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    Thermoplastic polyester resin composition and molded object obtained therefrom
    1.
    发明申请
    Thermoplastic polyester resin composition and molded object obtained therefrom 审中-公开
    热塑性聚酯树脂组合物及其制得的成型体

    公开(公告)号：US20060041056A1

    公开(公告)日：2006-02-23

    申请号：US10530515

    申请日：2003-11-06

    申请人： Takenobu Sunagawa ,  Hiroshi Tone ,  Hideyuki Sakamoto ,  Hiroki Nakajima ,  Yasushi Nakanishi ,  Mamoru Kadokura

    发明人： Takenobu Sunagawa ,  Hiroshi Tone ,  Hideyuki Sakamoto ,  Hiroki Nakajima ,  Yasushi Nakanishi ,  Mamoru Kadokura

    IPC分类号： C08G63/48

    CPC分类号： C08L67/02 ,  C08L33/068 ,  C08L51/00 ,  C08L51/04 ,  C08L2666/02

    摘要： The present invention provides a thermoplastic polyester resin composition, which exhibits stable processability in extrusion molding, blow molding and calender molding, particularly in profile extrusion and extrusion molding of boards and pipes, by efficiently enhancing melt viscosity of thermoplastic polyester resin, and gives a molded article having favorable surface properties and excellent impact strength. By compounding (B) 0.1 to 50 parts by weight of a viscosity modifier for thermoplastic polyester resin comprising (a) 3 to 95% by weight of alkyl(meth)acrylate containing an epoxy group, (b) 5 to 97% by weight of another alkyl(meth)acrylate and (c) 0 to 92% by weight of another vinyl monomer copolymerizable therewith, and having weight average molecular weight of 1,000 to 400,000; and (C) 1 to 50 parts by weight of a core-shell graft polymer, based on (A) 100 parts by weight of thermoplastic polyester resin, stable processability is exhibited in extrusion molding and a molded article having favorable surface properties and excellent impact strength is obtained.

    摘要翻译： 本发明提供一种热塑性聚酯树脂组合物，其通过有效提高热塑性聚酯树脂的熔融粘度，在挤出成型，吹塑成型和压延成型中特别是板材和管材的型材挤出和挤出成型中表现出稳定的加工性能， 制品具有良好的表面性能和优异的冲击强度。 通过配合（B）0.1〜50重量份的热塑性聚酯树脂用粘度调节剂，其包含（a）3〜95重量％的含有环氧基的（甲基）丙烯酸烷基酯，（b）5〜97重量％ 另外（甲基）丙烯酸烷基酯和（c）0〜92重量％的可与其共聚的其它乙烯基单体，重均分子量为1,000〜400,000; 和（C）1〜50重量份的核 - 壳接枝聚合物，基于（A）100重量份的热塑性聚酯树脂，在挤出成型中表现出稳定的加工性，并且具有良好的表面性能和优异的冲击的成型品 获得强度。

    Viscosity modifier for thermoplastic polyester resin, thermoplastic resin composition containing the same and molded article comprising the same
    2.
    发明申请
    Viscosity modifier for thermoplastic polyester resin, thermoplastic resin composition containing the same and molded article comprising the same 审中-公开
    热塑性聚酯树脂用粘度调节剂，含有该热塑性聚酯树脂的热塑性树脂组合物和包含其的模制品

    公开(公告)号：US20060116496A1

    公开(公告)日：2006-06-01

    申请号：US10530358

    申请日：2003-10-28

    申请人： Takenobu Sunagawa ,  Hiroshi Tone ,  Hideyuki Sakamoto ,  Yasushi Nakanishi ,  Mamoru Kadokura

    发明人： Takenobu Sunagawa ,  Hiroshi Tone ,  Hideyuki Sakamoto ,  Yasushi Nakanishi ,  Mamoru Kadokura

    IPC分类号： C08F118/02

    CPC分类号： C08F220/18 ,  C08F220/32 ,  C08L33/14 ,  C08L67/02 ,  C08L2666/04

    摘要： 0.1 to 50 parts of a viscosity modifier for thermoplastic polyester resin comprising (a) 15 to 95% by weight alkyl (meth)acrylate containing an epoxy group, (b) 5 to 85% by weight of another alkyl (meth)acrylate and (c) 0 to 80% by weight of another vinyl monomer copolymerizable therewith and having weight average molecular weight of 1,000 to 400,000 is compounded, based on 100 parts by weight of a thermoplastic polyester resin. As a result, melt viscosity of thermoplastic polyester resin can be efficiently improved, stable processability is exhibited in extrusion molding, blow molding and calender molding, particularly profile extrusion and extrusion molding of boards and pipes which are extremely difficult, and a molded article having favorable surface properties is obtained.

    摘要翻译： 0.1〜50份热塑性聚酯树脂用粘度调节剂，其含有（a）15〜95重量％的含有环氧基的（甲基）丙烯酸烷基酯，（b）5〜85重量％的其它（甲基）丙烯酸烷基酯和（甲基） c）基于100重量份的热塑性聚酯树脂，混合0-80重量％的可与其共聚并且重均分子量为1,000至400,000的其它乙烯基单体。 结果，可以有效地提高热塑性聚酯树脂的熔融粘度，在挤出成型，吹塑成型和压延成型，特别是非常困难的板和管的型材挤出和挤出成型中表现出稳定的加工性， 获得表面性质。

    Circuit device
    4.
    发明授权
    Circuit device 有权
    电路设备

    公开(公告)号：US08102655B2

    公开(公告)日：2012-01-24

    申请号：US12837078

    申请日：2010-07-15

    申请人： Hideyuki Sakamoto ,  Hidefumi Saito ,  Yasuhiro Koike ,  Masao Tsukizawa

    发明人： Hideyuki Sakamoto ,  Hidefumi Saito ,  Yasuhiro Koike ,  Masao Tsukizawa

    IPC分类号： H05K7/20

    CPC分类号： H05K1/144 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4903 ,  H01L2224/73265 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/14 ,  H01L2924/3025 ,  H05K3/284 ,  H05K3/3447 ,  H05K5/065 ,  H05K2201/042 ,  H05K2201/10318 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014

    摘要： Provided is a circuit device capable of increasing the packaging density and preventing the thermal interference between circuit elements to be incorporated. In a hybrid integrated circuit device, a first circuit board and a second circuit board are fitted into a case member in a way that the first circuit board is overlaid with the second circuit board. A first circuit element is arranged on the upper surface of the first circuit board and a second circuit element is arranged on the upper surface of the second circuit board. Furthermore, inside the case member, provided is a hollow portion that is not filled with a sealing resin. Such a configuration prevents the second circuit element, which is a microcomputer, from operating unstably due to a heat generated in the first circuit element, which is a power transistor, for example.

    摘要翻译： 提供了能够增加封装密度并防止引入电路元件之间的热干扰的电路装置。 在混合集成电路装置中，第一电路板和第二电路板以第一电路板与第二电路板重叠的方式装配到壳体构件中。 第一电路元件布置在第一电路板的上表面上，第二电路元件布置在第二电路板的上表面上。 此外，在壳体内设置有未填充有密封树脂的中空部。 这样的结构防止作为微型计算机的第二电路元件例如由于在作为功率晶体管的第一电路元件中产生的热而不稳定地运行。

    Circuit device
    5.
    发明授权
    Circuit device 有权
    电路设备

    公开(公告)号：US07782628B2

    公开(公告)日：2010-08-24

    申请号：US12239250

    申请日：2008-09-26

    申请人： Hideyuki Sakamoto ,  Hidefumi Saito ,  Yasuhiro Koike ,  Masao Tsukizawa

    发明人： Hideyuki Sakamoto ,  Hidefumi Saito ,  Yasuhiro Koike ,  Masao Tsukizawa

    IPC分类号： H05K7/20

    CPC分类号： H05K1/144 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4903 ,  H01L2224/73265 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/14 ,  H01L2924/3025 ,  H05K3/284 ,  H05K3/3447 ,  H05K5/065 ,  H05K2201/042 ,  H05K2201/10318 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014

    摘要： Provided is a circuit device capable of increasing the packaging density and preventing the thermal interference between circuit elements to be incorporated. In a hybrid integrated circuit device, a first circuit board and a second circuit board are fitted into a case member in a way that the first circuit board is overlaid with the second circuit board. A first circuit element is arranged on the upper surface of the first circuit board and a second circuit element is arranged on the upper surface of the second circuit board. Furthermore, inside the case member, provided is a hollow portion that is not filled with a sealing resin. Such a configuration prevents the second circuit element, which is a microcomputer, from operating unstably due to a heat generated in the first circuit element, which is a power transistor, for example.

    摘要翻译： 提供了能够增加封装密度并防止引入电路元件之间的热干扰的电路装置。 在混合集成电路装置中，第一电路板和第二电路板以第一电路板与第二电路板重叠的方式装配到壳体构件中。 第一电路元件布置在第一电路板的上表面上，第二电路元件布置在第二电路板的上表面上。 此外，在壳体内设置有未填充有密封树脂的中空部。 这样的结构防止作为微型计算机的第二电路元件例如由于在作为功率晶体管的第一电路元件中产生的热而不稳定地运行。

    Circuit device and method of manufacturing the same
    8.
    发明授权
    Circuit device and method of manufacturing the same 有权
    电路装置及其制造方法

    公开(公告)号：US08995139B2

    公开(公告)日：2015-03-31

    申请号：US13331784

    申请日：2011-12-20

    申请人： Hideyuki Sakamoto

    发明人： Hideyuki Sakamoto

    IPC分类号： H05K5/00 ,  H01L23/31 ,  H05K3/28 ,  H01L21/56 ,  H05K3/00

    CPC分类号： H01L23/3107 ,  B29C45/14008 ,  B29C45/14819 ,  B29L2031/3425 ,  H01L21/565 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/19105 ,  H05K3/0052 ,  H05K3/0097 ,  H05K3/284 ,  H05K2201/09154 ,  H05K2203/1316 ,  H05K2203/1545 ,  H01L2924/00014 ,  H01L2924/00

    摘要： Provided is a circuit device in which encapsulating resin to encapsulate a circuit board is optimized in shape, and a method of manufacturing the circuit device. A hybrid integrated circuit device, which is a circuit device according to the present invention includes a circuit board, a circuit element mounted on a top surface of the circuit board, and encapsulating resin encapsulating the circuit element, and coating the top surface, side surfaces, and a bottom surface of the circuit board. In addition, the encapsulating resin is partly recessed and thereby provided with recessed areas at two sides of the circuit board. The providing of the recessed areas reduces the amount of resin to be used, and prevents the hybrid integrated circuit device from being deformed by the cure shrinkage of the encapsulating resin.

    摘要翻译： 提供一种电路装置，其中密封电路板的封装树脂的形状优化，以及制造电路装置的方法。 作为根据本发明的电路装置的混合集成电路装置包括电路板，安装在电路板的顶表面上的电路元件和封装电路元件的封装树脂，并且将顶表面，侧表面 ，以及电路板的底面。 此外，封装树脂部分凹陷，从而在电路板的两侧设置有凹陷区域。 凹陷区域的设置减少了使用的树脂的量，并且防止混合集成电路器件由于封装树脂的固化收缩而变形。