摘要:
A hydrated water-absorption polymer containing resin composition includes a liquid cross-link curable resin composition, and a water-absorption polymer dispersed in the liquid cross-link curable resin composition. The water-absorption polymer is preliminarily hydrated and swollen. The water-absorption polymer before being hydrated and swollen includes an average particle diameter of not more than 10 μm. The water-absorption polymer includes an amount of water absorption of 10 to 100 g/g.
摘要:
A hydrous water absorbent polymer dispersed ultraviolet curable resin composition includes an ultraviolet curable resin composition, and a hydrous water absorbent polymer swollen by water beforehand, and dispersed in the ultraviolet curable resin composition so that the hydrous water absorbent polymer dispersed ultraviolet curable resin composition has a moisture content of not less than 50 percent. The water absorption rate of the ultraviolet curable resin composition is not more than 2 percent.
摘要:
An insulated wire includes a conductor, and an insulating layer of a porous member formed on the conductor by using a water-in-oil type emulsion (W/O emulsion) including a thermosetting liquid solventless varnish as the oil and water drops of water-soluble polymer contained in the thermosetting liquid solventless varnish as the water. The insulating layer of the porous member is formed by that the water-in-oil type emulsion is coated so as to form a thin film as a coated film, the thermosetting liquid solventless varnish as the oil is polymerized and cured after the formation of the thin film, and the water drops as the water is dried and removed after the curing of the thermosetting liquid solventless varnish.
摘要:
A hydrous water absorbent polymer-dispersed ultraviolet curable resin composition, a porous substance, an insulated wire, a multilayer covered cable, a coaxial cable using the same, a method for manufacturing the porous substance and a method for manufacturing the insulated wire using the same. A hydrous water absorbent polymer preliminarily hydrated and swollen is dispersed in an ultraviolet curable resin composition. The ultraviolet curable resin composition includes an urethane oligomer having a molecular weight of 5000 or less and having a poly(ethylene-glicol-adipate)diol having a molecular weight of 500 to 3000 and having an acryloyl radical or a methacryloyl radical as a functional radical X at both ends by urethane bond via an alicyclic isocyanate as expressed by a following formula, at least one kind of alicyclic monomer, a hydrophilic monomer, and a photopolymerization initiator. 0.01 mass % to 0.5 mass % of a non-ionic fluorine based surface active agent or a non-ionic silicone-based surface active agent may be added to the resin composition.
摘要:
An insulated wire includes a conductor, and an insulating layer of a porous member formed on the conductor by using a water-in-oil type emulsion (W/O emulsion) including a thermosetting liquid solventless varnish as the oil and water drops of water-soluble polymer contained in the thermosetting liquid solventless varnish as the water. The insulating layer of the porous member is formed by that the water-in-oil type emulsion is coated so as to form a thin film as a coated film, the thermosetting liquid solventless varnish as the oil is polymerized and cured after the formation of the thin film, and the water drops as the water is dried and removed after the curing of the thermosetting liquid solventless varnish.
摘要:
A hydrous water absorbent polymer-dispersed ultraviolet curable resin composition includes a hydrous water absorbent polymer preliminarily hydrated, swollen and dispersed in the resin composition, and a hydrophilic monomer. The hydrophilic monomer is added not less than 10 mass % to the resin composition.
摘要:
A hydrated water-absorption polymer containing resin composition includes a liquid cross-link curable resin composition, and a water-absorption polymer dispersed in the liquid cross-link curable resin composition. The water-absorption polymer is preliminarily hydrated and swollen. The water-absorption polymer before being hydrated and swollen includes an average particle diameter of not more than 10 μm. The water-absorption polymer includes an amount of water absorption of 10 to 100 g/g.
摘要:
An adhesive composition includes a phenoxy resin having a bisphenol S skeleton in a structure and 10 to 100 parts by weight of a maleimide compound based on 100 parts by weight of the phenoxy resin. The maleimide compound has a plurality of maleimide groups in a structure and is at least one of a first maleimide compound having a melting temperature of 160° C. or lower and a gelling time at 200° C. of 180 to 350 seconds and a second maleimide compound having a melting temperature of 160° C. or lower and a gelling time at 250° C. of 110 to 150 seconds. A heat resistant adhesive film may be formed by coating the adhesive composition on a substrate film, and a wiring film may have a conductor wiring layer put between such heat resistant adhesive films.
摘要:
An insulated wire including a conductor, and an insulating film formed by coating and baking an insulating varnish on the conductor directly or via another insulation layer. The insulating varnish includes a phenolic hydroxyl group-containing polyimide resin represented by a chemical formula (1): where X is a tetravalent aromatic group composing an aromatic tetracarboxylic dianhydride residue, Y1 is a divalent aromatic group including one or more phenolic hydroxyl groups and Y2 is a divalent aromatic group not including a phenolic hydroxyl group A ratio of the number Z1 of phenolic hydroxyl groups included in Y1 of the chemical formula (1) to the number Z2 of an imide group included in the chemical formula (1) is 0.15≦Z1/Z2≦0.85.
摘要:
An insulation coating for electric wires has a resin coating made from polyimide resin or polyamide-imide resin as a constituent resin, the insulation coating being formed by dispersing phenyl trialkoxysilane and pure water in the resin coating. The phenyl trialkoxysilane is included 3 to 100 parts by weight for the constituent resin of 100 parts by weight in the resin coating.