公开(公告)号：US20160288032A1

公开(公告)日：2016-10-06

申请号：US15078017

申请日：2016-03-23

Applicant: Tokyo Electron Limited

Inventor： Hideo SHITE ,  Kazuhiko KIMURA ,  Tomoyuki YUMOTO

IPC: B01D36/00 ,  B01D37/04 ,  H01L21/67

CPC classification number: H01L21/6715 ,  H01L21/67017

Abstract: A treatment solution supply method includes: a degassed treatment solution generating step of degassing a treatment solution by a degassing mechanism to generate a degassed treatment solution; a treatment solution storing step of storing the degassed treatment solution in a container; a filter solution-passing step of bringing a downstream side from a filter connected to a downstream side from the container via a treatment solution supply pipe to a negative pressure with respect to a pressure in the container to pass the treatment solution in the container through the filter; and a negative pressure maintaining step of maintaining a state in which the downstream side from the filter is brought to the negative pressure, for a predetermined period, after stopping supply of the treatment solution from the container to the filter.

Abstract translation: 处理溶液供给方法包括：脱气处理液生成步骤，通过脱气机构对处理液进行脱气，生成脱气处理液; 将脱气后的处理液储存在容器内的处理液储存工序; 过滤器溶液通过步骤，使得从连接到下游侧的过滤器的下游侧经由处理溶液供给管相对于容器中的压力到达负压，以将容器中的处理溶液通过所述容器 过滤; 并且在停止将处理液从容器供给到过滤器之后，将从过滤器的下游侧保持为负压的状态的负压保持步骤达预定时间。

公开(公告)号：US20180065065A1

公开(公告)日：2018-03-08

申请号：US15696365

申请日：2017-09-06

Applicant: Tokyo Electron Limited

Inventor： Takashi SASA ,  Daisuke ISHIMARU ,  Katsuya HASHIMOTO ,  Hideo SHITE ,  Shinya WAKAMIZU ,  Kazuhiko KIMURA

IPC: B01D29/60 ,  G03F7/16 ,  B01D37/04 ,  B01D35/02

CPC classification number: B01D29/606 ,  B01D35/02 ,  B01D37/046 ,  B01D2201/20 ,  B01D2201/202 ,  F04B43/02 ,  F04B43/08 ,  F04B53/10 ,  F04B53/20 ,  G03F7/16 ,  G03F7/162 ,  G03F7/3021

Abstract: A treatment solution supply apparatus for supplying a treatment solution to a treatment solution discharge unit that discharges the treatment solution to a treatment body, includes: a temporary storage apparatus that temporarily stores the treatment solution supplied from a treatment solution supply source that stores the treatment solution; a filter that removes a foreign substance in the treatment solution from the temporary storage apparatus; and a pump that sends the treatment solution from which the foreign substance has been removed by the filter to the treatment solution discharge unit, wherein the temporary storage apparatus has a pressure-feeding function of pressure-feeding the treatment solution stored in the temporary storage apparatus.

公开(公告)号：US20200090967A1

公开(公告)日：2020-03-19

申请号：US16692152

申请日：2019-11-22

Applicant: TOKYO ELECTRON LIMITED

Inventor： Seiichi KURE ,  Ryouichirou NAITOU ,  Hideo SHITE

IPC: H01L21/67 ,  H01L21/027 ,  H01L21/31

Abstract: A substrate processing apparatus includes a nozzle for discharging a processing solution, a processing solution supply part for supplying the processing solution to the nozzle and a controller. The processing solution supply part includes a tank, a first conduit for guiding the processing solution from the tank to the nozzle, a pump installed in the first conduit, and a filter having first and second spaces, and a filtering member for separating between the first space and the second space. The controller performs a first control process of controlling the processing solution supply part to flow the processing solution from the first space to the second space through the filtering member by the pump, and after the first control process, a second control process of controlling the processing solution supply part to flow the processing solution from the second space to the first space through the filtering member by the pump.

公开(公告)号：US20200290080A1

公开(公告)日：2020-09-17

申请号：US16768216

申请日：2018-12-07

Applicant: Tokyo Electron Limited

Inventor： Ryouichirou NAITOU ,  Masato HAYASHI ,  Hideo SHITE ,  Hiroyuki IDE ,  Yosuke KAMEDA ,  Seiya TOTSUKA ,  Atsumu MAITA ,  Takami SATOH ,  Hirofumi ARAKI ,  Kentaro YOSHIHARA

IPC: B05C19/06 ,  B05C11/10

Abstract: A solution supply apparatus for supplying a treatment solution to a treatment solution discharger configured to discharge the treatment solution to a treatment object, the solution supply apparatus includes: a supply pipe line connected to the treatment solution discharger; a filter provided on the supply pipe line and configured to filter the treatment solution to remove foreign substances; and a controller configured to perform a determination of a state of the treatment solution to be supplied to a primary side of the filter and, when the state of the treatment solution is determined to be bad, to output a control signal for restricting supply of the treatment solution to the primary side of the filter.

公开(公告)号：US20180061690A1

公开(公告)日：2018-03-01

申请号：US15681494

申请日：2017-08-21

Applicant: TOKYO ELECTRON LIMITED

Inventor： Seiichi KURE ,  Ryouichirou NAITOU ,  Hideo SHITE

IPC: H01L21/67 ,  H01L21/027 ,  H01L21/31

CPC classification number: H01L21/67225 ,  H01L21/0274 ,  H01L21/31 ,  H01L21/67017 ,  H01L21/67069 ,  H01L21/6715 ,  H01L21/67161 ,  H01L21/67253

Abstract: A substrate processing apparatus includes a nozzle for discharging a processing solution, a processing solution supply part for supplying the processing solution to the nozzle and a controller. The processing solution supply part includes a tank, a first conduit for guiding the processing solution from the tank to the nozzle, a pump installed in the first conduit, and a filter having first and second spaces, and a filtering member for separating between the first space and the second space. The controller performs a first control process of controlling the processing solution supply part to flow the processing solution from the first space to the second space through the filtering member by the pump, and after the first control process, a second control process of controlling the processing solution supply part to flow the processing solution from the second space to the first space through the filtering member by the pump.