公开(公告)号：US20080236872A1

公开(公告)日：2008-10-02

申请号：US11632793

申请日：2005-06-03

申请人： Tatsuo Kataoka ,  Yoshikazu Akashi ,  Yutaka Iguchi ,  Hiroaki Kurihara ,  Naoya Yasui

发明人： Tatsuo Kataoka ,  Yoshikazu Akashi ,  Yutaka Iguchi ,  Hiroaki Kurihara ,  Naoya Yasui

IPC分类号： H05K1/00 ,  H05K3/00

CPC分类号： H05K3/26 ,  H05K3/06 ,  H05K3/067 ,  H05K3/244 ,  H05K3/388 ,  H05K2201/0761 ,  H05K2203/1157 ,  H05K2203/1476 ,  Y10T29/49124

摘要： The printed wiring board of the present invention is a printed wiring board produced by selectively etching a base film having a base metal layer and a conductive metal layer, which are formed on an insulating film, through plural etching steps comprising a conductive metal etching step and a base metal etching step to form a wiring pattern and then bringing the base film having the thus formed wiring pattern into contact with a reducing aqueous solution containing a reducing substance, wherein the amount of a residual metal derived from the etching solution on the printed wiring board is not more than 0.05 μg/cm2. According to the present invention, the metal derived from the etching solution is removed by the use of a reducing substance-containing solution. Therefore, the water rinsing step in the production process can be shortened, occurrence of migration attributable to the residual metal can be prevented, and a printed wiring board having high reliability can be efficiently produced.

摘要翻译： 本发明的印刷电路板是通过多个蚀刻步骤选择性地蚀刻形成在绝缘膜上的具有基底金属层和导电金属层的基膜而制造的印刷线路板，其中包括导电金属蚀刻步骤和 贱金属蚀刻步骤，以形成布线图形，然后将具有如此形成的布线图案的基底膜与含有还原物质的还原水溶液接触，其中源自印刷布线上的蚀刻溶液的残余金属的量 板不超过0.05毫升/厘米2。 根据本发明，通过使用还原性物质的溶液除去来自蚀刻溶液的金属。 因此，可以缩短生产过程中的水洗步骤，可以防止由于残留金属引起的迁移的发生，并且可以有效地生产具有高可靠性的印刷线路板。

公开(公告)号：US07523548B2

公开(公告)日：2009-04-28

申请号：US10580948

申请日：2004-12-02

申请人： Tatsuo Kataoka ,  Yoshikazu Akashi ,  Yutaka Iguchi

发明人： Tatsuo Kataoka ,  Yoshikazu Akashi ,  Yutaka Iguchi

IPC分类号： H05K3/02 ,  B05D5/12

CPC分类号： H05K3/06 ,  H05K3/381 ,  H05K3/388 ,  H05K2201/0338 ,  H05K2201/098 ,  Y10T29/49124 ,  Y10T29/49155 ,  Y10T29/5164

摘要： A process for producing a printed wiring board comprises the steps of depositing a base metal on at least one surface of an insulating film to form a base metal layer and further depositing copper or a copper alloy to form a conductive metal layer, then removing a surface metal layer, which is formed through the above step, by etching to form a wiring pattern, and then treating the base metal layer with a treating liquid capable of dissolving and/or passivating the metal that forms the base metal layer. The printed wiring board so provided comprises an insulating film and a wiring pattern formed on at least one surface of the insulating film, the wiring pattern including a base metal layer deposited on the insulating film surface and a conductive metal layer, the base metal layer for forming the wiring pattern protrudes in a widthwise direction more than the conductive metal layer for forming the wiring pattern.

摘要翻译： 一种制造印刷电路板的方法包括以下步骤：在绝缘膜的至少一个表面上沉积贱金属以形成贱金属层，并进一步沉积铜或铜合金以形成导电金属层，然后除去表面 通过蚀刻形成布线图案，然后用能够溶解和/或钝化形成基底金属层的金属的处理液对基底金属层进行处理。 所提供的印刷电路板包括绝缘膜和形成在绝缘膜的至少一个表面上的布线图案，布线图案包括沉积在绝缘膜表面上的基底金属层和导电金属层，所述基底金属层用于 形成布线图案比形成布线图案的导电金属层的宽度方向突出。

公开(公告)号：US20070145584A1

公开(公告)日：2007-06-28

申请号：US10583846

申请日：2004-12-10

申请人： Tatsuo Kataoka ,  Yoshikazu Akashi ,  Yutaka Iguchi

发明人： Tatsuo Kataoka ,  Yoshikazu Akashi ,  Yutaka Iguchi

IPC分类号： H01L23/48

CPC分类号： C25D5/02 ,  C25D7/00 ,  H01L2924/0002 ,  H05K3/06 ,  H05K3/067 ,  H05K3/22 ,  H05K3/388 ,  H05K2201/0338 ,  H05K2201/098 ,  H05K2203/0346 ,  H05K2203/1476 ,  H01L2924/00

摘要： The printed wiring board comprises, on at least one surface of an insulating film, a base metal layer and a conductive metal layer formed on the base metal layer, and is characterized in that in a section of the wiring board the bottom width of the conductive metal layer is smaller than the top width of the base metal layer. The circuit device comprises the printed wiring board and an electronic part mounted thereon. The process for producing a printed wiring board comprises bringing a base metal layer and a conductive metal layer into contact with an etching solution capable of dissolving the conductive metal to form a wiring pattern and then sequentially bringing the resultant into contact with a first treating solution capable of dissolving the metal for forming the base metal layer, a microetching solution capable of selectively dissolving the conductive metal and a second treating solution having a different chemical composition from the first treating solution in this order.

摘要翻译： 印刷布线板在绝缘膜的至少一个表面上包括形成在基底金属层上的基底金属层和导电金属层，其特征在于，在布线板的一部分中，导电的底部宽度 金属层比基体金属层的顶部宽度小。 电路装置包括印刷线路板和安装在其上的电子部件。 制造印刷电路板的方法包括使基底金属层和导电金属层与能够溶解导电金属的蚀刻溶液接触以形成布线图案，然后顺序地使得到的第一处理溶液与第一处理溶液接触 溶解用于形成基底金属层的金属，能够依次从第一处理溶液中选择性地溶解导电金属的微蚀刻溶液和具有不同化学组成的第二处理溶液。

公开(公告)号：US20070111401A1

公开(公告)日：2007-05-17

申请号：US10581880

申请日：2004-09-02

申请人： Tatsuo Kataoka ,  Yoshikazu Akashi ,  Yutaka Iguchi

发明人： Tatsuo Kataoka ,  Yoshikazu Akashi ,  Yutaka Iguchi

IPC分类号： H01L21/82 ,  H01L27/10

CPC分类号： H05K3/06 ,  H05K3/002 ,  H05K3/26 ,  H05K3/388 ,  H05K2201/0338 ,  H05K2201/0761 ,  H05K2203/1476

摘要： A printed wiring board manufacturing process comprises forming a conductive metal layer on at least one surface of an insulating film with a sputtered metal layer in between, selectively etching the conductive metal layer and the sputtered metal layer to produce a wiring pattern, treating the laminated film with a first treatment liquid capable of dissolving nickel of the sputtered metal layer, and treating with a second treatment liquid capable of dissolving chrome of the sputtered metal layer and also capable of eliminating the sputtered metal layer in the insulating film to remove a superficial surface of the insulating film exposed from the wiring pattern together with the residual sputtered metals in the superficial surface. A printed wiring board comprises an insulating film and a wiring pattern, wherein the insulating film in an area exposed from the wiring pattern has a thickness smaller by 1 to 100 nm than that of an area under the wiring pattern. The process eliminates the sputtered metals combined with the insulating film together with the superficial surface of the insulating film, and therefore the insulating film surface between wires does not contain any residual metals and a short circuit between wires is prevented.

摘要翻译： 印刷电路板的制造方法包括在绝缘膜的至少一个表面上形成导电金属层，其间具有溅射金属层，选择性地蚀刻导电金属层和溅射金属层以产生布线图案，处理层叠膜 使用能够溶解溅射金属层的镍的第一处理液，并且用能够溶解溅射金属层的铬的第二处理液进行处理，并且还能够消除绝缘膜中的溅射金属层以去除表面的表面 所述绝缘膜与所述布线图案一起暴露在所述表面的残余溅射金属。 印刷布线板包括绝缘膜和布线图案，其中从布线图案露出的区域中的绝缘膜的厚度比布线图案下面的区域的厚度小1〜100nm。 该工艺消除了与绝缘膜结合的溅射金属以及绝缘膜的表面，因此导线之间的绝缘膜表面不含有任何残余金属，并且防止了导线之间的短路。

公开(公告)号：US07495177B2

公开(公告)日：2009-02-24

申请号：US10581880

申请日：2004-12-02

申请人： Tatsuo Kataoka ,  Yoshikazu Akashi ,  Yutaka Iguchi

发明人： Tatsuo Kataoka ,  Yoshikazu Akashi ,  Yutaka Iguchi

IPC分类号： H05K1/03

CPC分类号： H05K3/06 ,  H05K3/002 ,  H05K3/26 ,  H05K3/388 ,  H05K2201/0338 ,  H05K2201/0761 ,  H05K2203/1476

摘要： A printed wiring board manufacturing process comprises forming a conductive metal layer on at least one surface of an insulating film with a sputtered metal layer in between, selectively etching the conductive metal layer and the sputtered metal layer to produce a wiring pattern, treating the laminated film with a first treatment liquid capable of dissolving nickel of the sputtered metal layer, and treating with a second treatment liquid capable of dissolving chrome of the sputtered metal layer and also capable of eliminating the sputtered metal layer in the insulating film to remove a superficial surface of the insulating film exposed from the wiring pattern together with the residual sputtered metals in the superficial surface. A printed wiring board comprises an insulating film and a wiring pattern, wherein the insulating film in an area exposed from the wiring pattern has a thickness smaller by 1 to 100 nm than that of an area under the wiring pattern. The process eliminates the sputtered metals combined with the insulating film together with the superficial surface of the insulating film, and therefore the insulating film surface between wires does not contain any residual metals and a short circuit between wires is prevented.

摘要翻译： 印刷电路板的制造方法包括在绝缘膜的至少一个表面上形成导电金属层，其间具有溅射金属层，选择性地蚀刻导电金属层和溅射金属层以产生布线图案，处理层叠膜 使用能够溶解溅射金属层的镍的第一处理液，并且用能够溶解溅射金属层的铬的第二处理液进行处理，并且还能够消除绝缘膜中的溅射金属层以去除表面的表面 所述绝缘膜与所述布线图案一起暴露在所述表面的残余溅射金属。 印刷布线板包括绝缘膜和布线图案，其中从布线图案露出的区域中的绝缘膜的厚度比布线图案下面的区域的厚度小1〜100nm。 该工艺消除了与绝缘膜结合的溅射金属以及绝缘膜的表面，因此导线之间的绝缘膜表面不含有任何残余金属，并且防止了导线之间的短路。

公开(公告)号：US20070101571A1

公开(公告)日：2007-05-10

申请号：US10580948

申请日：2004-12-02

申请人： Tatsuo Kataoka ,  Yoshikazu Akashi ,  Yutaka Iguchi

发明人： Tatsuo Kataoka ,  Yoshikazu Akashi ,  Yutaka Iguchi

IPC分类号： H05K3/00

CPC分类号： H05K3/06 ,  H05K3/381 ,  H05K3/388 ,  H05K2201/0338 ,  H05K2201/098 ,  Y10T29/49124 ,  Y10T29/49155 ,  Y10T29/5164

摘要： [Solution means] A process for producing a printed wiring board comprises the steps of depositing a base metal on at least one surface of an insulating film to form a base metal layer and further depositing copper or a copper alloy to form a conductive metal layer, then removing a surface metal layer, which is formed through the above step, by etching to form a wiring pattern, and then treating the base metal layer with a treating liquid capable of dissolving and/or passivating the metal that forms the base metal layer. The printed wiring board so provided comprises an insulating film and a wiring pattern formed on at least one surface of the insulating film, the wiring pattern including a base metal layer deposited on the insulating film surface and a conductive metal layer, the base metal layer for forming the wiring pattern protrudes in a widthwise direction more than the conductive metal layer for forming the wiring pattern.

摘要翻译： [解决方案]印刷电路板的制造方法包括以下步骤：在绝缘膜的至少一个表面上沉积贱金属以形成贱金属层，并进一步沉积铜或铜合金以形成导电金属层， 然后通过蚀刻去除通过上述步骤形成的表面金属层以形成布线图案，然后用能够溶解和/或钝化形成基底金属层的金属的处理液处理基底金属层。 所提供的印刷电路板包括绝缘膜和形成在绝缘膜的至少一个表面上的布线图案，布线图案包括沉积在绝缘膜表面上的基底金属层和导电金属层，所述基底金属层用于 形成布线图案比形成布线图案的导电金属层的宽度方向突出。

公开(公告)号：US5118386A

公开(公告)日：1992-06-02

申请号：US452198

申请日：1989-12-18

申请人： Tatsuo Kataoka ,  Yutaka Iguchi

发明人： Tatsuo Kataoka ,  Yutaka Iguchi

IPC分类号： H01L21/60 ,  H01L21/48 ,  H05K1/00 ,  H05K3/06 ,  H05K3/24 ,  H05K3/28 ,  H05K3/40

CPC分类号： H05K3/4007 ,  H01L21/4853 ,  H05K1/0393 ,  H05K2201/0367 ,  H05K2203/0384 ,  H05K2203/054 ,  H05K3/064 ,  H05K3/281

摘要： A printed circuit board having a plurality of bumps that serve for connection terminals, the bumps being formed by covering the printed circuit except portions where the bumps are to be formed, applying an electroplating onto the uncovered bump-forming portions on the printed circuit maintaining a thickness nearly equal to that of the covering, applying thereon a non-electrolytic plating and electroplating on the whole surface from the surfaces of the bump-forming portions to the surfaces of the covered portions, and removing the platings by etching from the surface except the bump portions.

摘要翻译： 一种印刷电路板，具有用于连接端子的多个凸块，所述凸块通过覆盖印刷电路而形成，除了要形成凸点的部分之外，在印刷电路板上的未覆盖的凸起形成部分上施加电镀， 厚度几乎等于覆盖层的厚度，从凸起形成部分的表面到覆盖部分的表面，在整个表面上施加非电解电镀和电镀，并且通过蚀刻从除了 凸起部分。

公开(公告)号：US07377032B2

公开(公告)日：2008-05-27

申请号：US10991921

申请日：2004-11-18

申请人： Shinichi Sumi ,  Yutaka Iguchi

发明人： Shinichi Sumi ,  Yutaka Iguchi

IPC分类号： H05K3/02

CPC分类号： H05K3/4069 ,  H05K1/113 ,  H05K3/246 ,  H05K2201/0347 ,  H05K2201/0394 ,  H05K2201/09909 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/53548

摘要： A printed wiring board for mounting electronic components includes an insulating layer and a wiring pattern formed on one surface of the insulating layer, wherein one end portion of a filled via 4 is connected with the wiring pattern and the other end portion is overlaid with a covering layer 9 obtained by applying a conductive paste to cover at least the boundary between the filled via 4 and the insulating layer 2; alternatively, a plating resist 7 is formed at the other end portion to cover at least the boundary between the filled via 4 and the insulating layer 2, and is removed after an end portion of the filled via 4 enclosed within the plating resist 7 is plated to produce a terminal layer, thereby preventing a wet processing liquid such as a tin plating solution from leaking in between the filled via 4 and the insulating layer 2.

摘要翻译： 一种用于安装电子部件的印刷线路板包括绝缘层和形成在绝缘层的一个表面上的布线图案，其中填充的通孔4的一个端部与布线图案连接，另一个端部覆盖有覆盖层 通过施加导电浆料至少覆盖填充的通孔4和绝缘层2之间的边界获得的层9; 可选地，在另一端部形成电镀抗蚀剂7，以至少覆盖填充的通孔4和绝缘层2之间的边界，并且在封装在电镀抗蚀剂7中的填充通孔4的端部被电镀之后被去除 以制造端子层，从而防止诸如镀锡溶液之类的湿处理液体在填充的通孔4和绝缘层2之间泄漏。

公开(公告)号：US20060063401A1

公开(公告)日：2006-03-23

申请号：US10946131

申请日：2004-09-22

申请人： Kohji Ariga ,  Yutaka Iguchi ,  Hisayasu Mase

发明人： Kohji Ariga ,  Yutaka Iguchi ,  Hisayasu Mase

IPC分类号： H05K1/00

CPC分类号： H05K5/0039 ,  H01R12/7023 ,  H01R12/724

摘要： A fixing member includes a case member provided with at least a substrate supporting member adjusted to support a substrate and integrally provided with a connector, a cap member adjusted to be fixed to the case member, at least an external force transmitting portion extending at the substrate supporting member between the substrate supporting member and the cap member and adjusted to transmit an external force subjected to the connector to the cap member while the case member has been fixed at the cap member.

公开(公告)号：US20050111205A1

公开(公告)日：2005-05-26

申请号：US10991921

申请日：2004-11-18

申请人： Shinichi Sumi ,  Yutaka Iguchi

发明人： Shinichi Sumi ,  Yutaka Iguchi

IPC分类号： H05K1/11 ,  H05K3/24 ,  H05K3/40

CPC分类号： H05K3/4069 ,  H05K1/113 ,  H05K3/246 ,  H05K2201/0347 ,  H05K2201/0394 ,  H05K2201/09909 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/53548

摘要： A printed wiring board for mounting electronic components includes an insulating layer and a wiring pattern formed on one surface of the insulating layer, wherein one end portion of a filled via 4 is connected with the wiring pattern and the other end portion is overlaid with a covering layer 9 obtained by applying a conductive paste to cover at least the boundary between the filled via 4 and the insulating layer 2; alternatively, a plating resist 7 is formed at the other end portion to cover at least the boundary between the filled via 4 and the insulating layer 2, and is removed after an end portion of the filled via 4 enclosed within the plating resist 7 is plated to produce a terminal layer, thereby preventing a wet processing liquid such as a tin plating solution from leaking in between the filled via 4 and the insulating layer 2.

摘要翻译： 一种用于安装电子部件的印刷线路板包括绝缘层和形成在绝缘层的一个表面上的布线图案，其中填充的通孔4的一个端部与布线图案连接，另一个端部覆盖有覆盖层 通过施加导电浆料至少覆盖填充的通孔4和绝缘层2之间的边界获得的层9; 可选地，在另一端部形成电镀抗蚀剂7，以至少覆盖填充的通孔4和绝缘层2之间的边界，并且在封装在电镀抗蚀剂7中的填充通孔4的端部被电镀之后被去除 以制造端子层，从而防止诸如镀锡溶液之类的湿处理液体在填充的通孔4和绝缘层2之间泄漏。