive tape for fixing a flexible printed circuit board superior in adhesive power after bonding under low pressure and also in repelling resistance after processing in high-temperature steps. The double sided pressure-sensitive adhesive tape for fixing a flexible printed circuit board according to the present invention has a 180° peel adhesion, as determined by bonding the adhesive tape onto a stainless steel plate under pressure by one reciprocation of a 10-g roller, leaving it still for 5 minutes and measuring it at a tensile speed of 300 mm/minute, of 6.5 N/20 mm or more and a terminal separation distance after reflow of 2.5 mm or less.

摘要翻译： 提供一种双面粘合带，用于固定在低压下粘合之后具有优异的粘合力的柔性印刷电路板，以及在高温步骤处理之后的排斥电阻。 根据本发明的用于固定柔性印刷电路板的双面压敏粘合带具有180°的剥离粘合力，这通过将粘合带通过10g辊的一个往复运动在压力下粘合到不锈钢板上而​​确定 将其静置5分钟，以300mm /分钟的拉伸速度测定为6.5N / 20mm以上，回流后的终端间隔距离为2.5mm以下。

公开(公告)号：US20100183872A1

公开(公告)日：2010-07-22

申请号：US12654892

申请日：2010-01-07

申请人： Takahiro Nonaka ,  Noritsugu Daigaku ,  Masahiro Oura

发明人： Takahiro Nonaka ,  Noritsugu Daigaku ,  Masahiro Oura

IPC分类号： B32B9/04 ,  B32B23/00

CPC分类号： C09J133/066 ,  C09J7/22 ,  C09J7/38 ,  C09J2201/128 ,  C09J2201/606 ,  C09J2203/326 ,  C09J2433/00 ,  H01L2924/00013 ,  H05K1/0393 ,  H05K3/0058 ,  H05K3/386 ,  H05K2203/0191 ,  Y10T428/265 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599

摘要： Disclosed is a double-coated pressure-sensitive adhesive sheet for fixing a flexible printed circuit board, which includes at least a pressure-sensitive adhesive unit including a plastic base film having a thickness of 13 μm or less, and pressure-sensitive adhesive layers on both sides of the plastic base film. The pressure-sensitive adhesive layers are formed from an acrylic polymer containing, as essential monomer components, a polar-group-containing monomer and an alkyl (meth)acrylate whose alkyl moiety being a linear or branched-chain alkyl group having 2 to 14 carbon atoms. The pressure-sensitive adhesive unit has a thickness of 60 μm or less, the double-coated pressure-sensitive adhesive sheet shows an outgassing of 1 μg/cm2 or less when heated at 120° C. for 10 minutes, and shows a split distance (lifting) of 1.5 mm or less.

摘要翻译： 公开了一种用于固定柔性印刷电路板的双面压敏粘合片，其包括至少包括具有13μm或更小厚度的塑料基膜的压敏粘合剂单元和压敏粘合剂层 塑料底片两侧。 压敏粘合剂层由含有极性基团的单体和烷基部分为具有2〜14个碳原子的直链或支链烷基的（甲基）丙烯酸烷基酯作为必需单体成分的丙烯酸类聚合物形成， 原子 压敏粘合剂单元的厚度为60μm以下时，在120℃下加热10分钟时，双面粘合片的脱气量为1μg/ cm 2以下，显示出分割距离 （提升）为1.5mm以下。

公开(公告)号：US20120111612A1

公开(公告)日：2012-05-10

申请号：US13382377

申请日：2010-06-23

申请人： Rie Kuwahara ,  Masahiro Oura ,  Takahiro Nonaka ,  Noritsugu Daigaku

发明人： Rie Kuwahara ,  Masahiro Oura ,  Takahiro Nonaka ,  Noritsugu Daigaku

IPC分类号： H05K1/00 ,  C09J133/08 ,  C08F220/10

CPC分类号： C09J161/14 ,  C08G8/36 ,  C08L33/08 ,  C08L61/14 ,  C09J7/10 ,  C09J2201/622 ,  C09J2203/326 ,  C09J2433/00 ,  C09J2461/00 ,  H01L2924/00013 ,  H05K3/386 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599

摘要： The present invention provides a thermosetting adhesive tape or sheet having a thermosetting adhesive layer, which can be stored stably at room temperature, and, when thermally cured, can exert excellent adhesiveness and high thermal stability after exposure to heat and moist, because the resin in the adhesive rapidly reacts upon curing. The thermosetting adhesive tape or sheet according to the present invention includes a thermosetting adhesive layer which has a gel fraction of less than 70%, a difference in gel fraction between before and after storage at 40° C. for 7 days [(gel fraction after storage at 40° C. for 7 days)−(gel fraction before storage at 40° C. for 7 days)] of 15% or less, and a gel fraction after curing at 150° C. for 1 hour of 90% or more.

摘要翻译： 本发明提供一种具有热固性粘合剂层的热固性粘合带或片材，其可以在室温下稳定地储存，并且当热固化时，可以在暴露于热和潮湿之后发挥优异的粘合性和高的热稳定性，因为树脂在 粘合剂在固化时迅速反应。 根据本发明的热固性粘合带或片材包括凝胶分数低于70％的热固性粘合剂层，在40℃下保存7天之前的凝胶分数之间的凝胶分数差异[（凝胶分数 在40℃下保存7天） - （在40℃下储存7天的凝胶分数）]为15％以下，在150℃下固化1小时后的凝胶分数为90％或 更多。

公开(公告)号：US07927697B2

公开(公告)日：2011-04-19

申请号：US11783631

申请日：2007-04-11

申请人： Takahiro Nonaka ,  Miyoko Ikishima ,  Noritsugu Daigaku ,  Masahiro Oura ,  Masahiko Ando

发明人： Takahiro Nonaka ,  Miyoko Ikishima ,  Noritsugu Daigaku ,  Masahiro Oura ,  Masahiko Ando

IPC分类号： B32B7/12 ,  B32B27/30

CPC分类号： H05K3/007 ,  C09J7/21 ,  C09J7/38 ,  C09J7/385 ,  C09J2201/128 ,  C09J2203/326 ,  C09J2433/00 ,  H05K1/0393 ,  H05K2203/0152 ,  H05K2203/0191 ,  Y10T428/24917 ,  Y10T428/24926 ,  Y10T428/28 ,  Y10T428/2852 ,  Y10T428/2878 ,  Y10T428/2891

摘要： The present invention relates to a double-sided pressure-sensitive adhesive tape or sheet for wiring circuit board, which comprises a pressure-sensitive adhesive layer formed by a pressure-sensitive adhesive composition containing an acrylic polymer and a chain transfer substance, in which the pressure-sensitive adhesive layer has characteristics that a gel fraction in the initial stage is from 40 to 70% by weight, and a difference between a gel fraction (% by weight) of the pressure-sensitive adhesive layer after the following solder reflow step and the gel fraction (% by weight) of the pressure-sensitive adhesive layer in the initial stage is 10 or less. The solder reflow step satisfies the following heat treatment conditions. Surface temperature of the double-sided pressure-sensitive adhesive tape or sheet reaches 175±10° C. within 130 to 180 seconds, the surface temperature reaches 230±10° C. within 200 to 250 seconds, the surface temperature reaches 255±15° C. within 260 to 300 seconds and the solder reflow step finishes within 370 seconds after start of the solder reflow step for the double-sided pressure-sensitive adhesive tape or sheet.

摘要翻译： 本发明涉及一种用于布线电路板的双面压敏粘合带或片，其包括由含有丙烯酸类聚合物和链转移物质的压敏粘合剂组合物形成的压敏粘合剂层，其中 压敏粘合剂层具有以下特征：初始阶段的凝胶分数为40〜70重量％，以下的回流焊步骤后的粘合剂层的凝胶分数（重量％）与第 初始阶段的粘合剂层的凝胶分数（重量％）为10以下。 回流焊步骤满足以下热处理条件。 表面温度在130〜180秒内达到175±10℃，表面温度在200〜250秒内达到230±10℃，表面温度达到255±15℃ 在260〜300秒钟内，并且焊料回流步骤在对双面压敏粘合带或片材进行的焊料回流步骤开始后的370秒内完成。

公开(公告)号：US20070237949A1

公开(公告)日：2007-10-11

申请号：US11783631

申请日：2007-04-11

申请人： Takahiro Nonaka ,  Miyoko Ikishima ,  Noritsugu Daigaku ,  Masahiro Oura ,  Masahiko Ando

发明人： Takahiro Nonaka ,  Miyoko Ikishima ,  Noritsugu Daigaku ,  Masahiro Oura ,  Masahiko Ando

IPC分类号： B32B3/00 ,  B32B18/00 ,  B32B7/12

CPC分类号： H05K3/007 ,  C09J7/21 ,  C09J7/38 ,  C09J7/385 ,  C09J2201/128 ,  C09J2203/326 ,  C09J2433/00 ,  H05K1/0393 ,  H05K2203/0152 ,  H05K2203/0191 ,  Y10T428/24917 ,  Y10T428/24926 ,  Y10T428/28 ,  Y10T428/2852 ,  Y10T428/2878 ,  Y10T428/2891

摘要： The present invention relates to a double-sided pressure-sensitive adhesive tape or sheet for wiring circuit board, which comprises a pressure-sensitive adhesive layer formed by a pressure-sensitive adhesive composition containing an acrylic polymer and a chain transfer substance, in which the pressure-sensitive adhesive layer has characteristics that a gel fraction in the initial stage is from 40 to 70% by weight, and a difference between a gel fraction (% by weight) of the pressure-sensitive adhesive layer after the following solder reflow step and the gel fraction (% by weight) of the pressure-sensitive adhesive layer in the initial stage is 10 or less. The solder reflow step satisfies the following heat treatment conditions. Surface temperature of the double-sided pressure-sensitive adhesive tape or sheet reaches 175±10° C. within 130 to 180 seconds, the surface temperature reaches 230±10° C. within 200 to 250 seconds, the surface temperature reaches 255±15° C. within 260 to 300 seconds and the solder reflow step finishes within 370 seconds after start of the solder reflow step for the double-sided pressure-sensitive adhesive tape or sheet.

摘要翻译： 本发明涉及一种用于布线电路板的双面压敏粘合带或片，其包括由含有丙烯酸类聚合物和链转移物质的压敏粘合剂组合物形成的压敏粘合剂层，其中 压敏粘合剂层具有以下特征：初始阶段的凝胶分数为40〜70重量％，以下的回流焊步骤后的粘合剂层的凝胶分数（重量％）与第 初始阶段的粘合剂层的凝胶分数（重量％）为10以下。 回流焊步骤满足以下热处理条件。 表面温度在130〜180秒内达到175±10℃，表面温度在200〜250秒内达到230±10℃，表面温度达到255±15℃ 在260〜300秒钟内，并且焊料回流步骤在对双面压敏粘合带或片材进行的焊料回流步骤开始后的370秒内完成。