公开(公告)号：US20170358470A1

公开(公告)日：2017-12-14

申请号：US15617134

申请日：2017-06-08

Applicant: Tokyo Electron Limited

Inventor： Hiroshi Tanaka ,  Tsukasa Hirayama ,  Takao Inada

IPC: H01L21/67

CPC classification number: H01L21/67248 ,  H01L21/67017 ,  H01L21/67086 ,  H01L21/67253

Abstract: A substrate liquid processing apparatus includes a liquid processing unit, a processing liquid circulating line, and a boiling state detecting unit provided in a processing bath of the liquid processing unit. The controller controls a supply pump of the processing liquid circulating line based on a signal from the boiling state detecting unit, and adjusts a pressure of a supplied phosphoric acid aqueous solution in a flow path so as to adjust the boiling state of the phosphoric acid aqueous solution to a desired state.

公开(公告)号：US09362106B2

公开(公告)日：2016-06-07

申请号：US13910249

申请日：2013-06-05

Applicant: Sony Corporation ,  Tokyo Electron Limited

Inventor： Hayato Iwamoto ,  Yoshiya Hagimoto ,  Tomoki Tetsuka ,  Shinichiro Shimomura ,  Teruomi Minami ,  Hiroki Sakurai ,  Hirotaka Maruyama ,  Yosuke Kawabuchi ,  Hiroshi Tanaka

IPC: H01L21/461 ,  H01L21/02 ,  H01L21/67 ,  H01L21/306

CPC classification number: H01L21/02019 ,  H01L21/02052 ,  H01L21/30608 ,  H01L21/6708

Abstract: A wafer is held horizontally and rotated by a substrate holding mechanism. An aqueous alkaline solution is supplied to a wafer by a nozzle and caused to flow from a central portion to a peripheral edge portion of the wafer, thereby etching the wafer. An amount of oxygen, which is equal to or more than the amount of oxygen in atmospheric air involved in the aqueous alkaline solution flowing on the wafer, is previously dissolved in the aqueous alkaline solution.

Abstract translation: 晶片被水平地保持并由基板保持机构旋转。 通过喷嘴将水性碱性溶液供给到晶片，并使其从晶片的中心部分流向周边边缘部分，从而蚀刻晶片。 预先将一定量的氧气等于或大于在流过晶片的碱性水溶液中所涉及的大气中的氧气的量，将其溶解在碱性水溶液中。

公开(公告)号：US20140283887A1

公开(公告)日：2014-09-25

申请号：US14293324

申请日：2014-06-02

Applicant: Tokyo Electron Limited

Inventor： Hiroshi Tanaka ,  Hironobu Hyakutake ,  Takashi Uno

IPC: H01L21/67

CPC classification number: H01L21/67057 ,  H01L21/67028

Abstract: There is provided a substrate processing apparatus including: a cleaning tank configured to clean a target substrate; a drying chamber configured to communicate with an upper area of the cleaning tank and dry the target substrate picked up from the cleaning tank; a first drying gas supply unit configured to supply a first drying gas containing vapor of a solvent for removing a liquid; a second drying gas supply unit configured to supply a second drying gas not containing the vapor of the solvent for removing the liquid; a substrate holder configured to pick up the target substrate from the cleaning tank and transfer the target substrate to the drying chamber; and a controller configured to output a control signal to alternately supply the first drying gas and the second drying gas.

Abstract translation: 提供了一种基板处理装置，包括：清洗槽，其构造成清洁目标基板; 干燥室，其构造成与清洗槽的上部区域连通并干燥从清洗槽取出的目标基板; 第一干燥气体供给单元，其构造成供给包含用于除去液体的溶剂的蒸气的第一干燥气体; 第二干燥气体供给单元，其构造为供给不含溶剂蒸气的第二干燥气体，以除去液体; 衬底保持器，其构造成从所述清洁槽拾取所述目标衬底并将所述目标衬底转移到所述干燥室; 以及控制器，被配置为输出控制信号以交替地供应第一干燥气体和第二干燥气体。

公开(公告)号：US09339775B2

公开(公告)日：2016-05-17

申请号：US14750319

申请日：2015-06-25

Applicant: TOKYO ELECTRON LIMITED

Inventor： Hiroshi Tanaka ,  Koukichi Hiroshiro ,  Fumihiro Kamimura

IPC: B01F5/10 ,  B01F3/08 ,  B01F15/00 ,  B01F15/04 ,  C01B15/08 ,  C11D3/39 ,  C11D11/00 ,  H01L21/67 ,  B01F15/02 ,  B01F15/06

CPC classification number: B01F3/088 ,  B01F3/0861 ,  B01F3/0865 ,  B01F5/10 ,  B01F15/00253 ,  B01F15/00331 ,  B01F15/00396 ,  B01F15/0243 ,  B01F15/0412 ,  B01F15/0437 ,  B01F15/06 ,  B01F2015/062 ,  B01F2215/0036 ,  B01J19/24 ,  B01J2219/00103 ,  B01J2219/24 ,  C01B15/08 ,  C11D3/3947 ,  C11D11/0047 ,  H01L21/67057

Abstract: The present invention provides a chemical-liquid mixing method and a chemical-liquid mixing apparatus capable of sufficiently generating a peroxornonosulfuric acid that is effective in removing a resist from a substrate, when a sulfuric acid and a hydrogen peroxide solution are mixed with each other. At first, an inner tank 10 is filled up with a sulfuric acid and the sulfuric acid overflowing from the inner tank 10 is allowed to flow into an outer tank 12. Then, a hydrogen peroxide solution is supplied into the inner tank 10 and the hydrogen peroxide solution is allowed to flow into the outer tank 12 whereby the two kinds of liquids of the hydrogen peroxide solution and the sulfuric acid are stored in the outer tank 12. Simultaneously when the hydrogen peroxide solution flows into the outer tank 12, a return pump 16 is activated.

Abstract translation: 本发明提供了当硫酸和过氧化氢溶液彼此混合时，能够充分产生有效地从基材中除去抗蚀剂的化学 - 液体混合方法和药物 - 液体混合装置。 首先，用硫酸填充内箱10，使从内箱10溢出的硫酸流入外箱12.然后，将过氧化氢溶液供给至内箱10，将氢 使过氧化物溶液流入外槽12，由此将过氧化氢溶液和硫酸的两种液体储存在外罐12中。同时当过氧化氢溶液流入外罐12时，返回泵 16被激活。

公开(公告)号：US09415356B1

公开(公告)日：2016-08-16

申请号：US15130282

申请日：2016-04-15

Applicant: TOKYO ELECTRON LIMITED

Inventor： Hiroshi Tanaka ,  Koukichi Hiroshiro ,  Fumihiro Kamimura

IPC: B01F3/08 ,  B01F5/10 ,  B01F15/00 ,  B01F15/06 ,  B01J19/24 ,  C01B15/08

CPC classification number: B01F3/088 ,  B01F3/0861 ,  B01F3/0865 ,  B01F5/10 ,  B01F15/00253 ,  B01F15/00331 ,  B01F15/00396 ,  B01F15/0243 ,  B01F15/0412 ,  B01F15/0437 ,  B01F15/06 ,  B01F2015/062 ,  B01F2215/0036 ,  B01J19/24 ,  B01J2219/00103 ,  B01J2219/24 ,  C01B15/08 ,  C11D3/3947 ,  C11D11/0047 ,  H01L21/67057

Abstract: The present invention provides a chemical-liquid mixing method and a chemical-liquid mixing apparatus capable of sufficiently generating a peroxomonosulfuric acid that is effective in removing a resist from a substrate, when a sulfuric acid and a hydrogen peroxide solution are mixed with each other. At first, an inner tank 10 is filled up with a sulfuric acid and the sulfuric acid overflowing from the inner tank 10 is allowed to flow into an outer tank 12. Then, a hydrogen peroxide solution is supplied into the inner tank 10 and the hydrogen peroxide solution is allowed to flow into the outer tank 12 whereby the two kinds of liquids of the hydrogen peroxide solution and the sulfuric acid are stored in the outer tank 12. Simultaneously when the hydrogen peroxide solution flows into the outer tank 12, a return pump 16 is activated.