公开(公告)号：US4722823A

公开(公告)日：1988-02-02

申请号：US525889

申请日：1983-08-24

申请人： Takashi Honda ,  Toshio Kawakami ,  Masakiyo Izumiya ,  Akira Minato ,  Katsumi Ohsumi

发明人： Takashi Honda ,  Toshio Kawakami ,  Masakiyo Izumiya ,  Akira Minato ,  Katsumi Ohsumi

IPC分类号： G21D1/00 ,  G21C13/087 ,  G21C13/10 ,  G21F9/00 ,  G21C11/00

CPC分类号： G21C13/087 ,  G21C13/10 ,  Y02E30/40

摘要： A nuclear power plant using a structural material consisting of metal which comes into contact with a liquid in which radioactive substances are dissolved has a function to suppress the deposition of the radioactive substances. In this function, metal elements constituting the surface layer of the structural material which comes into contact with the liquid are oxidized by injecting oxidizing agents from outside, thereby preliminarily producing an oxide film. The oxidizing agents comprise at least one kind selected from the group consisting of oxygen, hydrogen peroxide, chromate, nitrite, molybdate, tungstate and ferrate. Particularly, by suppressing the deposition of radioactive substances on a stainless steel, the dose rate of exposure of workers is effectively reduced.

摘要翻译： 使用与溶解有放射性物质的液体接触的金属构成的结构材料的核电站具有抑制放射性物质沉积的功能。 在该功能中，构成与液体接触的结构材料的表面层的金属元素通过从外部注入氧化剂而被氧化，从而预先生成氧化膜。 氧化剂包括选自氧，过氧化氢，铬酸盐，亚硝酸盐，钼酸盐，钨酸盐和高铁酸盐中的至少一种。 特别是通过抑制放射性物质在不锈钢上的沉积，有效地降低了工作人员的接触剂量。

公开(公告)号：US5986460A

公开(公告)日：1999-11-16

申请号：US674539

申请日：1996-07-02

申请人： Toshio Kawakami

发明人： Toshio Kawakami

IPC分类号： G01R31/26 ,  G01R1/073 ,  H01L21/66 ,  H01L23/12 ,  H01L23/31 ,  H01L23/498 ,  H01L23/58

CPC分类号： H01L22/32 ,  G01R1/07307 ,  H01L23/3128 ,  H01L23/49816 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2924/01055 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/1433 ,  H01L2924/15173 ,  H01L2924/15311 ,  H01L2924/181

摘要： A semiconductor device includes a substrate, a semiconductor chip provided on the substrate, a plurality of terminals provided on a first side of the substrate, each electrically connected to the semiconductor chip and a plurality of test pads for performing electrical characteristic tests on the semiconductor chip, each test pad being electrically connected to a respective terminal in one-to-one correspondence.

摘要翻译： 半导体器件包括衬底，设置在衬底上的半导体芯片，设置在衬底的第一侧上的多个端子，每个端子与半导体芯片电连接，以及用于对半导体芯片进行电特性测试的多个测试焊盘 每个测试垫以一一对应的方式电连接到相应的终端。

公开(公告)号：US4688051A

公开(公告)日：1987-08-18

申请号：US732886

申请日：1985-05-08

申请人： Toshio Kawakami ,  Masaaki Mori ,  Chiharu Okada

发明人： Toshio Kawakami ,  Masaaki Mori ,  Chiharu Okada

IPC分类号： B41J2/36 ,  B41J2/365 ,  G01D15/10

CPC分类号： B41J2/365 ,  B41J2/36

摘要： A thermal print head driving system supplies a predetermined number of driving pulses to each of a plurality of heat-producing elements arranged in a line to record a single dot of desired tone. The pulse width of driving pulse is controlled in accordance with the temperature at or in the vicinity of the heat-producing elements thereby allowing to maintain the density level of desired tone at constant. In another aspect of the present invention, it is so structured that driving pulses may be applied to the heat-producing elements in a continuous manner without producing a cooling period during switching between tone levels. In a further aspect of the present invention, it is so structured that a predetermined number of driving pulses for each of predetermined number of tone levels is altered in consideration of the data in at least one of preceding recording lines, thereby allowing to carry out a high speed recording operation without causing fluctuations in predetermined tone density level.

摘要翻译： 热打印头驱动系统向排列成一行的多个发热元件中的每一个提供预定数量的驱动脉冲，以记录所需色调的单个点。 驱动脉冲的脉冲宽度根据发热元件处或附近的温度来控制，从而允许将期望的色调的浓度水平保持在恒定值。 在本发明的另一方面，其结构使得驱动脉冲可以以连续的方式施加到发热元件，而不会在音调电平之间切换期间产生冷却时段。 在本发明的另一方面，其结构使得考虑到至少一个先前的记录线中的数据，改变预定数量的音调电平中的每一个的预定数量的驱动脉冲，从而允许执行 高速记录操作，而不会引起预定的音调密度级别的波动。

公开(公告)号：US5302062A

公开(公告)日：1994-04-12

申请号：US924960

申请日：1992-08-05

申请人： Sadamu Baba ,  Toshio Kawakami

发明人： Sadamu Baba ,  Toshio Kawakami

IPC分类号： B23B31/173 ,  B23Q1/28 ,  F15B15/26 ,  F16D1/09 ,  F16D1/091 ,  F16D1/094 ,  B23C1/02

CPC分类号： F16D1/094 ,  B23B31/16179 ,  B23Q1/28 ,  F15B15/262 ,  F16D1/091 ,  Y10T279/1266 ,  Y10T408/94 ,  Y10T409/309352 ,  Y10T409/309912

摘要： A machine tool is provided with a spindle clamping device for clamping a spindle assembly supported by a spindle head and composed of an outer spindle rotatably supported by the spindle head and an inner spindle disposed inside the outer spindle to be reciprocal along an axial direction thereof. The inner spindle is inserted into an inner hollow portion of the outer spindle so that a space is formed between an inner peripheral surface of the outer spindle and an outer peripheral surface of the inner spindle. The spindle clamping device comprises a pressure applying member such as a pair of pistons or oil ring disposed in the space between the outer and inner spindles for applying a pressure in an axial direction of the outer and inner spindles. The pressure applying member is provided with an oil chamber, and a pair of clamp rings are disposed in the space axially outside the pressure applying member. Each of the paired clamp rings comprises inner and outer ring elements having tapered surfaces slidably contacting each other. Spring members are disposed in the space axially outside the clamp rings, respectively, for urging the outer ring elements inwardly, and a static pressure pocket is formed in a contacting portion of the spindle head supporting the inner spindle wherein pressurized oil and air is supplied into the oil chamber through the static pressure pocket.

摘要翻译： 一种机床具有主轴夹持装置，用于夹紧由主轴头支撑的主轴组件，该主轴组件由可由主轴头可旋转地支撑的外主轴和设置在外主轴内侧的内心轴沿其轴向方向往复运动。 内心轴插入外心轴的内中空部分，使得在外心轴的内周面与内心轴的外周面之间形成空间。 主轴夹持装置包括压力施加构件，例如设置在外心轴和内心轴之间的空间中的一对活塞或油环，用于在外心轴和内心轴的轴向施加压力。 压力施加构件设置有油室，并且在压力施加构件的轴向外侧的空间中设置有一对夹紧环。 每个成对的夹环包括具有可滑动地彼此接触的锥形表面的内圈和外圈元件。 弹簧构件分别设置在夹紧环的轴向外侧的空间中，用于向外推动外环元件，并且在支撑内心轴的主轴头的接触部分中形成静压袋，其中加压油和空气被供给到 油室通过静压袋。

公开(公告)号：US5048179A

公开(公告)日：1991-09-17

申请号：US480013

申请日：1990-02-14

申请人： Masahiro Shindo ,  Toshikazu Yoshimizu ,  Kenichi Kurihara ,  Shunpei Tamaki ,  Toshio Kawakami ,  Yukio Kadowaki ,  Shoji Matsumoto

发明人： Masahiro Shindo ,  Toshikazu Yoshimizu ,  Kenichi Kurihara ,  Shunpei Tamaki ,  Toshio Kawakami ,  Yukio Kadowaki ,  Shoji Matsumoto

IPC分类号： G06K19/077 ,  H01L23/14 ,  H01L23/538

CPC分类号： H01L24/25 ,  G06K19/07745 ,  H01L23/142 ,  H01L23/5388 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/82 ,  H01L24/96 ,  H01L2224/04105 ,  H01L2224/2413 ,  H01L2224/24137 ,  H01L2224/24227 ,  H01L2224/2518 ,  H01L2224/92144 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01055 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01093 ,  H01L2924/1305 ,  H01L2924/14 ,  H01L2924/18162 ,  H01L2924/19041 ,  H01L2924/19043 ,  Y10T29/4913 ,  Y10T29/49144

摘要： An IC mounting method and its resulting structure, such as an IC card is provided. An IC card includes a metal plate formed with at least one hole, and an IC chip is located fixed in position in the hole with a filler material filling the gap between the hole and the IC chip. An interconnect pattern is provided on the plate with an electrically insulating film sandwiched therebetween, and the interconnect pattern is in electrical contact with a contact pad of the IC chip. Preferably, the surface of the IC chip on which the contact pad is provided is substantially flush with one surface of the plate. When an electrically insulating film is fixedly attached to a substrate having a hole, in which an IC chip is fixedly provided, by an adhesive agent, the material of the film is selected to be similar to the material of the adhesive agent. In this manner, a contact hole may be formed in registry with a contact pad of the IC chip in the insulating film by one etching step without formation of a stepped portion in the resulting contact hole. Moreover, a film to be later removed is first formed on a substrate, and after providing elements on the film and its supporting structure, a predetermined processing, such as exposure to light, is applied to the film to change its property, thereby causing the elements to be separated away from the film.

摘要翻译： 提供IC安装方法及其结果，如IC卡。 IC卡包括形成有至少一个孔的金属板，并且IC芯片被固定在孔中的适当位置，填充填充孔和IC芯片之间的间隙的填充材料。 在该板上设置有夹在其间的电绝缘膜的互连图案，并且布线图案与IC芯片的接触焊盘电接触。 优选地，设置接触垫的IC芯片的表面与板的一个表面基本齐平。 当通过粘合剂将电绝缘膜固定地附接到具有固定设置有IC芯片的孔的基板上时，选择膜的材料与粘合剂的材料相似。 以这种方式，可以通过一个蚀刻步骤在绝缘膜中与IC芯片的接触焊盘对准形成接触孔，而不会在所形成的接触孔中形成阶梯部分。 此外，首先在基板上形成要去除的膜，并且在膜上提供元件及其支撑结构之后，对膜进行预定处理，例如曝光以改变其性能，从而使 要从电影中分离的元素。

公开(公告)号：US4581810A

公开(公告)日：1986-04-15

申请号：US574263

申请日：1984-01-26

申请人： Toshio Kawakami ,  Izumi Kimura

发明人： Toshio Kawakami ,  Izumi Kimura

IPC分类号： B23Q3/155 ,  G05B19/18 ,  B23Q3/157

CPC分类号： G05B19/182 ,  B23Q3/15526 ,  Y10T29/49819 ,  Y10T29/5107 ,  Y10T483/10 ,  Y10T483/127 ,  Y10T483/132 ,  Y10T483/1864 ,  Y10T483/1891

摘要： A tool magazine is divided into four regions respectively containing substantially the same number of tool pots. When a designated tool is contained in a first or fourth region the magazine is rotated in the clockwise direction to index the designated tool to a tool exchange position, whereas when the designated tool is contained in a second or third region the magazine is rotated in the counterclockwise direction. Designation of a desired tool, the direction of rotation of the magazine and number of steps of the magazine are controlled by a computer including a memory having a comparison table written with correspondences between tool numbers and absolute tool pot numbers. According to a modified embodiment, the tool magazine is provided with two tool exchange positions between adjacent regions and on one side thereof, and the tool exchanger is selectively moved to either one of the tool exchange positions.

摘要翻译： 工具箱分为四个区域，分别包含大致相同数量的工具箱。 当指定的工具被容纳在第一或第四区域中时，刀库沿顺时针方向旋转以将指定刀具分度到刀具更换位置，而当指定刀具被容纳在第二或第三区域中时，刀库在 逆时针方向 所期望的工具的指定，刀库的旋转方向和刀库的步数由包括存储器的计算机控制，所述计算机具有写入刀具号和绝对刀具号之间的对应关系的比较表。 根据改进的实施例，工具仓在相邻区域之间并且在其一侧上设置有两个工具交换位置，并且工具交换器被选择性地移动到工具交换位置中的任一个。

公开(公告)号：US3969153A

公开(公告)日：1976-07-13

申请号：US541115

申请日：1975-01-15

申请人： Katsumi Suzuki ,  Toshio Kawakami ,  Osamu Asai

发明人： Katsumi Suzuki ,  Toshio Kawakami ,  Osamu Asai

IPC分类号： C23C8/18 ,  C23C22/68 ,  F16L58/02 ,  F22B37/04 ,  C23F7/04

CPC分类号： F22B37/04 ,  F16L58/02 ,  Y10S122/13

摘要： A boiler tube and a method for manufacturing the same are disclosed in which an inner surface of the boiler tube used in the center of a high-temperature, high-pressure boiler is formed with a spinel layer consisting of an oxide of iron, chromium and nickel, which is exposed. The specific method of the manufacture is that after the boiler tube is brought into contact with high temperature steam, a magnetic iron (Fe.sub.3 O.sub.4) layer produced on the inner surface is removed.

摘要翻译： 公开了一种锅炉管及其制造方法，其中在高温高压锅炉的中心使用的锅炉管的内表面形成有尖晶石层，该尖晶石层由铁，铬的氧化物和 镍，暴露。 制造的具体方法是在锅炉管与高温蒸汽接触后，在内表面上产生的磁铁（Fe 3 O 4）层被去除。