摘要:
On a substrate a protective layer is formed which can suppress the diffusion of a contaminant from the substrate. On the protective layer, thus formed, a resin layer is formed. The resin layer comprises a photosensitive composition containing a compound which has a substituent group capable of being decomposed or cross-linked in the presence of an acid, and a compound which can generate an acid when exposed to light. The resin layer is pattern-exposed to light and then baked at a predetermined temperature. The resin layer is developed, whereby the exposed portions of the resin layer are removed or left, thus forming a pattern comprising lines and spaces each having a predetermined width. Each of the lines of the pattern has a cross-section having neither sloped profile nor undercut profile, and the pattern therefore has an improved resolution.
摘要:
A photosensitive composition comprises an alkali-soluble resin, a compound which has a substituent group decomposable by an acid and generates an alkali-soluble group upon decomposition of the substituent group, or a compound which has a substituent group capable of crosslinking the alkali-soluble resin in the presence of an acid, and a compound which generates an acid upon exposure, which is represented by formula (1) given below: ##STR1## wherein R.sub.11 represents a monovalent organic group or a monovalent organic group into which at least one selected from the group consisting of a halogen atom, a nitro group, and a cyano group is introduced, each of R.sub.12, R.sub.13, and R.sub.14 independently represents hydrogen, a halogen atom, a nitro group, a cyano group, a monovalent organic group, or a monovalent organic group into which at least one selected from the group consisting of a halogen atom, a nitro group, and a cyano group is introduced.
摘要:
A photosensitive composition comprising: an acid-decomposable compound having at least one substituent which is decomposed by an acid, forming a product which reacts with alkali solution and forms --COO.sup.- or --SO.sub.3.sup.- ; and a compound which generates an acid when exposed to a chemical radiation. If necessary, the composition further comprises an alkali-soluble polymer. The acid-decomposable compound is one which is represented by the following formula (1), and the alkali-soluble polymer has a softening point of 150.degree. C. or more and an average molecular weight of 3000 to 8000. When used as photoresist, the composition can form a fine resist pattern. ##STR1## where R.sub.1 and R.sub.2 are either the same or different, each of which represents at least one selected from the group consisting of hydrogen, halogen atom, cyano group, nitro group, silyl group, and monovalent organic group; X represents >C.dbd.O or --SO.sub.2 --; Y represents a divalent organic group; R.sub.1 and R.sub.2 can be bonded together, forming a ring; and at least one of R.sub.1, R.sub.2, and Y has a substituent which is decomposed by an acid.
摘要:
A photosensitive composition comprising: an acid-decomposable compound having at least one substituent which is decomposed by an acid, forming a product which reacts with alkali solution and forms —COO— or —SO3—; and a compound which generates an acid when exposed to a chemical radiation. If necessary, the composition further comprises an alkali-soluble polymer. The acid-decomposable compound is one which is represented by the following formula (1), and the alkali-soluble polymer has a softening point of 150° C. or more and an average molecular weight of 3000 to 8000. When used as photoresist, the composition can form a fine resist pattern. where R1 and R2 are either the same or different, each of which represents at least one selected from the group consisting of hydrogen, halogen atom, cyano group, nitro group, silyl group, and monovalent organic group; X represents
摘要:
A photosensitive composition comprising: an acid-decomposable compound having at least one substituent which is decomposed by an acid, forming a product which reacts with alkali solution and forms —COO− or —SO3−; and a compound which generates an acid when exposed to a chemical radiation. If necessary, the composition further comprises an alkali-soluble polymer. The acid-decomposable compound is one which is represented by the following formula (1), and the alkali-soluble polymer has a softening point of 150° C. or more and an average molecular weight of 3000 to 8000. When used as photoresist, the composition can form a fine resist pattern. where R1 and R2 are either the same or different, each of which represents at least one selected from the group consisting of hydrogen, halogen atom, cyano group, nitro group, silyl group, and monovalent organic group; X represents >C═O or —SO2—; Y represents a divalent organic group; R1 and R2 can be bonded together, forming a ring; and at least one of R1, R2, and Y has a substituent which is decomposed by an acid.
摘要:
A photosensitive composition comprising a polymer having a repeating segment represented by the following general formula (1A) and a compound which is capable of generating an acid by irradiation of an actinic radiation. wherein R11 is a hydrogen atom, an aliphatic hydrocarbon group, an alcoxy group, a halogen atom or a cyano group, R12 is an aliphatic hydrocarbon group or a cyclic olefin, R13 is either one of (a) a straight-chain olefin having 2 to 12 carbon atoms, a cyclic olefin or a heterocyclic group and (b) a hydrocarbon group represented by — (CH2)m—(m is an integer of 3 to 9), and R14 is a hydrophilic group.
摘要:
The present invention provides a pattern forming process. The process comprises the following steps. (1) A photosensitive material is prepared by coating a photosensitive composition onto the surface of a substrate. The photosensitive composition comprises the following components: (a) an acid generator which generates an acid when irradiated with actinic radiation, and (b) a compound containing carboxyl groups, which can decompose upon decarboxylation. (2) The photosensitive material is subjected to pattern-wise exposure to actinic radiation, thereby allowing the acid generator (a) to generate an acid in the exposed area. (3) The acid generated in the exposed area is neutralized with a basic compound (c). (4) The carboxyl groups in the carboxyl-group-containing compound (b) in the unexposed area are decarboxylated by applying conditions under which the basic compound (c) can catalyze decarboxylation. (5) The photosensitive material, and composition used in the above process are developed. The basic compound (c) can be introduced in advance into the photosensitive material prepared in step (1). By using such a pattern forming process or a photosensitive composition, a pattern can successfully be formed with high reproducibility without being affected by the environment.
摘要:
Disclosed is a positive photosensitive composition, comprising an alkali soluble resin having at least some or all of the alkali soluble groups protected by a substituent which can be decomposed by an acid, a compound which generates an acid upon irradiation with an actinic radiation, and a compound which generates water under action of an acid catalyst.
摘要:
The objectives of the present invention are to provide a photosensitive composition having high solubility to organic solvents as well as to alkaline developers or water-base developers of pH 11 or less, and to provide a pattern forming process for obtaining a high-resolution resist pattern. These objectives are achieved by means of a photosensitive composition comprising a compound which is glassy at room temperature and has a cyclic structure with three or more aromatic rings containing an acid-decomposable substituent, and a pattern forming process wherein a photosensitive material using said photosensitive composition is exposed to a light pattern and developed with an aqueous solution of an alkali or with a water-base developer of pH 11 or less.
摘要:
According to the present invention, a resist resin having in its structure a specific bridged-bond-containing aliphatic ring, and a resist composition comprising the same are provided. By using this resist composition, a resist pattern excellent in both transparency against short-wavelength light and dry-etching resistance can be formed by alkali development with high resolution.