公开(公告)号：US07349762B2

公开(公告)日：2008-03-25

申请号：US11271460

申请日：2005-11-10

申请人： Takashi Omizo ,  Charles R. Johns ,  Michael F. Wang ,  Kazuaki Yazawa ,  Toshiyuki Hiroi

发明人： Takashi Omizo ,  Charles R. Johns ,  Michael F. Wang ,  Kazuaki Yazawa ,  Toshiyuki Hiroi

IPC分类号： G06F17/40

CPC分类号： G05D23/19

摘要： Systems and methods for sensing temperatures of multiple functional blocks within a digital device and controlling the operation of these functional blocks in a manner that selectively reduces temperatures associated with some of the functional blocks, but not others. One embodiment comprises an integrated circuit having multiple functional blocks (such as processor cores) and a set of thermal sensors coupled to sense the temperatures of the functional blocks. The integrated circuit includes control circuitry configured to receive signals from the thermal sensors, detect thermal events in the functional blocks and to individually adjust operation of the functional blocks to reduce the temperatures causing the thermal events. In one embodiment, the control circuitry includes a detection/control circuit coupled to each of the functional blocks and a thermal management unit configured to evaluate detected thermal events and to determine actions to be taken in response to the thermal events.

摘要翻译： 用于感测数字设备内的多个功能块的温度的系统和方法，并且以选择性地降低与一些功能块相关联的温度而不是其它功能块的方式来控制这些功能块的操作。 一个实施例包括具有多个功能块（例如处理器核）的集成电路和耦合以感测功能块的温度的一组热传感器。 集成电路包括控制电路，其被配置为从热传感器接收信号，检测功能块中的热事件并且单独地调整功能块的操作以降低导致热事件的温度。 在一个实施例中，控制电路包括耦合到每个功能块的检测/控制电路和被配置为评估检测到的热事件并且确定响应于热事件而采取的动作的热管理单元。

公开(公告)号：US20070106428A1

公开(公告)日：2007-05-10

申请号：US11271460

申请日：2005-11-10

申请人： Takashi Omizo ,  Charles Johns ,  Michael Wang ,  Kazuaki Yazawa ,  Toshiyuki Hiroi

发明人： Takashi Omizo ,  Charles Johns ,  Michael Wang ,  Kazuaki Yazawa ,  Toshiyuki Hiroi

IPC分类号： G05D23/00

CPC分类号： G05D23/19

摘要： Systems and methods for sensing temperatures of multiple functional blocks within a digital device and controlling the operation of these functional blocks in a manner that selectively reduces temperatures associated with some of the functional blocks, but not others. One embodiment comprises an integrated circuit having multiple functional blocks (such as processor cores) and a set of thermal sensors coupled to sense the temperatures of the functional blocks. The integrated circuit includes control circuitry configured to receive signals from the thermal sensors, detect thermal events in the functional blocks and to individually adjust operation of the functional blocks to reduce the temperatures causing the thermal events. In one embodiment, the control circuitry includes a detection/control circuit coupled to each of the functional blocks and a thermal management unit configured to evaluate detected thermal events and to determine actions to be taken in response to the thermal events.

摘要翻译： 用于感测数字设备内的多个功能块的温度的系统和方法，并且以选择性地降低与一些功能块相关联的温度而不是其它功能块的方式来控制这些功能块的操作。 一个实施例包括具有多个功能块（例如处理器核）的集成电路和耦合以感测功能块的温度的一组热传感器。 集成电路包括控制电路，其被配置为从热传感器接收信号，检测功能块中的热事件并且单独地调整功能块的操作以降低导致热事件的温度。 在一个实施例中，控制电路包括耦合到每个功能块的检测/控制电路和被配置为评估检测到的热事件并且确定响应于热事件而采取的动作的热管理单元。

公开(公告)号：US07535020B2

公开(公告)日：2009-05-19

申请号：US11168591

申请日：2005-06-28

申请人： Munehiro Yoshida ,  Daniel Stasiak ,  Michael F. Wang ,  Charles R. Johns ,  Hiroki Kihara ,  Tetsuji Tamura ,  Kazuaki Yazawa ,  Iwao Takiguchi

发明人： Munehiro Yoshida ,  Daniel Stasiak ,  Michael F. Wang ,  Charles R. Johns ,  Hiroki Kihara ,  Tetsuji Tamura ,  Kazuaki Yazawa ,  Iwao Takiguchi

IPC分类号： H01L23/58

CPC分类号： H01L25/162 ,  G06F1/206 ,  H01L23/34 ,  H01L2924/0002 ,  H01L2924/00

摘要： Systems and methods for positioning thermal sensors within an integrated circuit in a manner that provides useful thermal measurements corresponding to different parts of the integrated circuit. In one embodiment, an integrated circuit includes multiple, duplicate functional blocks. A separate thermal sensor is coupled to each of the duplicate functional blocks, preferably in the same relative location on each of the duplicate functional blocks, and preferably at a hotspot. One embodiment also includes thermal sensors on one or more functional blocks of other types in the integrated circuit. One embodiment includes a thermal sensor positioned at a cool spot, such as at the edge of the integrated circuit chip. Each of the thermal sensors may have ports to enable power and ground connections or data connections between the sensors and external components or devices.

摘要翻译： 用于以集成电路的不同部分提供有用的热测量的方式在集成电路内定位热传感器的系统和方法。 在一个实施例中，集成电路包括多个复制功能块。 单独的热传感器耦合到每个重复功能块，优选地在每个复制功能块上相同的相对位置，并且优选地在热点处。 一个实施例还包括在集成电路中的其它类型的一个或多个功能块上的热传感器。 一个实施例包括位于集成电路芯片的边缘处的冷点处的热传感器。 每个热传感器可以具有端口，以实现传感器和外部组件或设备之间的电源和接地连接或数据连接。

公开(公告)号：US07954101B2

公开(公告)日：2011-05-31

申请号：US10575042

申请日：2005-04-08

申请人： Kenichi Adachi ,  Kazuaki Yazawa ,  Iwao Takiguchi ,  Atsuhiko Imai ,  Tetsuji Tamura

发明人： Kenichi Adachi ,  Kazuaki Yazawa ,  Iwao Takiguchi ,  Atsuhiko Imai ,  Tetsuji Tamura

IPC分类号： G06F9/46 ,  G06F1/00

CPC分类号： G06F1/3203 ,  G06F1/329 ,  G06F9/4887 ,  Y02D10/126 ,  Y02D10/24

摘要： This task management method includes dividing a unit time of processing into a reserved band for guaranteeing real-timeness and a non-reserved band not for guaranteeing real-timeness, and skipping a task to be executed in the non-reserved band as appropriate when processor throughput falls. That is, when the operating frequency of the processor is lowered in order to suppress heat generation, the real-timeness of tasks to be executed in the reserved band is guaranteed at the expense of processing the task to be executed in the non-reserved band in a best-efforts fashion.

摘要翻译： 该任务管理方法包括将处理的单位时间划分为用于保证实时性的保留频带和不保证实时性的非保留频带，并且当处理器适当时跳过在非保留频带中执行的任务 吞吐量下降。 也就是说，当为了抑制发热而降低处理器的工作频率时，保证在保留频带中执行的任务的实时性以处理在非保留频带中执行的任务为代价 以尽力而为的方式。

公开(公告)号：US20090218583A1

公开(公告)日：2009-09-03

申请号：US12369463

申请日：2009-02-11

申请人： Yuichi Ishida ,  Kazuaki Yazawa ,  Norikazu Nakayama

发明人： Yuichi Ishida ,  Kazuaki Yazawa ,  Norikazu Nakayama

IPC分类号： H01L33/00 ,  H01L21/28

CPC分类号： H01L33/645 ,  H01L33/0079 ,  H01S5/0224 ,  H01S5/02415 ,  H01S5/0261 ,  H01S5/32341 ,  H01S2301/173

摘要： Disclosed is a light-emitting device. The light-emitting device includes an EL layer and a heat dissipation layer. The EL layer includes a first semiconductor layer, a second semiconductor layer, and an active layer, the first semiconductor layer having a first conductivity type that is one of n type and p type, the second semiconductor layer having a second conductivity type that is opposite to the first conductivity type, the active layer being provided between the first semiconductor layer and the second semiconductor layer. The heat dissipation layer has the first conductivity type and is bonded to a side of the EL layer closer to the second semiconductor layer than the first semiconductor layer.

摘要翻译： 公开了一种发光装置。 发光器件包括EL层和散热层。 EL层包括第一半导体层，第二半导体层和有源层，第一半导体层具有作为n型和p型之一的第一导电类型，第二半导体层具有相反的第二导电类型 对于第一导电类型，有源层设置在第一半导体层和第二半导体层之间。 散热层具有第一导电类型，并且被结合到比第一半导体层更靠近第二半导体层的EL层的一侧。

公开(公告)号：US07369409B2

公开(公告)日：2008-05-06

申请号：US11166919

申请日：2005-06-24

申请人： Kazuaki Yazawa

发明人： Kazuaki Yazawa

IPC分类号： H05K7/20 ,  F28F7/00

CPC分类号： H01L23/34 ,  H01L23/4735 ,  H01L2924/0002 ,  Y10S165/908 ,  H01L2924/00

摘要： A thermal distribution detecting unit detects a thermal distribution state on a surface of an electronic device. An emission control unit identifies a position to be cooled in accordance with the thermal distribution state detected. A nozzle selecting unit selects a cooling nozzle corresponding to the position. An emission time computing unit computes a coolant emission time and timing for the cooling nozzle. Upon reception of an instruction from the emission control unit, a drive unit drives a nozzle unit, thereby allowing a jet of coolant to impinge upon the electronic device.

摘要翻译： 热分布检测单元检测电子设备的表面上的热分布状态。 排放控制单元根据检测到的热分布状态来识别待冷却的位置。 喷嘴选择单元选择与该位置对应的冷却喷嘴。 排放时间计算单元计算冷却喷嘴的冷却剂排放时间和时间。 在从排放控制单元接收到指令时，驱动单元驱动喷嘴单元，从而允许冷却剂射流撞击电子设备。

公开(公告)号：US20070198134A1

公开(公告)日：2007-08-23

申请号：US10589380

申请日：2004-12-22

申请人： Kenichi Adachi ,  Kazuaki Yazawa ,  Iwao Takiguchi ,  Atsuhiko Imai ,  Tetsuji Tamura

发明人： Kenichi Adachi ,  Kazuaki Yazawa ,  Iwao Takiguchi ,  Atsuhiko Imai ,  Tetsuji Tamura

IPC分类号： G05D23/00

CPC分类号： G06F1/206 ,  G06F1/3203 ,  G06F1/329 ,  G06F9/3836 ,  G06F9/3869 ,  G06F9/4881 ,  G06F9/505 ,  Y02D10/126 ,  Y02D10/24

摘要： An instruction decoder identifies, for each instruction, an operational block involved in the execution of the instruction and an associated heat release coefficient. The instruction decoder stores identified information in a heat release coefficient profile. An instruction scheduler schedules the instructions in accordance with the dependence of the instructions on data. A heat release frequency adder cumulatively adds the heat release coefficient to the heat release frequency of the operational block held in the operational block heat release frequency register as the execution of the scheduled instructions proceeds. A heat release frequency subtractor subtracts from the heat release frequency of the operational blocks in the operational block heat release frequency register in accordance with heat discharge that occurs with time. A hot spot detector detects an operational block with its heat release frequency, held in the operational block heat release frequency register, exceeding a predetermined threshold value as a hot spot. The instruction scheduler delays the execution of the instruction involving for its execution the operational block identified as a hot spot.

摘要翻译： 指令解码器针对每个指令识别涉及执行指令的操作块和相关的放热系数。 指令解码器将识别的信息存储在放热系数分布中。 指令调度器根据指令对数据的依赖性来调度指令。 随着调度指令的执行进行，放热频率加法器将放热系数累积地加到保持在操作块放热频率寄存器中的操作块的放热频率。 热释放频率减法器根据随时间发生的放热量从操作块放热频率寄存器中的操作块的放热频率中减去。 热点检测器以其热释放频率检测到操作块放热频率寄存器中的操作块超过预定阈值作为热点。 指令调度器延迟涉及其执行的指令的执行被识别为热点的操作块。

公开(公告)号：US07102417B2

公开(公告)日：2006-09-05

申请号：US10982019

申请日：2004-11-05

申请人： Melia F. Gordon ,  Charles Ray Johns ,  Hiroki Kihara ,  Iwao Takiguchi ,  Tetsuji Tamura ,  Michael Fan Wang ,  Kazuaki Yazawa ,  Munehiro Yoshida

发明人： Melia F. Gordon ,  Charles Ray Johns ,  Hiroki Kihara ,  Iwao Takiguchi ,  Tetsuji Tamura ,  Michael Fan Wang ,  Kazuaki Yazawa ,  Munehiro Yoshida

IPC分类号： H03K17/78

CPC分类号： G01K15/00 ,  G01R31/2856 ,  G01R31/2874 ,  G01R31/31704 ,  G01R31/319 ,  G01R31/31908

摘要： An integrated circuit die is disclosed including a temperature detection circuit and a memory configured to store calibration data. The temperature detection circuit is operatively coupled to the memory, and receives an input signal. The temperature detection circuit is configured to produce an output signal dependent upon the input signal and indicative of whether a temperature of the integrated circuit die is greater than a selected temperature. During a normal operating mode of the integrated circuit die the input signal comprises the calibration data. A system and methods for calibrating the temperature detection circuit are also described.

摘要翻译： 公开了一种集成电路管芯，其包括温度检测电路和配置为存储校准数据的存储器。 温度检测电路可操作地耦合到存储器，并且接收输入信号。 温度检测电路被配置为根据输入信号产生输出信号，并且指示集成电路管芯的温度是否大于所选择的温度。 在集成电路管芯的正常操作模式期间，输入信号包括校准数据。 还描述了用于校准温度检测电路的系统和方法。

公开(公告)号：US06856037B2

公开(公告)日：2005-02-15

申请号：US09994179

申请日：2001-11-26

申请人： Kazuaki Yazawa ,  Avram Bar-Cohen

发明人： Kazuaki Yazawa ,  Avram Bar-Cohen

IPC分类号： F28D15/02 ,  F03G7/00 ,  F28D15/00 ,  H01L23/427 ,  H01L23/473 ,  H02K44/08 ,  H05K7/20 ,  F03B13/00 ,  G06F1/16

CPC分类号： F28F23/00 ,  F03G7/00 ,  F28D15/00 ,  F28D15/0266 ,  F28F2250/08 ,  H01L23/4275 ,  H01L2924/0002 ,  H01L2924/00

摘要： A method for converting lower temperature dissipated heat to other useful energy and apparatus therefore. Heat energy is transferred to a fluid contained within a conduit, and natural convection of the fluid is utilized to transfer kinetic energy of the heat to another type of energy such as electrical energy.

摘要翻译： 因此，将较低温度耗散的热量转换为其它有用的能量和装置的方法。 热能转移到管道内所含的流体，并且利用流体的自然对流将热量的动能传递到另一类能量，例如电能。

公开(公告)号：US07973434B2

公开(公告)日：2011-07-05

申请号：US11355706

申请日：2006-02-16

申请人： Kazuaki Yazawa ,  Iwao Takiguchi

发明人： Kazuaki Yazawa ,  Iwao Takiguchi

IPC分类号： H02K44/00 ,  H01L23/34

CPC分类号： H05K7/20272 ,  F04B19/006 ,  H01L2924/0002 ,  H01L2924/00

摘要： An electromotive cooling head includes a substrate, an N-pole magnet, and an S-pole magnet, and kept in intimate contact with the backside of the semiconductor integrated circuit so as to cover it. The substrate has a fluid channel having a micro-channel structure, through which a conductive fluid flows. An anode and a cathode are disposed to sandwich the fluid channel. The conductive fluid interacts with a magnetic field to thereby induce an electromotive force between the anode and the cathode. A circuit includes, on its backside, a power supply voltage terminal and a ground terminal, and is driven by the electromotive force induced in the electromotive cooling head.

摘要翻译： 电动冷却头包括基板，N极磁体和S极磁体，并且与半导体集成电路的背面保持紧密接触以覆盖它。 衬底具有具有微通道结构的流体通道，导电流体通过该通道结构流动。 设置阳极和阴极以夹持流体通道。 导电流体与磁场相互作用，从而在阳极和阴极之间引起电动势。 电路的背面包括电源电压端子和接地端子，并且由电动冷却头中感应的电动势驱动。