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    Die Bonder and Bonding Method
    1.
    发明申请
    Die Bonder and Bonding Method 审中-公开
    Die Bonder和Bonding Method

    公开(公告)号：US20130068826A1

    公开(公告)日：2013-03-21

    申请号：US13415920

    申请日：2012-03-09

    申请人： Hiroshi Maki ,  Masayuki Mochizuki ,  Yukio Tani ,  Takehito Mochizuki

    发明人： Hiroshi Maki ,  Masayuki Mochizuki ,  Yukio Tani ,  Takehito Mochizuki

    IPC分类号： B23K31/02 ,  B23K37/04

    CPC分类号： H01L24/27 ,  H01L24/75 ,  H01L2224/83191 ,  H01L2224/83192

    摘要： A die bonder includes a die supply stage, which is configured to hold a wafer; a first head having a first collet, which is configured to pick up a die from the wafer and to attach the die, provisionally, on a target to be conducted with mounting thereon, on the attach stage; a second head having a second collet, which is configured to conduct main compression of the die, which is provisionally attached on the attach stage, on the target to be conducted with mounting; and a controller apparatus, wherein the controller apparatus controls the first head to pick up a next die from the die supply stage, during when the second head conducts the main compression on the die onto the target to be conducted with mounting, thereby achieving the die bonder and the die bonding method being stable in quality.

    摘要翻译： 芯片接合器包括：晶片供给台，其配置成保持晶片; 第一头具有第一夹头，其被配置为从所述晶片拾取模具并且临时地将所述管芯附着到要安装在其上的待导电的靶上; 具有第二夹头的第二头部，其被构造成在临时安装在附接台上的模具上进行主压缩，以安装在导向件上; 以及控制装置，其特征在于，所述控制装置控制所述第一头从所述模具供给台拾取下一个模具，在所述第二头部将所述模具上的主压缩导向所述待进行导向的所述靶上，从而实现所述模具 粘合剂和芯片焊接方法质量稳定。

    Die bonder and bonding method
    2.
    发明授权
    Die bonder and bonding method 有权

    公开(公告)号：US10096526B2

    公开(公告)日：2018-10-09

    申请号：US13585900

    申请日：2012-08-15

    申请人： Masayuki Mochizuki ,  Hiroshi Maki ,  Yukio Tani ,  Takehito Mochizuki

    发明人： Masayuki Mochizuki ,  Hiroshi Maki ,  Yukio Tani ,  Takehito Mochizuki

    IPC分类号： H01L21/66 ,  H01L21/67 ,  H01L21/68 ,  H01L23/00

    摘要： A bonding method of a die bonder with a single conveyance lane and a single bonding head, or a plurality of conveyance lanes and a plurality of bonding heads includes the steps of generating a classification map of class dies with different electric properties on the wafer, which are classified in accordance with a plurality of grades, picking up the die from the wafer, bonding the die onto a substrate or the die using a bonding head, conveying a class substrate corresponding to the class die on the conveyance lane in a unit of the class substrate, and further bonding the class die to the corresponding class substrate based on the classification map.

    Die Bonder and Bonding Method
    4.
    发明申请
    Die Bonder and Bonding Method 审中-公开
    Die Bonder和Bonding Method

    公开(公告)号：US20130068824A1

    公开(公告)日：2013-03-21

    申请号：US13585900

    申请日：2012-08-15

    申请人： Masayuki MOCHIZUKI ,  Hiroshi Maki ,  Yukio Tani ,  Takehito Mochizuki

    发明人： Masayuki MOCHIZUKI ,  Hiroshi Maki ,  Yukio Tani ,  Takehito Mochizuki

    IPC分类号： B23K31/00 ,  B23K37/04

    CPC分类号： H01L22/20 ,  H01L21/67132 ,  H01L21/67144 ,  H01L21/681 ,  H01L22/14 ,  H01L24/75 ,  H01L24/83 ,  H01L2224/7565 ,  H01L2224/757 ,  H01L2224/759 ,  H01L2224/83

    摘要： A bonding method of a die bonder with a single conveyance lane and a single bonding head, or a plurality of conveyance lanes and a plurality of bonding heads includes the steps of generating a classification map of class dies with different electric properties on the wafer, which are classified in accordance with a plurality of grades, picking up the die from the wafer, bonding the die onto a substrate or the die using a bonding head, conveying a class substrate corresponding to the class die on the conveyance lane in a unit of the class substrate, and further bonding the class die to the corresponding class substrate based on the classification map.

    摘要翻译： 具有单个输送通道和单个接合头，或多个输送通道和多个接合头的管芯接合器的接合方法包括以下步骤：在晶片上产生具有不同电特性的类别的分类图，其中 根据多个等级进行分类，从晶片拾取模具，使用结合头将模具接合到基板或模具上，以一个单位的方式将对应于类模的类基板输送在输送通道上 并且基于分类图进一步将类模具结合到相应的类基板。