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1.发明授权Semiconductor device including wiring excellent in impedance matching, and method for designing the same 有权包括阻抗匹配优良的布线的半导体装置及其设计方法公开(公告)号：US08089004B2
公开(公告)日：2012-01-03
申请号：US12232889
申请日：2008-09-25
申请人： Tatsuaki Tsukuda , Masayoshi Hirata
发明人： Tatsuaki Tsukuda , Masayoshi Hirata
IPC分类号： H05K1/16
CPC分类号： H05K1/0228 , G06F17/5063 , H01L24/73 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/73265 , H01L2924/15182 , H01L2924/15192 , H01L2924/15311 , H01L2924/30107 , H01L2924/3011 , H05K1/141 , H05K2201/10378 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
摘要： A semiconductor device includes an interposer, and a semiconductor chip mounted on the interposer. In a plan view, the interposer includes a first region overlapping the semiconductor chip, and a second region excluding the first region. The interposer includes at least one wiring formed astride the first region and the second region. The cross-sectional area of the wiring in the first region and the cross-sectional area of the wiring in the second region are different from each other.
摘要翻译： 半导体器件包括插入器和安装在插入器上的半导体芯片。 在平面图中，插入器包括与半导体芯片重叠的第一区域和除第一区域之外的第二区域。 插入器包括横跨第一区域和第二区域的至少一个布线。 第一区域中的布线的横截面积和第二区域中的布线的横截面积彼此不同。
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公开(公告)号：US08363421B2
公开(公告)日：2013-01-29
申请号：US12382599
申请日：2009-03-19
申请人： Tatsuaki Tsukuda , Masayoshi Hirata
发明人： Tatsuaki Tsukuda , Masayoshi Hirata
CPC分类号： H01L24/16 , H01L23/50 , H01L23/552 , H01L23/66 , H01L24/28 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2223/6611 , H01L2223/6627 , H01L2224/13099 , H01L2224/16225 , H01L2224/16237 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/484 , H01L2224/49171 , H01L2224/73204 , H01L2224/73265 , H01L2924/00014 , H01L2924/01004 , H01L2924/01006 , H01L2924/01033 , H01L2924/01074 , H01L2924/014 , H01L2924/078 , H01L2924/14 , H01L2924/15311 , H01L2924/15787 , H01L2924/181 , H01L2924/19032 , H01L2924/19051 , H01L2924/19107 , H01L2924/30107 , H01L2924/3011 , H01L2924/30111 , H05K1/0224 , H05K1/025 , H05K1/0253 , H05K3/341 , H05K2201/093 , H05K2201/1028 , H05K2203/049 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/05599
摘要： A semiconductor device has a wiring board having a wiring, a semiconductor chip that is mounted on the wiring board, and an electric conductor reference plane provided in the inside of the wiring board, in which in top view. The wiring includes a first region that overlaps the electric conductor reference plane and a second region that is the whole region except for the first region. A conductor chip is mounted above the second region.
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3.发明申请Semiconductor device including wiring excellent in impedance matching, and method for designing the same 有权包括阻抗匹配优良的布线的半导体装置及其设计方法公开(公告)号：US20090084592A1
公开(公告)日：2009-04-02
申请号：US12232889
申请日：2008-09-25
申请人： Tatsuaki Tsukuda , Masayoshi Hirata
发明人： Tatsuaki Tsukuda , Masayoshi Hirata
CPC分类号： H05K1/0228 , G06F17/5063 , H01L24/73 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/73265 , H01L2924/15182 , H01L2924/15192 , H01L2924/15311 , H01L2924/30107 , H01L2924/3011 , H05K1/141 , H05K2201/10378 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
摘要： A semiconductor device includes an interposer, and a semiconductor chip mounted on the interposer. In a plan view, the interposer includes a first region overlapping the semiconductor chip, and a second region excluding the first region. The interposer includes at least one wiring formed astride the first region and the second region. The cross-sectional area of the wiring in the first region and the cross-sectional area of the wiring in the second region are different from each other.
摘要翻译： 半导体器件包括插入器和安装在插入器上的半导体芯片。 在平面图中，插入件包括与半导体芯片重叠的第一区域和除第一区域之外的第二区域。 插入器包括横跨第一区域和第二区域的至少一个布线。 第一区域中的布线的横截面积和第二区域中的布线的横截面积彼此不同。
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4.发明申请Semiconductor device having wiring formed on wiring board and electric conductor formed in wiring board and conductor chip formed over wiring 有权具有形成在布线板上的布线的半导体器件和形成在布线板上的电导体和布线上形成的导体芯片公开(公告)号：US20090244869A1
公开(公告)日：2009-10-01
申请号：US12382599
申请日：2009-03-19
申请人： Tatsuaki Tsukuda , Masayoshi Hirata
发明人： Tatsuaki Tsukuda , Masayoshi Hirata
CPC分类号： H01L24/16 , H01L23/50 , H01L23/552 , H01L23/66 , H01L24/28 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2223/6611 , H01L2223/6627 , H01L2224/13099 , H01L2224/16225 , H01L2224/16237 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/484 , H01L2224/49171 , H01L2224/73204 , H01L2224/73265 , H01L2924/00014 , H01L2924/01004 , H01L2924/01006 , H01L2924/01033 , H01L2924/01074 , H01L2924/014 , H01L2924/078 , H01L2924/14 , H01L2924/15311 , H01L2924/15787 , H01L2924/181 , H01L2924/19032 , H01L2924/19051 , H01L2924/19107 , H01L2924/30107 , H01L2924/3011 , H01L2924/30111 , H05K1/0224 , H05K1/025 , H05K1/0253 , H05K3/341 , H05K2201/093 , H05K2201/1028 , H05K2203/049 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/05599
摘要： A semiconductor device has a wiring board having a wiring, a semiconductor chip that is mounted on the wiring board, and an electric conductor reference plane provided in the inside of the wiring board, in which in top view. The wiring includes a first region that overlaps the electric conductor reference plane and a second region that is the whole region except for the first region. A conductor chip is mounted above the second region.
摘要翻译： 半导体器件具有布线板，布线板，安装在布线板上的半导体芯片和设置在布线板内部的电导体基准面，其顶视图。 布线包括与导电体参考平面重叠的第一区域和除了第一区域之外的整个区域的第二区域。 导体芯片安装在第二区域上方。
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