Semiconductor light emitting device having a reflective material, wavelength converting layer and optical plate with rough and plane surface regions, and method of manufacturing
    1.
    发明授权
    Semiconductor light emitting device having a reflective material, wavelength converting layer and optical plate with rough and plane surface regions, and method of manufacturing 有权
    具有反射材料,波长转换层和具有粗糙和平面表面区域的光学板的半导体发光器件及其制造方法

    公开(公告)号:US08581287B2

    公开(公告)日:2013-11-12

    申请号:US13355754

    申请日:2012-01-23

    IPC分类号: H01L33/00

    摘要: A semiconductor light-emitting device and a method for manufacturing the same can include a wavelength converting layer in order to emit various colored lights including white light. The device can include a board, a frame located on the board, at least one light-emitting chip mounted on the board, the wavelength converting layer located between an optical plate and an outside surface of the chips so that a density of a peripheral region is lower than that of a middle region, and a reflective material layer disposed at least between the frame and a side surface of the wavelength-converting layer. The device can have the reflective material layer form each reflector and can use a wavelength converting layer having different densities, and therefore can emit a wavelength-converted light having a high light-emitting efficiency and a uniform color tone from various small light-emitting surfaces.

    摘要翻译: 半导体发光器件及其制造方法可以包括波长转换层,以便发射包括白光的各种彩色光。 该装置可以包括板,位于板上的框架,安装在板上的至少一个发光芯片,位于光学板和芯片外表面之间的波长转换层,使得周边区域的密度 低于中间区域,反射材料层至少设置在框架与波长转换层的侧面之间。 该装置可以具有由反射体形成的反射材料层,并且能够使用具有不同密度的波长转换层,因此能够从各种小的发光面发射具有高发光效率和均匀色调的波长转换光 。

    Semiconductor light emitting device having a reflective material with a side slant surface and method of manufacturing
    2.
    发明授权
    Semiconductor light emitting device having a reflective material with a side slant surface and method of manufacturing 有权
    具有具有侧面倾斜表面的反射材料和制造方法的半导体发光器件

    公开(公告)号:US08461610B2

    公开(公告)日:2013-06-11

    申请号:US13162151

    申请日:2011-06-16

    IPC分类号: H01L33/00

    摘要: A semiconductor light-emitting device and a method for manufacturing the same can include a wavelength converting layer located over at least one semiconductor light-emitting chip in order to emit various colored lights including white light. The semiconductor light-emitting device can include a base board, a frame located on the base board, the chip mounted on the base board, a transparent material layer located between the wavelength converting layer and a side surface of the chip so as to extend toward the wavelength converting layer, and a reflective material layer disposed at least between the frame and both side surfaces of the wavelength converting layer and the transparent material layer. The semiconductor light-emitting device can be configured to improve light-emitting efficiency of the chip by using the reflective material layer as a reflector, and therefore can emit a wavelength-converted light having a high light-emitting efficiency from a small light-emitting surface.

    摘要翻译: 半导体发光器件及其制造方法可以包括位于至少一个半导体发光芯片上的波长转换层,以便发射包括白光的各种彩色光。 半导体发光装置可以包括基板,位于基板上的框架,安装在基板上的芯片,位于波长转换层和芯片的侧表面之间的透明材料层,以朝向 波长转换层和至少设置在波长转换层和透明材料层的框架和两个侧表面之间的反射材料层。 半导体发光装置可以通过使用反射材料层作为反射器来提高芯片的发光效率,因此可以从小的发光部分发射具有高发光效率的波长转换光 表面。

    SEMICONDUCTOR LIGHT-EMITTING DEVICE AND MANUFACTURING METHOD
    3.
    发明申请
    SEMICONDUCTOR LIGHT-EMITTING DEVICE AND MANUFACTURING METHOD 有权
    半导体发光器件及制造方法

    公开(公告)号:US20110309388A1

    公开(公告)日:2011-12-22

    申请号:US13162151

    申请日:2011-06-16

    IPC分类号: H01L33/08 H01L33/60 H01L33/50

    摘要: A semiconductor light-emitting device and a method for manufacturing the same can include a wavelength converting layer located over at least one semiconductor light-emitting chip in order to emit various colored lights including white light. The semiconductor light-emitting device can include a base board, a frame located on the base board, the chip mounted on the base board, a transparent material layer located between the wavelength converting layer and a side surface of the chip so as to extend toward the wavelength converting layer, and a reflective material layer disposed at least between the frame and both side surfaces of the wavelength converting layer and the transparent material layer. The semiconductor light-emitting device can be configured to improve light-emitting efficiency of the chip by using the reflective material layer as a reflector, and therefore can emit a wavelength-converted light having a high light-emitting efficiency from a small light-emitting surface.

    摘要翻译: 半导体发光器件及其制造方法可以包括位于至少一个半导体发光芯片上的波长转换层,以便发射包括白光的各种彩色光。 半导体发光装置可以包括基板,位于基板上的框架,安装在基板上的芯片,位于波长转换层和芯片的侧表面之间的透明材料层,以朝向 波长转换层和至少设置在波长转换层和透明材料层的框架和两个侧表面之间的反射材料层。 半导体发光装置可以通过使用反射材料层作为反射器来提高芯片的发光效率,因此可以从小的发光部分发射具有高发光效率的波长转换光 表面。

    SEMICONDUCTOR LIGHT-EMITTING DEVICE AND MANUFACTURING METHOD
    4.
    发明申请
    SEMICONDUCTOR LIGHT-EMITTING DEVICE AND MANUFACTURING METHOD 有权
    半导体发光器件及制造方法

    公开(公告)号:US20120025218A1

    公开(公告)日:2012-02-02

    申请号:US13196868

    申请日:2011-08-02

    IPC分类号: H01L33/50

    摘要: A semiconductor light-emitting device and a method for manufacturing the same can include a wavelength converting layer located on at least one semiconductor light-emitting chip in order to emit various colored lights including white light. The semiconductor light-emitting device can include a base board, the chip mounted on the base board and a transparent plate disposed on the wavelength converting layer including a spacer and a phosphor having a high density. The wavelength converting layer can be formed in a thin uniform thickness between the transparent plate and a top surface of the chip using the spacer so as to extend toward the transparent plate. The semiconductor light-emitting device can be configured to improve light-emitting efficiency of the chip by using the thin wavelength converting layer including the phosphor having a high density, and therefore can emit a wavelength-converted light having a high light-emitting efficiency from a small light-emitting surface.

    摘要翻译: 半导体发光器件及其制造方法可以包括位于至少一个半导体发光芯片上的波长转换层,以便发射包括白光的各种彩色光。 半导体发光装置可以包括基板,安装在基板上的芯片和布置在波长转换层上的透明板,该透明板包括间隔物和具有高密度的荧光体。 波长转换层可以使用间隔物在透明板和芯片的顶表面之间以均匀的厚度形成,以朝向透明板延伸。 半导体发光器件可以通过使用包括具有高密度的荧光体的薄波长转换层来提高芯片的发光效率,因此可以发射具有高发光效率的波长转换光 一个小的发光面。

    Semiconductor light-emitting device for producing wavelength-converted light and method for manufacturing the same
    6.
    发明授权
    Semiconductor light-emitting device for producing wavelength-converted light and method for manufacturing the same 有权
    用于生产波长转换光的半导体发光器件及其制造方法

    公开(公告)号:US08921877B2

    公开(公告)日:2014-12-30

    申请号:US13196868

    申请日:2011-08-02

    IPC分类号: H01L33/00 H01L33/50 H01L33/48

    摘要: A semiconductor light-emitting device and a method for manufacturing the same can include a wavelength converting layer located on at least one semiconductor light-emitting chip in order to emit various colored lights including white light. The semiconductor light-emitting device can include a base board, the chip mounted on the base board and a transparent plate disposed on the wavelength converting layer including a spacer and a phosphor having a high density. The wavelength converting layer can be formed in a thin uniform thickness between the transparent plate and a top surface of the chip using the spacer so as to extend toward the transparent plate. The semiconductor light-emitting device can be configured to improve light-emitting efficiency of the chip by using the thin wavelength converting layer including the phosphor having a high density, and therefore can emit a wavelength-converted light having a high light-emitting efficiency from a small light-emitting surface.

    摘要翻译: 半导体发光器件及其制造方法可以包括位于至少一个半导体发光芯片上的波长转换层,以便发射包括白光的各种彩色光。 半导体发光装置可以包括基板,安装在基板上的芯片和布置在波长转换层上的透明板,该透明板包括间隔物和具有高密度的荧光体。 波长转换层可以使用间隔物在透明板和芯片的顶表面之间以均匀的厚度形成,以朝向透明板延伸。 半导体发光器件可以通过使用包括具有高密度的荧光体的薄波长转换层来提高芯片的发光效率,因此可以发射具有高发光效率的波长转换光 一个小的发光面。

    LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME
    7.
    发明申请
    LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME 有权
    发光装置及其制造方法

    公开(公告)号:US20130033169A1

    公开(公告)日:2013-02-07

    申请号:US13567031

    申请日:2012-08-04

    IPC分类号: H01J1/62 H01J9/00

    摘要: There is provided a method for producing a light emitting device having a small light emitting area and showing high light extraction efficiency. An uncured resin 13′ is dropped on either one or both of a light emitting element 11 and a tabular member 14 in such an amount that the resin is maintained on them by surface tension, the light emitting element 11 and the tabular member 14 are piled up with the uncured resin 13′ maintained between them and on a side of the light emitting element by surface tension of the uncured resin 13′ to form an uncured resin layer 13′ having an inclined side 130, and then the resin layer 13 is cured. The tabular member is constituted with a material having an alkali metal oxide content of 0.2% by weight or lower.

    摘要翻译: 提供一种具有小的发光面积并且显示出高的光提取效率的发光器件的制造方法。 将未固化的树脂13'落在发光元件11和板状构件14的一个或两个上,其量使得树脂通过表面张力保持在其上,发光元件11和平板状构件14被堆叠 通过未固化树脂13'的表面张力保持在它们之间和发光元件的侧面上的未固化树脂13',形成具有倾斜侧130的未固化树脂层13',然后树脂层13固化 。 板状构件由碱金属氧化物含量为0.2重量%以下的材料构成。

    Light source and vehicle lamp
    8.
    发明授权
    Light source and vehicle lamp 有权
    光源和车灯

    公开(公告)号:US08142060B2

    公开(公告)日:2012-03-27

    申请号:US12372831

    申请日:2009-02-18

    IPC分类号: F21S8/10

    摘要: The disclosed subject matter includes light sources that have high use efficiency and a favorable bright distribution, and includes vehicle lamps that have both a favorable light distribution pattern and a capability of being simply composed by using the LED light sources. The light source can include a base board, at least one die bonding pad and wire bonding pad on the base board, at least one LED chip mounted on the die bonding pad and connected to respective bonding pads, and an encapsulating resin over the LED chip. The at least one LED chip can emit a uniform light with a distribution electrode on a top surface thereof and can form a favorable light distribution using a shield electrode on the top surface. The vehicle lamp can include the light source and an optical lens selected according to a kind and/or design of a vehicle lamp.

    摘要翻译: 所公开的主题包括具有高使用效率和良好的亮度分布的光源,并且包括具有良好的配光图案和能够简单地通过使用LED光源的能力的车辆灯。 光源可以包括基板,至少一个裸片接合焊盘和基板上的引线键合焊盘,安装在芯片焊盘上并连接到各个焊盘的至少一个LED芯片以及LED芯片上的封装树脂 。 至少一个LED芯片可以在其顶表面上发射具有分配电极的均匀光,并且可以在顶表面上使用屏蔽电极形成良好的光分布。 车灯可以包括光源和根据车灯的种类和/或设计选择的光学透镜。

    LED and method of manufacturing the same
    9.
    发明申请
    LED and method of manufacturing the same 有权
    LED及其制造方法

    公开(公告)号:US20060038187A1

    公开(公告)日:2006-02-23

    申请号:US11199168

    申请日:2005-08-09

    申请人: Kazuhiko Ueno

    发明人: Kazuhiko Ueno

    IPC分类号: H01L33/00

    摘要: An LED can include a pair of electrode members, and an LED chip joined to a chip mount portion disposed at the extremity of one of the pair of electrode members. The LED chip can be electrically connected to the pair of electrode members. A transparent resin portion can include a wavelength conversion material mixed therein, the transparent resin portion formed in such a manner as to surround the LED chip, wherein the LED chip is positioned offset toward one side in the transparent resin portion, and wherein the wavelength conversion material mixed in the transparent resin portion has a higher density around the LED chip within the transparent resin portion.

    摘要翻译: LED可以包括一对电极构件和连接到设置在该对电极构件之一的末端的芯片安装部分的LED芯片。 LED芯片可以电连接到一对电极部件。 透明树脂部分可以包括混合在其中的波长转换材料,透明树脂部分以围绕LED芯片的方式形成,其中LED芯片定位为偏离透明树脂部分中的一侧,并且其中波长转换 在透明树脂部分中混合的材料在透明树脂部分内的LED芯片周围具有更高的密度。

    White LED light source device and LED backlight using the same
    10.
    发明授权
    White LED light source device and LED backlight using the same 有权
    白色LED光源装置和LED背光使用相同

    公开(公告)号:US07810947B2

    公开(公告)日:2010-10-12

    申请号:US11950100

    申请日:2007-12-04

    IPC分类号: F21V9/00

    摘要: A white LED light source device and an LED backlight using the white LED light source can produce, among other features, white light with sufficient luminous intensity, uniform color tone, and high luminous utilization efficiency. A light path for producing white light with favorable color mixture can be shortened. The white LED light source device can be configured to include a bluish green LED lamp which can emit bluish green light by the combination of a blue LED device and a green phosphor material and a purple LED lamp which can emit purple light by the combination of a blue LED device and a red phosphor material. The bluish green light from the bluish green LED lamp and the purple light from the purple LED lamp are subjected to additive color mixture to produce white light with a spectrum containing three primary color wavelength components.

    摘要翻译: 使用白色LED光源的白色LED光源装置和LED背光源可以产生具有足够的发光强度,均匀色调和高发光效率的白光等特征。 可以缩短用于产生具有良好颜色混合物的白光的光路。 白色LED光源装置可以被配置为包括蓝绿色LED灯,其可以通过蓝色LED装置和绿色荧光体材料的组合发出蓝绿色光,以及紫色LED灯,其可以通过组合发出紫色光 蓝色LED装置和红色荧光体材料。 来自蓝绿色LED灯的蓝绿色绿色和紫色LED灯的紫色光被加入混色,产生含有三原色波长成分的光谱的白光。