公开(公告)号：US20120241096A1

公开(公告)日：2012-09-27

申请号：US13224536

申请日：2011-09-02

申请人： Takashi YAMAGAMI ,  Ryuichi Takano ,  Hiroshi Maki ,  Masayuki Mochizuki

发明人： Takashi YAMAGAMI ,  Ryuichi Takano ,  Hiroshi Maki ,  Masayuki Mochizuki

IPC分类号： B32B38/00 ,  B08B5/04 ,  B08B5/02

CPC分类号： H01L21/67028 ,  H01L21/67144 ,  H01L24/75 ,  H01L2924/10253 ,  Y10T156/14 ,  H01L2924/00

摘要： The invention has an object to provide a foreign substance removing device that is capable of quickly and efficiently cleaning substrate surfaces regardless of the size thereof and preventing readhesion of once removed foreign substances as well as to provide a die bonder equipped with the same.The foreign substance removing device of the invention includes: a pickup device to which a dicing film carrying dies thereon is fixed; and a collet for picking up a die separated from the dicing film and placing the die on a substrate having an adhesive applied thereon, and operates to remove foreign substances on the substrate in preparation for application of the adhesive onto the substrate. The foreign substance removing device includes a cleaning nozzle integrating an air outlet orifice and an air inlet orifice.

摘要翻译： 本发明的目的是提供一种异物移除装置，其能够快速有效地清洁基板表面，而不管其尺寸如何，并且防止一次去除的异物的再粘合以及提供装备有该物质的模具接合机。 本发明的异物清除装置包括：固定有其上载有模具的切割膜的拾取装置; 以及用于拾取与切割膜分离的模具的夹头，并将模具放置在其上施加有粘合剂的基板上，并且用于去除衬底上的异物以准备将粘合剂施加到基板上。 异物去除装置包括集成空气出口孔和空气入口孔的清洁喷嘴。

公开(公告)号：US08783319B2

公开(公告)日：2014-07-22

申请号：US13224536

申请日：2011-09-02

申请人： Takashi Yamagami ,  Ryuichi Takano ,  Hiroshi Maki ,  Masayuki Mochizuki

发明人： Takashi Yamagami ,  Ryuichi Takano ,  Hiroshi Maki ,  Masayuki Mochizuki

IPC分类号： B32B38/10

CPC分类号： H01L21/67028 ,  H01L21/67144 ,  H01L24/75 ,  H01L2924/10253 ,  Y10T156/14 ,  H01L2924/00

摘要： The invention has an object to provide a foreign substance removing device that is capable of quickly and efficiently cleaning substrate surfaces regardless of the size thereof and preventing readhesion of once removed foreign substances as well as to provide a die bonder equipped with the same.The foreign substance removing device of the invention includes: a pickup device to which a dicing film carrying dies thereon is fixed; and a collet for picking up a die separated from the dicing film and placing the die on a substrate having an adhesive applied thereon, and operates to remove foreign substances on the substrate in preparation for application of the adhesive onto the substrate. The foreign substance removing device includes a cleaning nozzle integrating an air outlet orifice and an air inlet orifice.

摘要翻译： 本发明的目的是提供一种异物移除装置，其能够快速有效地清洁基板表面，而不管其尺寸如何，并且防止一次去除的异物的再粘合以及提供装备有该物质的模具接合机。 本发明的异物清除装置包括：固定有其上载有模具的切割膜的拾取装置; 以及用于拾取与切割膜分离的模具的夹头，并将模具放置在其上施加有粘合剂的基板上，并且用于去除衬底上的异物以准备将粘合剂施加到基板上。 异物去除装置包括集成空气出口孔和空气入口孔的清洁喷嘴。

公开(公告)号：US20100055878A1

公开(公告)日：2010-03-04

申请号：US12618292

申请日：2009-11-13

申请人： Hiroshi MAKI ,  Masayuki Mochizuki ,  Ryuichi Takano ,  Yoshiaki Makita ,  Haruhiko Fukasawa ,  Keisuke Nadamoto ,  Tatsuyuki Okubo

发明人： Hiroshi MAKI ,  Masayuki Mochizuki ,  Ryuichi Takano ,  Yoshiaki Makita ,  Haruhiko Fukasawa ,  Keisuke Nadamoto ,  Tatsuyuki Okubo

IPC分类号： H01L21/304

CPC分类号： H01L21/67132 ,  H01L21/67092 ,  H01L21/6835 ,  H01L21/6836 ,  H01L21/6838 ,  H01L21/68742 ,  H01L21/78 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/75 ,  H01L24/83 ,  H01L2221/68322 ,  H01L2221/68327 ,  H01L2221/68336 ,  H01L2224/27436 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/8385 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/0132 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/1306 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/3511 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/01032 ,  H01L2924/00 ,  H01L2924/3512

摘要： A technique with which die bonding can be carried out without forming a void in a bond area is provided. A vacuum supply line that connects to a vacuum chuck hole formed in the bottom face of a vacuuming collet and supplies the vacuuming collet with reduced pressure for vacuum chucking a chip is constructed of two systems. That is, the vacuum supply line is so structured that a first pipe and a second pipe connect to the vacuuming collet. The first pipe supplies the vacuuming collet with a vacuum that provides suction force when a chip is unstuck from a dicing tape and transported to a mounting position on a wiring substrate. The second pipe supplies the vacuuming collet with a vacuum that provides suction force when a chip is mounted over a wiring substrate. The intensity of the vacuum (suction force) supplied to the vacuuming collet is controlled by opening or closing valves respectively installed in the pipes.

摘要翻译： 提供了一种可以在不在接合区域形成空隙的情况下进行管芯接合的技术。 连接到真空吸盘孔的真空供给线，其形成在真空夹头的底面，并且用于减压的真空吸盘用于真空夹紧芯片由两个系统构成。 也就是说，真空供给管的结构使得第一管和第二管连接到抽真空夹头。 第一管为真空提供真空，当芯片从切割胶带脱离并传送到布线基板上的安装位置时，该真空提供吸力。 第二个管道为抽真空筒提供一个真空，当芯片安装在布线基板上时，该真空提供吸力。 通过打开或关闭分别安装在管道中的阀门来控制提供给抽真空夹头的真空强度（吸力）。

公开(公告)号：US07629231B2

公开(公告)日：2009-12-08

申请号：US11735741

申请日：2007-04-16

申请人： Hiroshi Maki ,  Masayuki Mochizuki ,  Ryuichi Takano ,  Yoshiaki Makita ,  Haruhiko Fukasawa ,  Keisuke Nadamoto ,  Tatsuyuki Okubo

发明人： Hiroshi Maki ,  Masayuki Mochizuki ,  Ryuichi Takano ,  Yoshiaki Makita ,  Haruhiko Fukasawa ,  Keisuke Nadamoto ,  Tatsuyuki Okubo

IPC分类号： H01L21/00

CPC分类号： H01L21/67132 ,  H01L21/67092 ,  H01L21/6835 ,  H01L21/6836 ,  H01L21/6838 ,  H01L21/68742 ,  H01L21/78 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/75 ,  H01L24/83 ,  H01L2221/68322 ,  H01L2221/68327 ,  H01L2221/68336 ,  H01L2224/27436 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/8385 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/0132 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/1306 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/3511 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/01032 ,  H01L2924/00 ,  H01L2924/3512

摘要： A technique with which die bonding can be carried out without forming a void in a bond area is provided. A vacuum supply line that connects to a vacuum chuck hole formed in the bottom face of a vacuuming collet and supplies the vacuuming collet with reduced pressure for vacuum chucking a chip is constructed of two systems. That is, the vacuum supply line is so structured that a first pipe and a second pipe connect to the vacuuming collet. The first pipe supplies the vacuuming collet with a vacuum that provides suction force when a chip is unstuck from a dicing tape and transported to a mounting position on a wiring substrate. The second pipe supplies the vacuuming collet with a vacuum that provides suction force when a chip is mounted over a wiring substrate. The intensity of the vacuum (suction force) supplied to the vacuuming collet is controlled by opening or closing valves respectively installed in the pipes.

摘要翻译： 提供了一种可以在不在接合区域形成空隙的情况下进行管芯接合的技术。 连接到真空吸盘孔的真空供给线，其形成在真空夹头的底面，并且用于减压的真空吸盘用于真空夹紧芯片由两个系统构成。 也就是说，真空供给管的结构使得第一管和第二管连接到抽真空夹头。 第一管为真空提供真空，当芯片从切割胶带脱离并传送到布线基板上的安装位置时，该真空提供吸力。 第二个管道为抽真空筒提供一个真空，当芯片安装在布线基板上时，该真空提供吸力。 通过打开或关闭分别安装在管道中的阀门来控制提供给抽真空夹头的真空强度（吸力）。

公开(公告)号：US08703583B2

公开(公告)日：2014-04-22

申请号：US12618292

申请日：2009-11-13

申请人： Hiroshi Maki ,  Masayuki Mochizuki ,  Ryuichi Takano ,  Yoshiaki Makita ,  Haruhiko Fukasawa ,  Keisuke Nadamoto ,  Tatsuyuki Okubo

发明人： Hiroshi Maki ,  Masayuki Mochizuki ,  Ryuichi Takano ,  Yoshiaki Makita ,  Haruhiko Fukasawa ,  Keisuke Nadamoto ,  Tatsuyuki Okubo

IPC分类号： H01L21/00

CPC分类号： H01L21/67132 ,  H01L21/67092 ,  H01L21/6835 ,  H01L21/6836 ,  H01L21/6838 ,  H01L21/68742 ,  H01L21/78 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/75 ,  H01L24/83 ,  H01L2221/68322 ,  H01L2221/68327 ,  H01L2221/68336 ,  H01L2224/27436 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/8385 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/0132 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/1306 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/3511 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/01032 ,  H01L2924/00 ,  H01L2924/3512

摘要： A technique with which die bonding can be carried out without forming a void in a bond area is provided. A vacuum supply line that connects to a vacuum chuck hole formed in the bottom face of a vacuuming collet and supplies the vacuuming collet with reduced pressure for vacuum chucking a chip is constructed of two systems. That is, the vacuum supply line is so structured that a first pipe and a second pipe connect to the vacuuming collet. The first pipe supplies the vacuuming collet with a vacuum that provides suction force when a chip is unstuck from a dicing tape and transported to a mounting position on a wiring substrate. The second pipe supplies the vacuuming collet with a vacuum that provides suction force when a chip is mounted over a wiring substrate. The intensity of the vacuum (suction force) supplied to the vacuuming collet is controlled by opening or closing valves respectively installed in the pipes.

摘要翻译： 提供了一种可以在不在接合区域形成空隙的情况下进行管芯接合的技术。 连接到真空吸盘孔的真空供给线，其形成在真空夹头的底面，并且用于减压的真空吸盘用于真空夹紧芯片由两个系统构成。 也就是说，真空供给管的结构使得第一管和第二管连接到抽真空夹头。 第一管为真空提供真空，当芯片从切割胶带脱离并传送到布线基板上的安装位置时，该真空提供吸力。 第二个管道为抽真空筒提供一个真空，当芯片安装在布线基板上时，该真空提供吸力。 通过打开或关闭分别安装在管道中的阀门来控制提供给抽真空夹头的真空强度（吸力）。

公开(公告)号：US20070275544A1

公开(公告)日：2007-11-29

申请号：US11735741

申请日：2007-04-16

申请人： Hiroshi Maki ,  Masayuki Mochizuki ,  Ryuichi Takano ,  Yoshiaki Makita ,  Haruhiko Fukasawa ,  Keisuke Nadamoto ,  Tatsuyuki Okubo

发明人： Hiroshi Maki ,  Masayuki Mochizuki ,  Ryuichi Takano ,  Yoshiaki Makita ,  Haruhiko Fukasawa ,  Keisuke Nadamoto ,  Tatsuyuki Okubo

IPC分类号： H01L21/00

CPC分类号： H01L21/67132 ,  H01L21/67092 ,  H01L21/6835 ,  H01L21/6836 ,  H01L21/6838 ,  H01L21/68742 ,  H01L21/78 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/75 ,  H01L24/83 ,  H01L2221/68322 ,  H01L2221/68327 ,  H01L2221/68336 ,  H01L2224/27436 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/8385 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/0132 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/1306 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/3511 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/01032 ,  H01L2924/00 ,  H01L2924/3512

摘要： A technique with which die bonding can be carried out without forming a void in a bond area is provided. A vacuum supply line that connects to a vacuum chuck hole formed in the bottom face of a vacuuming collet and supplies the vacuuming collet with reduced pressure for vacuum chucking a chip is constructed of two systems. That is, the vacuum supply line is so structured that a first pipe and a second pipe connect to the vacuuming collet. The first pipe supplies the vacuuming collet with a vacuum that provides suction force when a chip is unstuck from a dicing tape and transported to a mounting position on a wiring substrate. The second pipe supplies the vacuuming collet with a vacuum that provides suction force when a chip is mounted over a wiring substrate. The intensity of the vacuum (suction force) supplied to the vacuuming collet is controlled by opening or closing valves respectively installed in the pipes.

摘要翻译： 提供了一种可以在不在接合区域形成空隙的情况下进行管芯接合的技术。 连接到真空吸盘孔的真空供给线，其形成在真空夹头的底面，并且用于减压的真空吸盘用于真空夹紧芯片由两个系统构成。 也就是说，真空供给管的结构使得第一管和第二管连接到抽真空夹头。 第一管为真空提供真空，当芯片从切割胶带脱离并传送到布线基板上的安装位置时，该真空提供吸力。 第二个管道为抽真空筒提供一个真空，当芯片安装在布线基板上时，该真空提供吸力。 通过打开或关闭分别安装在管道中的阀门来控制提供给抽真空夹头的真空强度（吸力）。

公开(公告)号：US5459335A

公开(公告)日：1995-10-17

申请号：US106408

申请日：1993-08-13

申请人： Katsuki Matsushita ,  Shigeru Senbonmatsu ,  Tsuneo Yamazaki ,  Tadao Iwaki ,  Ryuichi Takano

发明人： Katsuki Matsushita ,  Shigeru Senbonmatsu ,  Tsuneo Yamazaki ,  Tadao Iwaki ,  Ryuichi Takano

IPC分类号： G02F1/136 ,  G02F1/1368 ,  H01L21/02 ,  H01L21/20 ,  H01L21/762 ,  H01L27/12 ,  H01L23/14 ,  H01L23/15

CPC分类号： H01L21/76251 ,  H01L21/2007

摘要： A thin film semiconductor substrate for a display device includes a thin film semiconductor circuit layer formed on a single crystal semiconductor substrate and a support substrate formed over the thin film semiconductor circuit layer. An adhesive layer made of a fluorine-containing epoxy family adhesive is provided between the insulating layer and the support substrate. When the single crystal semiconductor substrate is removed, the yield rate in production of the thin film semiconductor substrate is greatly improved.

摘要翻译： 用于显示装置的薄膜半导体衬底包括形成在单晶半导体衬底上的薄膜半导体电路层和形成在薄膜半导体电路层上的支撑衬底。 在绝缘层和支撑基板之间设置由含氟环氧树脂系列粘合剂制成的粘合剂层。 当去除单晶半导体衬底时，薄膜半导体衬底的制造中的成品率大大提高。

公开(公告)号：US5646432A

公开(公告)日：1997-07-08

申请号：US57987

申请日：1993-05-05

申请人： Tadao Iwaki ,  Tsuneo Yamazaki ,  Katsuki Matsushita ,  Shigeru Senbonmatsu ,  Ryuichi Takano

发明人： Tadao Iwaki ,  Tsuneo Yamazaki ,  Katsuki Matsushita ,  Shigeru Senbonmatsu ,  Ryuichi Takano

IPC分类号： G02F1/136 ,  G02F1/1362 ,  G02F1/1368 ,  G06E3/00 ,  H01L21/02 ,  H01L21/20 ,  H01L21/304 ,  H01L21/336 ,  H01L21/762 ,  H01L27/12 ,  H01L29/78 ,  H01L29/786 ,  H01L27/01 ,  H01L23/48 ,  H01L29/00 ,  H01L31/032

CPC分类号： G02F1/13454 ,  G06E3/003 ,  H01L21/2007 ,  H01L27/1203 ,  G02F2202/105

摘要： A semiconductor substrate is provided which has a semiconductor on insulator structure but in which can be formed a thin film integrated circuit having electrical characteristics and microstructure equal to or of greater density than a silicon integrated circuit formed using a bulk single crystal silicon wafer. The semiconductor substrate has a structure which is formed of a sequentially layered single crystal silicon thin film sandwiched between a thermally oxidized silicon film and a silicon oxide or silicon nitride film, an element smoothing layer, a fluoro-epoxy series resin adhesive layer, and a supporting substrate. The single crystal silicon thin film can have integrated circuit devices formed in a sub-micron geometry similar to that of a bulk single crystal silicon. A transparent glass or a bulk single crystal silicon wafer can be used as a supporting substrate. Therefore the semiconductor thin film can integrate a highly fine, dense and compact semiconductor integrated circuit or semiconductor optical element. The semiconductor thin film element has a transparent optical detection region or optical modulation region with 100 million pixels or more.

摘要翻译： 提供了半导体衬底，其具有半导体绝缘体结构，但是其中可以形成具有等于或者比具有大体积单晶硅晶片形成的硅集成电路更高密度的电特性和微结构的薄膜集成电路。 半导体衬底具有由夹在热氧化硅膜和氧化硅或氮化硅膜之间的顺序层叠的单晶硅薄膜，元件平滑层，氟 - 环氧树脂粘合剂层和 支撑衬底。 单晶硅薄膜可以具有类似于大块单晶硅的亚微米几何形状的集成电路器件。 可以使用透明玻璃或块状单晶硅晶片作为支撑基板。 因此，半导体薄膜可以集成高精度，致密和紧凑的半导体集成电路或半导体光学元件。 半导体薄膜元件具有1亿像素以上的透明光检测区域或光调制区域。

公开(公告)号：US6067062A

公开(公告)日：2000-05-23

申请号：US749292

申请日：1991-08-23

申请人： Hiroaki Takasu ,  Yoshikazu Kojima ,  Masaaki Kamiya ,  Tsuneo Yamazaki ,  Hiroshi Suzuki ,  Masaaki Taguchi ,  Ryuichi Takano ,  Satoru Yabe

发明人： Hiroaki Takasu ,  Yoshikazu Kojima ,  Masaaki Kamiya ,  Tsuneo Yamazaki ,  Hiroshi Suzuki ,  Masaaki Taguchi ,  Ryuichi Takano ,  Satoru Yabe

IPC分类号： G02F1/1337 ,  G02F1/136 ,  G02F1/1362 ,  G09G3/20 ,  G09G3/36 ,  G09G5/00 ,  H01L27/12

CPC分类号： G02F1/13454 ,  G02F1/13378 ,  G09G3/3648 ,  H01L27/1214 ,  H01L27/1251 ,  G02F1/136213 ,  G02F2202/105 ,  G09G2330/02 ,  G09G5/006

摘要： A light valve has a composite substrate comprised of an electrically insulating substrate and a semiconductor single crystal thin film formed over the electrically insulating substrate. A pixel array comprising semiconductor switch elements is formed in the semiconductor single crystal thin film. A peripheral circuit having circuit elements is formed in the semiconductor single crystal thin film so that a small-sized, high speed light valve is obtained. X- driver and Y-driver circuits are formed in the semiconductor single crystal thin film and controlled by a control circuit, such as a video signal processing circuit, which receives and processes video signals inputted directly from an external source. The peripheral circuit can be a DRAM sense amplifier for sensing charges stored in each pixel of the pixel array to detect defects in the pixel array. The peripheral circuit can be a photosensor circuit for detecting an intensity of incident light to monitor the performance of a light source of the light valve. The peripheral circuit can be a temperature sensor for detecting the temperature of a liquid crystal layer of the light valve, and may be comprised of Darlington connected NPN transistors formed in the semiconductor single crystal thin film. The peripheral circuit can also be a solar cell for converting incident light into electrical energy to supply power to at least one of the pixel array, X-driver and Y-driver circuits and the peripheral circuit.

摘要翻译： 光阀具有由电绝缘基板和形成在电绝缘基板上的半导体单晶薄膜构成的复合基板。 包含半导体开关元件的像素阵列形成在半导体单晶薄膜中。 在半导体单晶薄膜中形成具有电路元件的外围电路，从而获得小型高速光阀。 X驱动器和Y驱动器电路形成在半导体单晶薄膜中，并由诸如视频信号处理电路的控制电路控制，该电路接收并处理从外部源直接输入的视频信号。 外围电路可以是用于感测存储在像素阵列的每个像素中的电荷的DRAM读出放大器，以检测像素阵列中的缺陷。 外围电路可以是用于检测入射光的强度以监视光阀的光源的性能的光电传感器电路。 外围电路可以是用于检测光阀的液晶层的温度的温度传感器，并且可以由形成在半导体单晶薄膜中的达林顿连接的NPN晶体管组成。 外围电路也可以是用于将入射光转换为电能以向像素阵列，X驱动器和Y驱动器电路和外围电路中的至少一个供电的太阳能电池。

公开(公告)号：US5637187A

公开(公告)日：1997-06-10

申请号：US464075

申请日：1995-06-05

申请人： Hiroaki Takasu ,  Yoshikazu Kojima ,  Masaaki Kamiya ,  Tsuneo Yamazaki ,  Hiroshi Suzuki ,  Masaaki Taguchi ,  Ryuichi Takano ,  Satoru Yabe

发明人： Hiroaki Takasu ,  Yoshikazu Kojima ,  Masaaki Kamiya ,  Tsuneo Yamazaki ,  Hiroshi Suzuki ,  Masaaki Taguchi ,  Ryuichi Takano ,  Satoru Yabe

IPC分类号： G02F1/1337 ,  G02F1/136 ,  G02F1/1362 ,  G09G3/20 ,  G09G3/36 ,  G09G5/00 ,  H01L27/12 ,  H01L21/00

CPC分类号： G02F1/13454 ,  G02F1/13378 ,  G09G3/3648 ,  H01L27/1214 ,  H01L27/1251 ,  G02F1/136213 ,  G02F2202/105 ,  G09G2330/02 ,  G09G5/006

摘要： A process for forming a light valve device comprises forming a semiconductor single crystal film to form a composite substrate by polishing a semiconductor single crystal substrate after an electric insulating substrate has been bonded thereto; forming a group of pixel electrodes for defining a pixel region and a group of switch elements for selectively energizing the pixel electrodes by integrating a pixel array portion over the composite substrate; forming a liquid crystal aligning means for the pixel region; superposing an opposed substrate over the composite substrate with a gap therebetween; and filling the gap with liquid crystal material.

摘要翻译： 形成光阀装置的方法包括：形成半导体单晶膜，以在电绝缘基板已经结合之后通过抛光半导体单晶基板来形成复合基板; 形成用于限定像素区域的一组像素电极和一组开关元件，用于通过在复合衬底上积分像素阵列部分来选择性地激励像素电极; 形成用于像素区域的液晶对准装置; 在复合基板上叠置相对的基板，其间具有间隙; 并用液晶材料填充间隙。