Semiconductor memory device and manufacturing method for the same
    4.
    发明授权
    Semiconductor memory device and manufacturing method for the same 有权
    半导体存储器件及其制造方法

    公开(公告)号:US07315059B2

    公开(公告)日:2008-01-01

    申请号:US10854555

    申请日:2004-05-25

    IPC分类号: H01L29/792

    CPC分类号: H01L27/11556 H01L27/115

    摘要: The present invention provides a semiconductor memory device having one or more protruding semiconductor layers formed on a semiconductor substrate of a first conductivity type and a plurality of memory cells on surfaces of the protruding semiconductor layers, wherein each of the memory cells is formed of a charge storage layer, a control gate and an impurity diffusion layer of a second conductivity type which is formed in a portion of the protruding semiconductor layer and the plurality of memory cells is aligned to at least a predetermined direction, and the control gates of the plurality of memory cells is aligned to the predetermined direction are placed so as to be separated from each other.

    摘要翻译: 本发明提供了一种半导体存储器件,其具有在突出的半导体层的表面上形成在第一导电类型的半导体衬底上的多个突出半导体层和多个存储单元,其中每个存储单元由电荷形成 存储层,控制栅极和第二导电类型的杂质扩散层形成在突出半导体层和多个存储单元的一部分中,至少沿预定方向排列,并且多个栅极的控制栅极 将存储单元与预定方向对准地被放置成彼此分离。