公开(公告)号：US08783319B2

公开(公告)日：2014-07-22

申请号：US13224536

申请日：2011-09-02

申请人： Takashi Yamagami ,  Ryuichi Takano ,  Hiroshi Maki ,  Masayuki Mochizuki

发明人： Takashi Yamagami ,  Ryuichi Takano ,  Hiroshi Maki ,  Masayuki Mochizuki

IPC分类号： B32B38/10

CPC分类号： H01L21/67028 ,  H01L21/67144 ,  H01L24/75 ,  H01L2924/10253 ,  Y10T156/14 ,  H01L2924/00

摘要： The invention has an object to provide a foreign substance removing device that is capable of quickly and efficiently cleaning substrate surfaces regardless of the size thereof and preventing readhesion of once removed foreign substances as well as to provide a die bonder equipped with the same.The foreign substance removing device of the invention includes: a pickup device to which a dicing film carrying dies thereon is fixed; and a collet for picking up a die separated from the dicing film and placing the die on a substrate having an adhesive applied thereon, and operates to remove foreign substances on the substrate in preparation for application of the adhesive onto the substrate. The foreign substance removing device includes a cleaning nozzle integrating an air outlet orifice and an air inlet orifice.

摘要翻译： 本发明的目的是提供一种异物移除装置，其能够快速有效地清洁基板表面，而不管其尺寸如何，并且防止一次去除的异物的再粘合以及提供装备有该物质的模具接合机。 本发明的异物清除装置包括：固定有其上载有模具的切割膜的拾取装置; 以及用于拾取与切割膜分离的模具的夹头，并将模具放置在其上施加有粘合剂的基板上，并且用于去除衬底上的异物以准备将粘合剂施加到基板上。 异物去除装置包括集成空气出口孔和空气入口孔的清洁喷嘴。

公开(公告)号：US20120241096A1

公开(公告)日：2012-09-27

申请号：US13224536

申请日：2011-09-02

申请人： Takashi YAMAGAMI ,  Ryuichi Takano ,  Hiroshi Maki ,  Masayuki Mochizuki

发明人： Takashi YAMAGAMI ,  Ryuichi Takano ,  Hiroshi Maki ,  Masayuki Mochizuki

IPC分类号： B32B38/00 ,  B08B5/04 ,  B08B5/02

CPC分类号： H01L21/67028 ,  H01L21/67144 ,  H01L24/75 ,  H01L2924/10253 ,  Y10T156/14 ,  H01L2924/00

摘要： The invention has an object to provide a foreign substance removing device that is capable of quickly and efficiently cleaning substrate surfaces regardless of the size thereof and preventing readhesion of once removed foreign substances as well as to provide a die bonder equipped with the same.The foreign substance removing device of the invention includes: a pickup device to which a dicing film carrying dies thereon is fixed; and a collet for picking up a die separated from the dicing film and placing the die on a substrate having an adhesive applied thereon, and operates to remove foreign substances on the substrate in preparation for application of the adhesive onto the substrate. The foreign substance removing device includes a cleaning nozzle integrating an air outlet orifice and an air inlet orifice.

摘要翻译： 本发明的目的是提供一种异物移除装置，其能够快速有效地清洁基板表面，而不管其尺寸如何，并且防止一次去除的异物的再粘合以及提供装备有该物质的模具接合机。 本发明的异物清除装置包括：固定有其上载有模具的切割膜的拾取装置; 以及用于拾取与切割膜分离的模具的夹头，并将模具放置在其上施加有粘合剂的基板上，并且用于去除衬底上的异物以准备将粘合剂施加到基板上。 异物去除装置包括集成空气出口孔和空气入口孔的清洁喷嘴。

公开(公告)号：US08703583B2

公开(公告)日：2014-04-22

申请号：US12618292

申请日：2009-11-13

申请人： Hiroshi Maki ,  Masayuki Mochizuki ,  Ryuichi Takano ,  Yoshiaki Makita ,  Haruhiko Fukasawa ,  Keisuke Nadamoto ,  Tatsuyuki Okubo

发明人： Hiroshi Maki ,  Masayuki Mochizuki ,  Ryuichi Takano ,  Yoshiaki Makita ,  Haruhiko Fukasawa ,  Keisuke Nadamoto ,  Tatsuyuki Okubo

IPC分类号： H01L21/00

CPC分类号： H01L21/67132 ,  H01L21/67092 ,  H01L21/6835 ,  H01L21/6836 ,  H01L21/6838 ,  H01L21/68742 ,  H01L21/78 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/75 ,  H01L24/83 ,  H01L2221/68322 ,  H01L2221/68327 ,  H01L2221/68336 ,  H01L2224/27436 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/8385 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/0132 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/1306 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/3511 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/01032 ,  H01L2924/00 ,  H01L2924/3512

摘要： A technique with which die bonding can be carried out without forming a void in a bond area is provided. A vacuum supply line that connects to a vacuum chuck hole formed in the bottom face of a vacuuming collet and supplies the vacuuming collet with reduced pressure for vacuum chucking a chip is constructed of two systems. That is, the vacuum supply line is so structured that a first pipe and a second pipe connect to the vacuuming collet. The first pipe supplies the vacuuming collet with a vacuum that provides suction force when a chip is unstuck from a dicing tape and transported to a mounting position on a wiring substrate. The second pipe supplies the vacuuming collet with a vacuum that provides suction force when a chip is mounted over a wiring substrate. The intensity of the vacuum (suction force) supplied to the vacuuming collet is controlled by opening or closing valves respectively installed in the pipes.

摘要翻译： 提供了一种可以在不在接合区域形成空隙的情况下进行管芯接合的技术。 连接到真空吸盘孔的真空供给线，其形成在真空夹头的底面，并且用于减压的真空吸盘用于真空夹紧芯片由两个系统构成。 也就是说，真空供给管的结构使得第一管和第二管连接到抽真空夹头。 第一管为真空提供真空，当芯片从切割胶带脱离并传送到布线基板上的安装位置时，该真空提供吸力。 第二个管道为抽真空筒提供一个真空，当芯片安装在布线基板上时，该真空提供吸力。 通过打开或关闭分别安装在管道中的阀门来控制提供给抽真空夹头的真空强度（吸力）。

公开(公告)号：US20070275544A1

公开(公告)日：2007-11-29

申请号：US11735741

申请日：2007-04-16

申请人： Hiroshi Maki ,  Masayuki Mochizuki ,  Ryuichi Takano ,  Yoshiaki Makita ,  Haruhiko Fukasawa ,  Keisuke Nadamoto ,  Tatsuyuki Okubo

发明人： Hiroshi Maki ,  Masayuki Mochizuki ,  Ryuichi Takano ,  Yoshiaki Makita ,  Haruhiko Fukasawa ,  Keisuke Nadamoto ,  Tatsuyuki Okubo

IPC分类号： H01L21/00

CPC分类号： H01L21/67132 ,  H01L21/67092 ,  H01L21/6835 ,  H01L21/6836 ,  H01L21/6838 ,  H01L21/68742 ,  H01L21/78 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/75 ,  H01L24/83 ,  H01L2221/68322 ,  H01L2221/68327 ,  H01L2221/68336 ,  H01L2224/27436 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/8385 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/0132 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/1306 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/3511 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/01032 ,  H01L2924/00 ,  H01L2924/3512

摘要： A technique with which die bonding can be carried out without forming a void in a bond area is provided. A vacuum supply line that connects to a vacuum chuck hole formed in the bottom face of a vacuuming collet and supplies the vacuuming collet with reduced pressure for vacuum chucking a chip is constructed of two systems. That is, the vacuum supply line is so structured that a first pipe and a second pipe connect to the vacuuming collet. The first pipe supplies the vacuuming collet with a vacuum that provides suction force when a chip is unstuck from a dicing tape and transported to a mounting position on a wiring substrate. The second pipe supplies the vacuuming collet with a vacuum that provides suction force when a chip is mounted over a wiring substrate. The intensity of the vacuum (suction force) supplied to the vacuuming collet is controlled by opening or closing valves respectively installed in the pipes.

摘要翻译： 提供了一种可以在不在接合区域形成空隙的情况下进行管芯接合的技术。 连接到真空吸盘孔的真空供给线，其形成在真空夹头的底面，并且用于减压的真空吸盘用于真空夹紧芯片由两个系统构成。 也就是说，真空供给管的结构使得第一管和第二管连接到抽真空夹头。 第一管为真空提供真空，当芯片从切割胶带脱离并传送到布线基板上的安装位置时，该真空提供吸力。 第二个管道为抽真空筒提供一个真空，当芯片安装在布线基板上时，该真空提供吸力。 通过打开或关闭分别安装在管道中的阀门来控制提供给抽真空夹头的真空强度（吸力）。

公开(公告)号：US20100055878A1

公开(公告)日：2010-03-04

申请号：US12618292

申请日：2009-11-13

申请人： Hiroshi MAKI ,  Masayuki Mochizuki ,  Ryuichi Takano ,  Yoshiaki Makita ,  Haruhiko Fukasawa ,  Keisuke Nadamoto ,  Tatsuyuki Okubo

发明人： Hiroshi MAKI ,  Masayuki Mochizuki ,  Ryuichi Takano ,  Yoshiaki Makita ,  Haruhiko Fukasawa ,  Keisuke Nadamoto ,  Tatsuyuki Okubo

IPC分类号： H01L21/304

CPC分类号： H01L21/67132 ,  H01L21/67092 ,  H01L21/6835 ,  H01L21/6836 ,  H01L21/6838 ,  H01L21/68742 ,  H01L21/78 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/75 ,  H01L24/83 ,  H01L2221/68322 ,  H01L2221/68327 ,  H01L2221/68336 ,  H01L2224/27436 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/8385 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/0132 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/1306 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/3511 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/01032 ,  H01L2924/00 ,  H01L2924/3512

摘要： A technique with which die bonding can be carried out without forming a void in a bond area is provided. A vacuum supply line that connects to a vacuum chuck hole formed in the bottom face of a vacuuming collet and supplies the vacuuming collet with reduced pressure for vacuum chucking a chip is constructed of two systems. That is, the vacuum supply line is so structured that a first pipe and a second pipe connect to the vacuuming collet. The first pipe supplies the vacuuming collet with a vacuum that provides suction force when a chip is unstuck from a dicing tape and transported to a mounting position on a wiring substrate. The second pipe supplies the vacuuming collet with a vacuum that provides suction force when a chip is mounted over a wiring substrate. The intensity of the vacuum (suction force) supplied to the vacuuming collet is controlled by opening or closing valves respectively installed in the pipes.

摘要翻译： 提供了一种可以在不在接合区域形成空隙的情况下进行管芯接合的技术。 连接到真空吸盘孔的真空供给线，其形成在真空夹头的底面，并且用于减压的真空吸盘用于真空夹紧芯片由两个系统构成。 也就是说，真空供给管的结构使得第一管和第二管连接到抽真空夹头。 第一管为真空提供真空，当芯片从切割胶带脱离并传送到布线基板上的安装位置时，该真空提供吸力。 第二个管道为抽真空筒提供一个真空，当芯片安装在布线基板上时，该真空提供吸力。 通过打开或关闭分别安装在管道中的阀门来控制提供给抽真空夹头的真空强度（吸力）。

公开(公告)号：US07629231B2

公开(公告)日：2009-12-08

申请号：US11735741

申请日：2007-04-16

申请人： Hiroshi Maki ,  Masayuki Mochizuki ,  Ryuichi Takano ,  Yoshiaki Makita ,  Haruhiko Fukasawa ,  Keisuke Nadamoto ,  Tatsuyuki Okubo

发明人： Hiroshi Maki ,  Masayuki Mochizuki ,  Ryuichi Takano ,  Yoshiaki Makita ,  Haruhiko Fukasawa ,  Keisuke Nadamoto ,  Tatsuyuki Okubo

IPC分类号： H01L21/00

CPC分类号： H01L21/67132 ,  H01L21/67092 ,  H01L21/6835 ,  H01L21/6836 ,  H01L21/6838 ,  H01L21/68742 ,  H01L21/78 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/75 ,  H01L24/83 ,  H01L2221/68322 ,  H01L2221/68327 ,  H01L2221/68336 ,  H01L2224/27436 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/8385 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/0132 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/1306 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/3511 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/01032 ,  H01L2924/00 ,  H01L2924/3512

摘要： A technique with which die bonding can be carried out without forming a void in a bond area is provided. A vacuum supply line that connects to a vacuum chuck hole formed in the bottom face of a vacuuming collet and supplies the vacuuming collet with reduced pressure for vacuum chucking a chip is constructed of two systems. That is, the vacuum supply line is so structured that a first pipe and a second pipe connect to the vacuuming collet. The first pipe supplies the vacuuming collet with a vacuum that provides suction force when a chip is unstuck from a dicing tape and transported to a mounting position on a wiring substrate. The second pipe supplies the vacuuming collet with a vacuum that provides suction force when a chip is mounted over a wiring substrate. The intensity of the vacuum (suction force) supplied to the vacuuming collet is controlled by opening or closing valves respectively installed in the pipes.

摘要翻译： 提供了一种可以在不在接合区域形成空隙的情况下进行管芯接合的技术。 连接到真空吸盘孔的真空供给线，其形成在真空夹头的底面，并且用于减压的真空吸盘用于真空夹紧芯片由两个系统构成。 也就是说，真空供给管的结构使得第一管和第二管连接到抽真空夹头。 第一管为真空提供真空，当芯片从切割胶带脱离并传送到布线基板上的安装位置时，该真空提供吸力。 第二个管道为抽真空筒提供一个真空，当芯片安装在布线基板上时，该真空提供吸力。 通过打开或关闭分别安装在管道中的阀门来控制提供给抽真空夹头的真空强度（吸力）。

公开(公告)号：US20130068826A1

公开(公告)日：2013-03-21

申请号：US13415920

申请日：2012-03-09

申请人： Hiroshi Maki ,  Masayuki Mochizuki ,  Yukio Tani ,  Takehito Mochizuki

发明人： Hiroshi Maki ,  Masayuki Mochizuki ,  Yukio Tani ,  Takehito Mochizuki

IPC分类号： B23K31/02 ,  B23K37/04

CPC分类号： H01L24/27 ,  H01L24/75 ,  H01L2224/83191 ,  H01L2224/83192

摘要： A die bonder includes a die supply stage, which is configured to hold a wafer; a first head having a first collet, which is configured to pick up a die from the wafer and to attach the die, provisionally, on a target to be conducted with mounting thereon, on the attach stage; a second head having a second collet, which is configured to conduct main compression of the die, which is provisionally attached on the attach stage, on the target to be conducted with mounting; and a controller apparatus, wherein the controller apparatus controls the first head to pick up a next die from the die supply stage, during when the second head conducts the main compression on the die onto the target to be conducted with mounting, thereby achieving the die bonder and the die bonding method being stable in quality.

摘要翻译： 芯片接合器包括：晶片供给台，其配置成保持晶片; 第一头具有第一夹头，其被配置为从所述晶片拾取模具并且临时地将所述管芯附着到要安装在其上的待导电的靶上; 具有第二夹头的第二头部，其被构造成在临时安装在附接台上的模具上进行主压缩，以安装在导向件上; 以及控制装置，其特征在于，所述控制装置控制所述第一头从所述模具供给台拾取下一个模具，在所述第二头部将所述模具上的主压缩导向所述待进行导向的所述靶上，从而实现所述模具 粘合剂和芯片焊接方法质量稳定。

公开(公告)号：US08367433B2

公开(公告)日：2013-02-05

申请号：US12840333

申请日：2010-07-21

申请人： Hideharu Kobashi ,  Hiroshi Maki ,  Masayuki Mochizuki ,  Yoshiaki Makita

发明人： Hideharu Kobashi ,  Hiroshi Maki ,  Masayuki Mochizuki ,  Yoshiaki Makita

IPC分类号： H01L21/66

CPC分类号： H01L22/12 ,  H01L21/67132 ,  H01L21/67271 ,  H01L24/45 ,  H01L24/73 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014

摘要： A technique is provided which can exactly recognize a chip to be picked up when picking up the chip from a wafer sheet in a process of die bonding a thin chip. A camera is coupled to one end of a lens barrel, an objective lens is attached to an opposite end of the lens barrel, and an image of a main surface of a chip is photographed through the objective lens. A surface-emitting lighting unit, a diffusing plate and a half mirror are internally provided between the lens barrel and the chip. Further, another lens barrel having a coaxial drop lighting function of radiating light to the main surface of the chip along the same optical axis as that of the camera is disposed.

公开(公告)号：US20090215204A1

公开(公告)日：2009-08-27

申请号：US12436647

申请日：2009-05-06

申请人： Hideharu KOBASHI ,  Hiroshi Maki ,  Masayuki Mochizuki ,  Yoshiaki Makita

发明人： Hideharu KOBASHI ,  Hiroshi Maki ,  Masayuki Mochizuki ,  Yoshiaki Makita

IPC分类号： H01L21/66

CPC分类号： H01L22/12 ,  H01L21/67132 ,  H01L21/67271 ,  H01L24/45 ,  H01L24/73 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014

摘要： A technique is provided which can exactly recognize a chip to be picked up when picking up the chip from a wafer sheet in a process of die bonding a thin chip. A camera is coupled to one end of a lens barrel, an objective lens is attached to an opposite end of the lens barrel, and an image of a main surface of a chip is photographed through the objective lens. A surface-emitting lighting unit, a diffusing plate and a half mirror are internally provided between the lens barrel and the chip. Further, another lens barrel having a coaxial drop lighting function of radiating light to the main surface of the chip along the same optical axis as that of the camera is disposed.

摘要翻译： 提供一种技术，其可以在芯片接合薄片的过程中从晶片片上拾取芯片时精确地识别要拾取的芯片。 相机耦合到镜筒的一端，物镜附着到镜筒的相对端，并且通过物镜拍摄芯片的主表面的图像。 在透镜筒和芯片之间内部设置表面发射照明单元，漫射板和半反射镜。 此外，设置具有沿着与照相机相同的光轴向芯片的主表面照射光的同轴放置点亮功能的另一个镜筒。

公开(公告)号：US10096526B2

公开(公告)日：2018-10-09

申请号：US13585900

申请日：2012-08-15

申请人： Masayuki Mochizuki ,  Hiroshi Maki ,  Yukio Tani ,  Takehito Mochizuki

发明人： Masayuki Mochizuki ,  Hiroshi Maki ,  Yukio Tani ,  Takehito Mochizuki

IPC分类号： H01L21/66 ,  H01L21/67 ,  H01L21/68 ,  H01L23/00

摘要： A bonding method of a die bonder with a single conveyance lane and a single bonding head, or a plurality of conveyance lanes and a plurality of bonding heads includes the steps of generating a classification map of class dies with different electric properties on the wafer, which are classified in accordance with a plurality of grades, picking up the die from the wafer, bonding the die onto a substrate or the die using a bonding head, conveying a class substrate corresponding to the class die on the conveyance lane in a unit of the class substrate, and further bonding the class die to the corresponding class substrate based on the classification map.