Multilayer ceramic chip capacitor
    1.
    发明授权
    Multilayer ceramic chip capacitor 失效
    多层陶瓷片式电容器

    公开(公告)号:US5335139A

    公开(公告)日:1994-08-02

    申请号:US90257

    申请日:1993-07-13

    IPC分类号: H01G4/12 H01G7/00

    摘要: A multilayer ceramic chip capacitor includes alternately stacked dielectric layers and internal electrode layers. The dielectric layers contain barium titanate as a major component and magnesium oxide, manganese oxide, barium oxide and/or calcium oxide, silicon oxide and optionally, yttrium oxide as minor components in such a proportion that there are present 0.1-3 mol of MgO, 0.05-1.0 mol of MnO, 2-12 mol of BaO+CaO, 2-12 mol of SiO.sub.2 and up to 1 mol of Y.sub.2 O.sub.3 per 100 mol of BaTiO.sub.3. The capacitor satisfies the standard temperature dependence of capacitance and shows a minimized change of capacitance with time under an applied DC electric field and a long insulation resistance life. Where the dielectric layers contain 0.1-3 mol of MgO, 1-5 mol of Y.sub.2 O.sub.3, 2-12 mol of BaO+CaO, and 2-12 mol of SiO.sub.2 per 100 mol of BaTiO.sub.3, the capacitor shows improved DC bias performance.

    摘要翻译: 多层陶瓷片状电容器包括交替堆叠的电介质层和内部电极层。 电介质层含有钛酸钡作为主要成分,氧化镁,氧化锰,氧化钡和/或氧化钙,氧化硅和任选的氧化钇为少量成分,其中存在0.1-3mol的MgO, 0.05〜1.0摩尔的MnO,2〜12摩尔的BaO + CaO,2〜12摩尔的SiO 2和1摩尔的Y 2 O 3/100摩尔的BaTiO 3。 电容器满足电容的标准温度依赖性,并且在施加的直流电场和长绝缘电阻寿命下显示电容随时间的最小化变化。 当电介质层含有0.1-3mol的MgO,1-5mol的Y2O3,2-12mol的BaO + CaO和2-12mol的SiO 2 / 100mol的BaTiO 3时,电容器显示出改善的DC偏置性能。

    Low-temperature co-fired ceramics material and multilayer wiring board using the same
    8.
    发明申请
    Low-temperature co-fired ceramics material and multilayer wiring board using the same 有权
    低温共烧陶瓷材料和使用其的多层线路板

    公开(公告)号:US20050288167A1

    公开(公告)日:2005-12-29

    申请号:US11166367

    申请日:2005-06-27

    摘要: Objects of the present invention are to provide a low-temperature co-fired ceramic material having a coefficient of linear thermal expansion controlled and has a high dielectric constant, and to reduce the warpage of a fired product even if it has an unsymmetrical lamination structure in a multilayer wiring board in which glass-ceramic mixed layers of different compositions are laminated. A low-temperature co-fired ceramic material in accordance with the present invention includes: SiO2—B2O3—Al2O3-alkaline earth metal oxide based glass, alumina, titania, and cordierite; glass, titania, and cordierite; or glass, titania, and mullite. When a multilayer wiring board is made of the low-temperature co-fired ceramic material, the content of cordierite or mullite of the substrate material is adjusted to control a difference in a coefficient of linear thermal expansion between the layers of the substrate material to not more than 0.25×10−6/° C.

    摘要翻译: 本发明的目的是提供一种具有控制线性热膨胀系数并具有高介电常数的低温共烧陶瓷材料,并且即使其具有不对称层压结构也能减少烧制产品的翘曲 层叠不同组成的玻璃 - 陶瓷混合层的多层布线基板。 根据本发明的低温共烧陶瓷材料包括:SiO 2 -S 2 O 3 O 3 -Al < 碱土金属氧化物基玻璃,氧化铝,二氧化钛和堇青石; 玻璃,二氧化钛和堇青石; 或玻璃,二氧化钛和莫来石。 当由低温共烧陶瓷材料制成多层布线板时,调整基板材料的堇青石或莫来石的含量,以控制基板材料层之间的线性热膨胀系数的差异 大于0.25×10 -6 /℃