摘要:
A TFT array for a display device includes a plurality of spaced apart gate conductors and a plurality of spaced apart source conductors crossing over the gate conductors. TFT's are arranged in rows and columns. The gates of TFT's in each row are connected to a gate conductor for that row, and the sources of TFT's in each column are connected to a source conductor for that column. The drains of the TFT's are connected to respective pixel electrodes arranged in rows and columns. Each of a plurality of display sections has a storage capacitance connected at one end to an associated pixel electrode. Storage capacitance conductors are arranged parallel to respective gate conductors. Storage capacitors associated with the display sections in each row are connected to a storage capacitance conductor that is connected to the gate conductor of the next adjacent row.
摘要:
An improved method for manufacturing a liquid crystal display unit substantially free from gate electrode breakage but with no increase in the number of manufacturing steps over the conventional method. The liquid crystal display unit includes a TFT array substrate including a plurality of gate electrode lines juxtaposed on a transparent insulating substrate, a plurality of source electrode lines arranged across the gate electrode lines, nonlinear active elements disposed at the intersections of the electrode lines, a confronting electrode substrate having a transparent conductive film on the surface thereof confronting the TFT array substrate, and a liquid crystal display material being held between the confronting electrode substrate and the TFT array substrate. Each of the gate electrode lines is constructed in the form of two layers. One of the two layers is made of display electrode material simultaneously with the formation of the display electrode.
摘要:
A matrix-addressed type display device has display material sandwiched between two substrates facing each other, and a transparent pixel electrode disposed in matrix arrangement. The display device display characters by the application of a voltage selectively to the transparent pixel electrode by the use of a thin-film transistor. To improve display characteristics, an electric charge capacitor is provided in each pixel. This electric charge capacitor is connected to an adjacent gate electrode path and includes a transparent inner bottom electrode sandwiched between a dielectric substrate and a transparent pixel electrode. A transparent dielectric film is Interposed between the transparent pixel electrode and the transparent inner bottom electrode.
摘要:
A liquid crystal display device includes a transparent conductive film display electrode on a transparent insulating substrate, a plurality of lower layer source conductors disposed simultaneously with a plurality of gate electrode conductors on the substrate, the source conductors intersecting the gate electrode conductors, a gate insulation film on the gate electrode conductors, the lower layer source conductors, and the display electrode, a semiconductor film disposed on the gate insulation film at a position overlying the gate electrode conductors, a drain electrode connected to the display electrode and disposed on the semiconductor film and the gate insulation film, and an upper layer source electrode conductor connected to the lower layer source conductors, the upper layer source electrode conductor disposed on the gate insulation film and the semiconductor film and forming a double-layer structure with the lower layer source conductors.
摘要:
A thin film transistor device according to an embodiment of the invention includes: a thin film transistor having a silicon layer including a source region, a drain region, and a channel region, a gate insulating layer, and a gate electrode formed on an insulating substrate; an interlayer insulating layer covering the thin film transistor; a line electrically connected with the source region, the drain region, and the gate electrode through a contact hole formed in the interlayer insulating layer; a first upper insulating layer covering the line and the interlayer insulating layer and smoothing out stepped portions of the line and irregularities of a surface of the interlayer insulating layer; and a second upper insulating layer covering the first upper insulating layer, the second upper insulating layer having a hydrogen diffusion coefficient smaller than a hydrogen diffusion coefficient of the first upper insulating layer.
摘要:
A thin film transistor device according to an embodiment of the invention includes: a thin film transistor having a silicon layer including a source region, a drain region, and a channel region, a gate insulating layer, and a gate electrode formed on an insulating substrate; an interlayer insulating layer covering the thin film transistor; a line electrically connected with the source region, the drain region, and the gate electrode through a contact hole formed in the interlayer insulating layer; a first upper insulating layer covering the line and the interlayer insulating layer and smoothing out stepped portions of the line and irregularities of a surface of the interlayer insulating layer; and a second upper insulating layer covering the first upper insulating layer, the second upper insulating layer having a hydrogen diffusion coefficient smaller than a hydrogen diffusion coefficient of the first upper insulating layer.
摘要:
A first thin film transistor including a gate electrode, a source region, a drain region, a GOLD region, and a channel region is formed at a first region at a TFT array substrate. A second thin film transistor including a gate electrode, a source region, drain region, a GOLD region, and a channel region is formed at a second region. The GOLD length (0.5 μm) of the GOLD region of the second thin film transistor is set shorter than the GOLD length (1.5 μm) of the GOLD region of the first thin film transistor. Accordingly, a semiconductor device directed to reducing the area occupied by semiconductor elements is obtained.
摘要:
A first thin film transistor including a gate electrode, a source region, a drain region, a GOLD region, and a channel region is formed at a first region at a TFT array substrate. A second thin film transistor including a gate electrode, a source region, drain region, a GOLD region, and a channel region is formed at a second region. The GOLD length (0.5 μm) of the GOLD region of the second thin film transistor is set shorter than the GOLD length (1.5 μm) of the GOLD region of the first thin film transistor. Accordingly, a semiconductor device directed to reducing the area occupied by semiconductor elements is obtained.
摘要:
A silicon nitride film and a silicon oxide film are formed on a glass substrate. On the silicon oxide film is formed a thin film transistor including a source region, a drain region, a channel region having a predetermined channel length, a GOLD region and an LDD region having an impurity concentration lower than the impurity concentration of the source region, a GOLD region and an LDD region having an impurity concentration lower than the impurity concentration of the drain region, a gate insulation film, and a gate electrode. The gate electrode is formed overlapping with and facing the channel region and the GOLD region. A semiconductor device is obtained, directed to improving source-drain breakdown voltage and AC stress resistance, and achieving desired current property.
摘要:
It is an object to provide a technique to improve electric characteristics after a high-temperature treatment even when a high melting point metal barrier layer is not formed. A semiconductor device includes a gate electrode formed on a transparent insulation substrate, a semiconductor layer having a Si semiconductor active film and an ohmic low resistance Si film having an n-type conductivity, being formed in this order on the gate electrode with a gate insulation film interposed between the gate electrode and the semiconductor layer, and the source and drain electrodes directly connected to the semiconductor layer and containing at least aluminum (Al). At least nitrogen (N) is contained in a first region that is in the vicinity of an interface between a side surface of the SI semiconductor active film and the source and drain electrodes.