摘要:
Disclosed is a device and a method for enabling a programmable semiconductor memory device to provide a block selection transistor of a high voltage withstand type, to prevent the voltage from being decreased at the time of programming, to prevent the readout current from being decreased and to provide a constant sum resistance of the electrically conductive regions without dependency upon the memory cell locations.
摘要:
A method of manufacturing a semiconductor device include a step of forming an insulating layer, which is obtained by building up a first oxide film, a nitride film and a second oxide film on a substrate in the order mentioned, and a Salicide step of forming a Salicide-structure gate electrode on the insulating film. A silicidation reaction between the substrate surface and an N+ diffusion region is prevented in the Salicide step by causing the insulating layer to remain even in a region on the substrate besides that immediately underlying the gate electrode.
摘要:
A plurality of gate electrodes are formed over a semiconductor substrate of a first conductivity type, and impurities of a second conductivity type are introduced into the substrate with a mask of the gate electrodes, to form source/drain impurity regions. Then, an insulating pattern is formed on the gate electrode and the source/drain impurity regions, and impurities of the second conductivity type are introduced into the substrate with a mask of the insulating pattern, to form a deep base region which is connected to one of the source/drain impurity regions. Also, impurities of the first conductivity type are introduced into the substrate with a mask of the insulating pattern, to form a shallow emitter region.
摘要:
A non-volatile storage device (1), such as a flash memory, that may include a plurality of sectors and additional sectors has been disclosed. Sectors may include a physical sector number. A logical sector number may be assigned to a sector with additional sectors not assigned a logical sector number. When an erase/write command is executed for a logical sector address, an additional sector may be selected to have the new or updated data written into and may be assigned the logical sector number. The additional sector assigned the logical sector number may then have the new or updated data written into while the physical sector number previously assigned the logical address is being erased. In this way, an apparent erase time may be reduced. The newly erased sector may be a new additional sector. Each sector may include a control data section (101) and a data section (102). Control data section (101) may store control data for controlling erasing and rewriting.
摘要:
A semiconductor memory device includes a first insulating film provided on a semiconductor substrate between first and second diffusion regions, a first gate electrode provided on the first insulating film, a second insulating film provided on the semiconductor substrate between the second diffusion region and a third diffusion region, and a second gate electrode provided on the second insulating film. The first and second diffusion regions, first insulating film, and first gate electrode constitute a first memory cell, while the second and third diffusion regions, second insulating film, and second gate electrode constitute a second memory cell. The first and second gate electrodes are connected in common to form a word line electrode. The first and third diffusion regions are connected to first and second read bit lines. The second diffusion region is connected to a program and erase bit line.
摘要:
A NAND ROM with an improved integration level is described. A number of trenches are formed in stripe pattern at the surface of a semiconductor substrate, and an insulating film for isolation between devices is formed at the sidewalls, respectively, of each trench. A first unit array consisting of MOSFETs connected in series is arranged in each first active region defined between two adjacent trenches. A second active region is defined in the bottom of each trench and a second unit array is arranged therein. Distinguished from the trench isolation technique which provides trenches between unit arrays, instead, according to the present invention, sidewalls of insulating film are formed. The trench width is limited to the minimum feature size involving the lithography. On the other hand, the width of the insulating-film sidewalls are independent of the limitation, permitting the size of the 64-Mbit mask ROM chip to be about 2 mm smaller.
摘要:
In a semiconductor memory comprising one main bit line D1, a pair of main ground lines VG1 and VD2, a plurality of memory cell banks to be selectively connected to the main bit line D1 and the main ground lines VG1 and VD2, and a plurality of word lines W1 to Wn extending through the memory cell banks, each of the memory cell banks includes a plurality of wirings L1, L2, L3, L4 and L5 located in parallel to each other, and a threshold of a block selection transistor BT11 connected between the main bit line D1 and the wiring L3, is lower than that of block selection transistors BT12 and BT13 connected between the main bit line D1 and the wiring L2 and between the main bit line D1 and the wiring L4, respectively.
摘要:
A 2-bit cell is made up of first and second diffusion regions provided on a substrate surface, first and second storage nodes adjacent to the first and second diffusion region, first and second gate electrodes provided on first and second storage nodes, a third storage node provided on the substrate and a third gate electrode provided on the third storage node. The first and second gate electrodes are connected common to form word line electrodes. A control gate electrode at right angles to the word line electrodes and a third diffusion region in the substrate surface disposed at a longitudinal end of the control gate electrode are provided. A storage node, Node 1, of interest, with the control gate channel as a drain, is read without the intermediary of the second node, which is not of interest, such that reading of Node 1 unaffected by the second node.
摘要:
When a data bit is read out from a semiconductor read only memory device, a current-mirror type sense amplifier is electrically connected through a bit line, a first selector, a selected memory cell and a second selector to a discharging line so as to check a potential drop on the bit line, and each of the first and second selectors selectively connects the bit line or the discharging line to eight columns of memory cells by increasing the component switching transistors thereof so as to space the bit line from the discharging line, thereby increasing a margin for a bit line contact.
摘要:
In a process for fabricating a semiconductor read only memory, a gate oxidation film is grown on a semiconductor substrate, and a first polycrystalline silicon layer is then grown on the gate oxidation film. The semicondctor substrate is provided with element separating trenches each passing through the gate oxidation film. Then, the element separating trenches are buried with a seccond polycrystalline silicon layer which provides no contamination for a channel portion and the gate oxidation film.