Method for manufacturing NAND type semiconductor memory device
    3.
    发明授权
    Method for manufacturing NAND type semiconductor memory device 失效
    用于制造NAND型半导体存储器件的方法

    公开(公告)号:US5593904A

    公开(公告)日:1997-01-14

    申请号:US451548

    申请日:1995-05-26

    IPC分类号: H01L21/8246 H01L27/112

    CPC分类号: H01L27/1126 H01L27/112

    摘要: A plurality of gate electrodes are formed over a semiconductor substrate of a first conductivity type, and impurities of a second conductivity type are introduced into the substrate with a mask of the gate electrodes, to form source/drain impurity regions. Then, an insulating pattern is formed on the gate electrode and the source/drain impurity regions, and impurities of the second conductivity type are introduced into the substrate with a mask of the insulating pattern, to form a deep base region which is connected to one of the source/drain impurity regions. Also, impurities of the first conductivity type are introduced into the substrate with a mask of the insulating pattern, to form a shallow emitter region.

    摘要翻译: 在第一导电类型的半导体衬底上形成多个栅电极,并且用栅电极的掩模将第二导电类型的杂质引入到衬底中,以形成源/漏杂质区。 然后,在栅电极和源极/漏极杂质区上形成绝缘图案,并且用绝缘图案的掩模将第二导电类型的杂质引入到衬底中,以形成连接到绝缘图案的深基区 的源极/漏极杂质区域。 此外,第一导电类型的杂质用绝缘图案的掩模引入到衬底中,以形成浅的发射极区域。

    Non-volatile storage device and rewrite control method thereof
    4.
    发明授权
    Non-volatile storage device and rewrite control method thereof 有权
    非易失性存储装置及其重写控制方法

    公开(公告)号:US07039775B2

    公开(公告)日:2006-05-02

    申请号:US10164657

    申请日:2002-06-06

    IPC分类号: G06F12/00

    CPC分类号: G06F12/0246

    摘要: A non-volatile storage device (1), such as a flash memory, that may include a plurality of sectors and additional sectors has been disclosed. Sectors may include a physical sector number. A logical sector number may be assigned to a sector with additional sectors not assigned a logical sector number. When an erase/write command is executed for a logical sector address, an additional sector may be selected to have the new or updated data written into and may be assigned the logical sector number. The additional sector assigned the logical sector number may then have the new or updated data written into while the physical sector number previously assigned the logical address is being erased. In this way, an apparent erase time may be reduced. The newly erased sector may be a new additional sector. Each sector may include a control data section (101) and a data section (102). Control data section (101) may store control data for controlling erasing and rewriting.

    摘要翻译: 已经公开了可以包括多个扇区和附加扇区的诸如闪存的非易失性存储设备(1)。 部门可以包括物理部门号码。 可以将逻辑扇区号分配给具有未分配逻辑扇区号的附加扇区的扇区。 当对逻辑扇区地址执行擦除/写入命令时,可以选择附加扇区以将新的或更新的数据写入并且可以分配逻辑扇区号。 分配逻辑扇区号的附加扇区然后可以在先前分配了逻辑地址的物理扇区号被擦除的同时写入新的或更新的数据。 以这种方式,可以减少表观擦除时间。 新擦除的行业可能是新增的行业。 每个扇区可以包括控制数据部分(101)和数据部分(102)。 控制数据部(101)可以存储用于控制擦除和重写的控制数据。

    Semiconductor memory device and control method and manufacturing method thereof
    5.
    发明授权
    Semiconductor memory device and control method and manufacturing method thereof 失效
    半导体存储器件及其控制方法及其制造方法

    公开(公告)号:US06979856B2

    公开(公告)日:2005-12-27

    申请号:US10648295

    申请日:2003-08-27

    摘要: A semiconductor memory device includes a first insulating film provided on a semiconductor substrate between first and second diffusion regions, a first gate electrode provided on the first insulating film, a second insulating film provided on the semiconductor substrate between the second diffusion region and a third diffusion region, and a second gate electrode provided on the second insulating film. The first and second diffusion regions, first insulating film, and first gate electrode constitute a first memory cell, while the second and third diffusion regions, second insulating film, and second gate electrode constitute a second memory cell. The first and second gate electrodes are connected in common to form a word line electrode. The first and third diffusion regions are connected to first and second read bit lines. The second diffusion region is connected to a program and erase bit line.

    摘要翻译: 半导体存储器件包括设置在第一和第二扩散区域之间的半导体衬底上的第一绝缘膜,设置在第一绝缘膜上的第一栅电极,设置在第二扩散区和第三扩散区之间的半导体衬底上的第二绝缘膜 以及设置在第二绝缘膜上的第二栅电极。 第一和第二扩散区域,第一绝缘膜和第一栅电极构成第一存储单元,而第二和第三扩散区域,第二绝缘膜和第二栅电极构成第二存储单元。 第一和第二栅电极共同连接形成字线电极。 第一和第三扩散区域连接到第一和第二读取位线。 第二扩散区连接到编程和擦除位线。

    NAND ROM with transistor strings located at trench bottoms as well as
between trenches
    6.
    发明授权
    NAND ROM with transistor strings located at trench bottoms as well as between trenches 失效
    NAND ROM,其中晶体管串位于沟槽底部以及沟槽之间

    公开(公告)号:US5635748A

    公开(公告)日:1997-06-03

    申请号:US370818

    申请日:1995-01-10

    CPC分类号: H01L27/112

    摘要: A NAND ROM with an improved integration level is described. A number of trenches are formed in stripe pattern at the surface of a semiconductor substrate, and an insulating film for isolation between devices is formed at the sidewalls, respectively, of each trench. A first unit array consisting of MOSFETs connected in series is arranged in each first active region defined between two adjacent trenches. A second active region is defined in the bottom of each trench and a second unit array is arranged therein. Distinguished from the trench isolation technique which provides trenches between unit arrays, instead, according to the present invention, sidewalls of insulating film are formed. The trench width is limited to the minimum feature size involving the lithography. On the other hand, the width of the insulating-film sidewalls are independent of the limitation, permitting the size of the 64-Mbit mask ROM chip to be about 2 mm smaller.

    摘要翻译: 描述了具有改进的集成度的NAND ROM。 在半导体衬底的表面上以条纹图案形成多个沟槽,并且在每个沟槽的侧壁处分别形成用于隔离的绝缘膜。 由串联连接的MOSFET组成的第一单元阵列布置在限定在两个相邻沟槽之间的每个第一有源区中。 第二有源区被限定在每个沟槽的底部,并且第二单元阵列被布置在其中。 与在单元阵列之间提供沟槽的沟槽隔离技术区别在于,根据本发明,形成绝缘膜的侧壁。 沟槽宽度限于涉及光刻的最小特征尺寸。 另一方面,绝缘膜侧壁的宽度与限制无关,允许64-Mbit掩模ROM芯片的尺寸小约2mm。

    Semiconductor memory device having bit lines widely spaced without
sacrifice of narrow pitch of source/drain lines of memory cells
    9.
    发明授权
    Semiconductor memory device having bit lines widely spaced without sacrifice of narrow pitch of source/drain lines of memory cells 失效
    半导体存储器件具有广泛间隔的位线,而不牺牲存储器单元的源极/漏极线的窄间距

    公开(公告)号:US5790450A

    公开(公告)日:1998-08-04

    申请号:US730677

    申请日:1996-10-11

    CPC分类号: G11C7/12 G11C17/126

    摘要: When a data bit is read out from a semiconductor read only memory device, a current-mirror type sense amplifier is electrically connected through a bit line, a first selector, a selected memory cell and a second selector to a discharging line so as to check a potential drop on the bit line, and each of the first and second selectors selectively connects the bit line or the discharging line to eight columns of memory cells by increasing the component switching transistors thereof so as to space the bit line from the discharging line, thereby increasing a margin for a bit line contact.

    摘要翻译: 当从半导体只读存储器件读出数据位时,电流镜型读出放大器通过位线,第一选择器,选择的存储单元和第二选择器电连接到放电线,以便检查 位线上的电位降,并且第一和第二选择器中的每一个选择性地通过增加其组件切换晶体管将位线或放电线连接到八列存储器单元,以便将位线从放电线放置, 从而增加了位线接触的余量。

    Process for fabricating a semiconductor read only memory
    10.
    发明授权
    Process for fabricating a semiconductor read only memory 失效
    用于制造半导体只读存储器的工艺

    公开(公告)号:US4981812A

    公开(公告)日:1991-01-01

    申请号:US451211

    申请日:1989-12-15

    CPC分类号: H01L27/1122 H01L21/763

    摘要: In a process for fabricating a semiconductor read only memory, a gate oxidation film is grown on a semiconductor substrate, and a first polycrystalline silicon layer is then grown on the gate oxidation film. The semicondctor substrate is provided with element separating trenches each passing through the gate oxidation film. Then, the element separating trenches are buried with a seccond polycrystalline silicon layer which provides no contamination for a channel portion and the gate oxidation film.

    摘要翻译: 在制造半导体只读存储器的工艺中,在半导体衬底上生长栅极氧化膜,然后在栅极氧化膜上生长第一多晶硅层。 所述半浸渍基板具有各自通过所述栅极氧化膜的元件分离沟槽。 然后,分离沟槽的元件被埋入具有不会污染通道部分和栅极氧化膜的多晶硅层。