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公开(公告)号：US20120049337A1
公开(公告)日：2012-03-01
申请号：US13293250
申请日：2011-11-10
IPC分类号： H01L23/495
CPC分类号： H02M1/08 , H01L24/37 , H01L24/40 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2224/05554 , H01L2224/05599 , H01L2224/0603 , H01L2224/371 , H01L2224/37124 , H01L2224/37147 , H01L2224/40095 , H01L2224/40137 , H01L2224/40245 , H01L2224/40247 , H01L2224/45015 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/49171 , H01L2224/49175 , H01L2224/73221 , H01L2224/83801 , H01L2224/84801 , H01L2224/8485 , H01L2224/85444 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01057 , H01L2924/01059 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12032 , H01L2924/1305 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/30107 , H01L2924/3011 , H01L2924/00 , H01L2924/00012 , H01L2924/20753
摘要： A non-insulated DC-DC converter has a power MOSFET for a highside switch and a power MOS•ET for a lowside switch. In the non-insulated DC-DC converter, the power MOS•ET for the highside switch and the power MOS•ET for the lowside switch, driver circuits that control operations of these elements, respectively, and a Schottky barrier diode connected in parallel with the power MOS•ET for the lowside switch are respectively formed in four different semiconductor chips. These four semiconductor chips are housed in one package. The semiconductor chips are mounted over the same die pad. The semiconductor chips are disposed so as to approach each other.
摘要翻译： 非绝缘DC-DC转换器具有用于高边开关的功率MOSFET和用于低端开关的功率MOS•ET。 在非绝缘DC-DC转换器中，用于高边开关的功率MOS•ET和用于低端开关的功率MOS•ET分别控制这些元件的操作的驱动电路和与...并联连接的肖特基势垒二极管 低端开关的功率MOS•ET分别形成在四个不同的半导体芯片中。 这四个半导体芯片容纳在一个封装中。 半导体芯片安装在相同的芯片焊盘上。 半导体芯片被配置为彼此接近。
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公开(公告)号：US20090026544A1
公开(公告)日：2009-01-29
申请号：US12237082
申请日：2008-09-24
IPC分类号： H01L29/00
CPC分类号： H02M1/08 , H01L24/37 , H01L24/40 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2224/05554 , H01L2224/05599 , H01L2224/0603 , H01L2224/371 , H01L2224/37124 , H01L2224/37147 , H01L2224/40095 , H01L2224/40137 , H01L2224/40245 , H01L2224/40247 , H01L2224/45015 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/49171 , H01L2224/49175 , H01L2224/73221 , H01L2224/83801 , H01L2224/84801 , H01L2224/8485 , H01L2224/85444 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01057 , H01L2924/01059 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12032 , H01L2924/1305 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/30107 , H01L2924/3011 , H01L2924/00 , H01L2924/00012 , H01L2924/20753
摘要： A non-insulated DC-DC converter has a power MOS•FET for a highside switch and a power MOS•FET for a lowside switch. In the non-insulated DC-DC converter, the power MOS•FET for the highside switch and the power MOS•FET for the lowside switch, driver circuits that control operations of these elements, respectively, and a Schottky barrier diode connected in parallel with the power MOS•FET for the lowside switch are respectively formed in four different semiconductor chips. These four semiconductor chips are housed in one package. The semiconductor chips are mounted over the same die pad. The semiconductor chips are disposed so as to approach each other.
摘要翻译： 非绝缘DC-DC转换器具有用于高侧开关的功率MOS.FET和用于低端开关的功率MOS.FET。 在非绝缘DC-DC转换器中，用于高侧开关的功率MOS.FET和用于低端开关的功率MOS.FET，分别控制这些元件的操作的驱动电路和与...并联连接的肖特基势垒二极管 用于低端开关的功率MOS.FET分别形成在四个不同的半导体芯片中。 这四个半导体芯片容纳在一个封装中。 半导体芯片安装在相同的芯片焊盘上。 半导体芯片被配置为彼此接近。
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公开(公告)号：US20050231990A1
公开(公告)日：2005-10-20
申请号：US11108825
申请日：2005-04-19
IPC分类号： H01L25/07 , H01L21/8238 , H01L25/04 , H01L25/18 , H01L27/092 , H01L29/06 , H01L29/78 , H02M1/08 , H02M3/155 , H02M7/217
CPC分类号： H02M1/08 , H01L24/37 , H01L24/40 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2224/05554 , H01L2224/05599 , H01L2224/0603 , H01L2224/371 , H01L2224/37124 , H01L2224/37147 , H01L2224/40095 , H01L2224/40137 , H01L2224/40245 , H01L2224/40247 , H01L2224/45015 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/49171 , H01L2224/49175 , H01L2224/73221 , H01L2224/83801 , H01L2224/84801 , H01L2224/8485 , H01L2224/85444 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01057 , H01L2924/01059 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12032 , H01L2924/1305 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/30107 , H01L2924/3011 , H01L2924/00 , H01L2924/00012 , H01L2924/20753
摘要： A non-insulated DC-DC converter a power MOS·FRT for a highside switch and a power MOS·FET for a lowside switch. In the non-insulated DC-DC converter, the power MOS·FET for the highside switch and the power MOS·FET for the lowside switch, driver circuits that control operations of these elements, respectively, and a Schottky barrier diode connected in parallel with the power MOS·FET for the lowside switch are respectively formed in four different semiconductor chips. These four semiconductor chips are housed in one package. The semiconductor chips are mounted over the same die pad. The semiconductor chips are disposed so as to approach each other.
摘要翻译： 一个非绝缘DC-DC转换器，一个用于高侧开关的功率MOS.FRT和一个用于低端开关的功率MOS.FET。 在非绝缘DC-DC转换器中，用于高侧开关的功率MOS.FET和用于低端开关的功率MOS.FET，分别控制这些元件的操作的驱动电路和与...并联连接的肖特基势垒二极管 用于低端开关的功率MOS.FET分别形成在四个不同的半导体芯片中。 这四个半导体芯片容纳在一个封装中。 半导体芯片安装在相同的芯片焊盘上。 半导体芯片被配置为彼此接近。
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公开(公告)号：US07863756B2
公开(公告)日：2011-01-04
申请号：US12237082
申请日：2008-09-24
CPC分类号： H02M1/08 , H01L24/37 , H01L24/40 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2224/05554 , H01L2224/05599 , H01L2224/0603 , H01L2224/371 , H01L2224/37124 , H01L2224/37147 , H01L2224/40095 , H01L2224/40137 , H01L2224/40245 , H01L2224/40247 , H01L2224/45015 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/49171 , H01L2224/49175 , H01L2224/73221 , H01L2224/83801 , H01L2224/84801 , H01L2224/8485 , H01L2224/85444 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01057 , H01L2924/01059 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12032 , H01L2924/1305 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/30107 , H01L2924/3011 , H01L2924/00 , H01L2924/00012 , H01L2924/20753
摘要： A non-insulated DC-DC converter has a power MOS•FET for a highside switch and a power MOS•FET for a lowside switch. In the non-insulated DC-DC converter, the power MOS•FET for the highside switch and the power MOS•FET for the lowside switch, driver circuits that control operations of these elements, respectively, and a Schottky barrier diode connected in parallel with the power MOS•FET for the lowside switch are respectively formed in four different semiconductor chips. These four semiconductor chips are housed in one package. The semiconductor chips are mounted over the same die pad. The semiconductor chips are disposed so as to approach each other.
摘要翻译： 非绝缘DC-DC转换器具有用于高侧开关的功率MOS•FET和用于低端开关的功率MOS•FET。 在非绝缘DC-DC转换器中，用于高边开关的功率MOS•FET和用于低端开关的功率MOS•FET分别控制这些元件的工作的驱动电路和与之并联连接的肖特基势垒二极管 用于低端开关的功率MOS•FET分别形成在四个不同的半导体芯片中。 这四个半导体芯片容纳在一个封装中。 半导体芯片安装在相同的芯片焊盘上。 半导体芯片被配置为彼此接近。
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公开(公告)号：US07436070B2
公开(公告)日：2008-10-14
申请号：US11108825
申请日：2005-04-19
IPC分类号： H01L23/48
CPC分类号： H02M1/08 , H01L24/37 , H01L24/40 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2224/05554 , H01L2224/05599 , H01L2224/0603 , H01L2224/371 , H01L2224/37124 , H01L2224/37147 , H01L2224/40095 , H01L2224/40137 , H01L2224/40245 , H01L2224/40247 , H01L2224/45015 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/49171 , H01L2224/49175 , H01L2224/73221 , H01L2224/83801 , H01L2224/84801 , H01L2224/8485 , H01L2224/85444 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01057 , H01L2924/01059 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12032 , H01L2924/1305 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/30107 , H01L2924/3011 , H01L2924/00 , H01L2924/00012 , H01L2924/20753
摘要： A non-insulated DC-DC converter hs a power MOS•FRT for a highside switch and a power MOS•FET for a lowside switch. In the non-insulated DC-DC converter, the power MOS•FET for the highside switch and the power MOS•FET for the lowside switch, driver circuits that control operations of these elements, respectively, and a Schottky barrier diode connected in parallel with the power MOS•FET for the lowside switch are respectively formed in four different semiconductor chips. These four semiconductor chips are housed in one package. The semiconductor chips are mounted over the same die pad. The semiconductor chips are disposed so as to approach each other.
摘要翻译： 非绝缘DC-DC转换器是用于高侧开关的功率MOS.FRT和用于低端开关的功率MOSFET。 在非绝缘DC-DC转换器中，用于高侧开关的功率MOS.FET和用于低端开关的功率MOS.FET，分别控制这些元件的操作的驱动电路和与...并联连接的肖特基势垒二极管 用于低端开关的功率MOS.FET分别形成在四个不同的半导体芯片中。 这四个半导体芯片容纳在一个封装中。 半导体芯片安装在相同的芯片焊盘上。 半导体芯片被配置为彼此接近。
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公开(公告)号：US08482345B2
公开(公告)日：2013-07-09
申请号：US13293250
申请日：2011-11-10
IPC分类号： H01L25/00
CPC分类号： H02M1/08 , H01L24/37 , H01L24/40 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2224/05554 , H01L2224/05599 , H01L2224/0603 , H01L2224/371 , H01L2224/37124 , H01L2224/37147 , H01L2224/40095 , H01L2224/40137 , H01L2224/40245 , H01L2224/40247 , H01L2224/45015 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/49171 , H01L2224/49175 , H01L2224/73221 , H01L2224/83801 , H01L2224/84801 , H01L2224/8485 , H01L2224/85444 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01057 , H01L2924/01059 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12032 , H01L2924/1305 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/30107 , H01L2924/3011 , H01L2924/00 , H01L2924/00012 , H01L2924/20753
摘要： A non-insulated DC-DC converter has a power MOS•FET for a highside switch and a power MOS•FET for a lowside switch. In the non-insulated DC-DC converter, the power MOS•FET for the highside switch and the power MOS•FET for the lowside switch, driver circuits that control operations of these elements, respectively, and a Schottky barrier diode connected in parallel with the power MOS•FET for the lowside switch are respectively formed in four different semiconductor chips. These four semiconductor chips are housed in one package. The semiconductor chips are mounted over the same die pad. The semiconductor chips are disposed so as to approach each other.
摘要翻译： 非绝缘DC-DC转换器具有用于高侧开关的功率MOS.FET和用于低端开关的功率MOS.FET。 在非绝缘DC-DC转换器中，用于高侧开关的功率MOS.FET和用于低端开关的功率MOS.FET，分别控制这些元件的操作的驱动电路和与...并联连接的肖特基势垒二极管 用于低端开关的功率MOS.FET分别形成在四个不同的半导体芯片中。 这四个半导体芯片容纳在一个封装中。 半导体芯片安装在相同的芯片焊盘上。 半导体芯片被配置为彼此接近。
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公开(公告)号：US08076767B2
公开(公告)日：2011-12-13
申请号：US12912287
申请日：2010-10-26
IPC分类号： H01L23/02
CPC分类号： H02M1/08 , H01L24/37 , H01L24/40 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2224/05554 , H01L2224/05599 , H01L2224/0603 , H01L2224/371 , H01L2224/37124 , H01L2224/37147 , H01L2224/40095 , H01L2224/40137 , H01L2224/40245 , H01L2224/40247 , H01L2224/45015 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/49171 , H01L2224/49175 , H01L2224/73221 , H01L2224/83801 , H01L2224/84801 , H01L2224/8485 , H01L2224/85444 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01057 , H01L2924/01059 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12032 , H01L2924/1305 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/30107 , H01L2924/3011 , H01L2924/00 , H01L2924/00012 , H01L2924/20753
摘要： A non-insulated DC-DC converter has a power MOS-FET for a highside switch and a power MOS-FET for a lowside switch. In the non-insulated DC-DC converter, the power MOS-FET for the highside switch and the power MOS-FET for the lowside switch, driver circuits that control operations of these elements, respectively, and a Schottky barrier diode connected in parallel with the power MOS-FET for the lowside switch are respectively formed in four different semiconductor chips. These four semiconductor chips are housed in one package. The semiconductor chips are mounted over the same die pad. The semiconductor chips are disposed so as to approach each other.
摘要翻译： 非绝缘DC-DC转换器具有用于高侧开关的功率MOS-FET和用于低端开关的功率MOS-FET。 在非绝缘DC-DC转换器中，用于高侧开关的功率MOS-FET和用于低端开关的功率MOS-FET，分别控制这些元件的操作的驱动电路和并联连接的肖特基势垒二极管 用于低端开关的功率MOS-FET分别形成在四个不同的半导体芯片中。 这四个半导体芯片容纳在一个封装中。 半导体芯片安装在相同的芯片焊盘上。 半导体芯片被配置为彼此接近。
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公开(公告)号：US20110037449A1
公开(公告)日：2011-02-17
申请号：US12912287
申请日：2010-10-26
IPC分类号： G05F3/02
CPC分类号： H02M1/08 , H01L24/37 , H01L24/40 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2224/05554 , H01L2224/05599 , H01L2224/0603 , H01L2224/371 , H01L2224/37124 , H01L2224/37147 , H01L2224/40095 , H01L2224/40137 , H01L2224/40245 , H01L2224/40247 , H01L2224/45015 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/49171 , H01L2224/49175 , H01L2224/73221 , H01L2224/83801 , H01L2224/84801 , H01L2224/8485 , H01L2224/85444 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01057 , H01L2924/01059 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12032 , H01L2924/1305 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/30107 , H01L2924/3011 , H01L2924/00 , H01L2924/00012 , H01L2924/20753
摘要： A non-insulated DC-DC converter has a power MOS-FET for a highside switch and a power MOS-FET for a lowside switch. In the non-insulated DC-DC converter, the power MOS-FET for the highside switch and the power MOS-FET for the lowside switch, driver circuits that control operations of these elements, respectively, and a Schottky barrier diode connected in parallel with the power MOS-FET for the lowside switch are respectively formed in four different semiconductor chips. These four semiconductor chips are housed in one package. The semiconductor chips are mounted over the same die pad. The semiconductor chips are disposed so as to approach each other.
摘要翻译： 非绝缘DC-DC转换器具有用于高侧开关的功率MOS-FET和用于低端开关的功率MOS-FET。 在非绝缘DC-DC转换器中，用于高侧开关的功率MOS-FET和用于低端开关的功率MOS-FET，分别控制这些元件的操作的驱动电路和并联连接的肖特基势垒二极管 用于低端开关的功率MOS-FET分别形成在四个不同的半导体芯片中。 这四个半导体芯片容纳在一个封装中。 半导体芯片安装在相同的芯片焊盘上。 半导体芯片被配置为彼此接近。
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公开(公告)号：US08159054B2
公开(公告)日：2012-04-17
申请号：US13188613
申请日：2011-07-22
IPC分类号： H01L23/495
CPC分类号： H01L23/5386 , H01L23/49575 , H01L23/50 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/85 , H01L25/165 , H01L29/4175 , H01L2224/05554 , H01L2224/0603 , H01L2224/29339 , H01L2224/45015 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48095 , H01L2224/48137 , H01L2224/48247 , H01L2224/4903 , H01L2224/49051 , H01L2224/49111 , H01L2224/49171 , H01L2224/49175 , H01L2224/4943 , H01L2224/83855 , H01L2224/85 , H01L2224/85203 , H01L2224/85205 , H01L2924/01002 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/0102 , H01L2924/01023 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/20753 , H01L2924/20755 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H02M3/1588 , H05K7/02 , Y02B70/1466 , H01L2924/00014 , H01L2924/00 , H01L2924/00012 , H01L2924/2075 , H01L2924/20754
摘要： The present invention provides a non-insulated type DC-DC converter having a circuit in which a power MOSωFET for a high side switch and a power MOSωFET for a low side switch are connected in series. In the non-insulated type DC-DC converter, the power transistor for the high side switch, the power transistor for the low side switch, and driver circuits that drive these are respectively constituted by different semiconductor chips. The three semiconductor chips are accommodated in one package, and the semiconductor chip including the power transistor for the high side switch, and the semiconductor chip including the driver circuits are disposed so as to approach each other.
摘要翻译： 本发明提供一种具有电路的非绝缘型DC-DC转换器，其中用于高侧开关的功率MOSωFET和用于低侧开关的功率MOSωFET串联连接。 在非绝缘型DC-DC转换器中，用于高侧开关的功率晶体管，低边开关的功率晶体管和驱动它们的驱动电路分别由不同的半导体芯片构成。 三个半导体芯片被容纳在一个封装中，并且包括用于高侧开关的功率晶体管的半导体芯片和包括驱动电路的半导体芯片被布置成彼此接近。
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公开(公告)号：US08013430B2
公开(公告)日：2011-09-06
申请号：US12708044
申请日：2010-02-18
IPC分类号： H01L23/495
CPC分类号： H01L23/5386 , H01L23/49575 , H01L23/50 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/85 , H01L25/165 , H01L29/4175 , H01L2224/05554 , H01L2224/0603 , H01L2224/29339 , H01L2224/45015 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48095 , H01L2224/48137 , H01L2224/48247 , H01L2224/4903 , H01L2224/49051 , H01L2224/49111 , H01L2224/49171 , H01L2224/49175 , H01L2224/4943 , H01L2224/83855 , H01L2224/85 , H01L2224/85203 , H01L2224/85205 , H01L2924/01002 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/0102 , H01L2924/01023 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/20753 , H01L2924/20755 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H02M3/1588 , H05K7/02 , Y02B70/1466 , H01L2924/00014 , H01L2924/00 , H01L2924/00012 , H01L2924/2075 , H01L2924/20754
摘要： The present invention provides a non-insulated type DC-DC converter having a circuit in which a power MOS·FET for a high side switch and a power MOS·FET for a low side switch are connected in series. In the non-insulated type DC-DC converter, the power transistor for the high side switch, the power transistor for the low side switch, and driver circuits that drive these are respectively constituted by different semiconductor chips. The three semiconductor chips are accommodated in one package, and the semiconductor chip including the power transistor for the high side switch, and the semiconductor chip including the driver circuits are disposed so as to approach each other.
摘要翻译： 本发明提供一种非绝缘型DC-DC转换器，其具有用于高侧开关的功率MOS·FET和低侧开关的功率MOS·FET串联连接的电路。 在非绝缘型DC-DC转换器中，用于高侧开关的功率晶体管，低边开关的功率晶体管和驱动它们的驱动电路分别由不同的半导体芯片构成。 三个半导体芯片被容纳在一个封装中，并且包括用于高侧开关的功率晶体管的半导体芯片和包括驱动电路的半导体芯片被布置成彼此接近。
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