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    METHOD OF GRINDING SEMICONDUCTOR WAFERS, GRINDING SURFACE PLATE, AND GRINDING DEVICE
    1.
    发明申请
    METHOD OF GRINDING SEMICONDUCTOR WAFERS, GRINDING SURFACE PLATE, AND GRINDING DEVICE 有权
    研磨半导体晶片的研磨方法，研磨表面和研磨装置

    公开(公告)号：US20090298396A1

    公开(公告)日：2009-12-03

    申请号：US12470714

    申请日：2009-05-22

    申请人： Tomohiro HASHII ,  Yasunori YAMADA ,  Yuichi KAKIZONO

    发明人： Tomohiro HASHII ,  Yasunori YAMADA ,  Yuichi KAKIZONO

    IPC分类号： B24B1/00 ,  B24D3/00 ,  B24B7/17 ,  B24B47/00

    CPC分类号： B24B37/042 ,  B24B7/17 ,  B24B7/228 ,  B24B37/08 ,  B24B41/067 ,  B24B47/12 ,  B24D7/14

    摘要： A method of grinding semiconductor wafers including simultaneously grinding both surfaces of multiple semiconductor wafers by rotating the wafers between a pair of upper and lower rotating surface plates in a state where the wafers are held on a carrier so that centers of the wafers are positioned on a circumference of a single circle, wherein a ratio of an area of a circle passing through the centers of the wafers to an area of one of the wafers is greater than or equal to 1.33 but less than 2.0; surfaces of the fixed abrasive grains comprised in the surface plates are comprised of pellets disposed in a grid-like fashion, with the pellets provided in a center portion and pellets provided in a peripheral portion being larger in size than the pellets provided in an intermediate portion.

    摘要翻译： 一种研磨半导体晶片的方法，包括在晶片被保持在载体上的状态下，通过在一对上下旋转表面板之间旋转晶片同时研磨多个半导体晶片的两个表面，使得晶片的中心位于 圆周，其中通过晶片中心的圆的面积与一个晶片的面积的比率大于或等于1.33但小于2.0; 包含在表面板中的固定磨料颗粒的表面由网格状排列的颗粒组成，颗粒设置在中心部分，并且设置在周边部分中的颗粒的尺寸大于设置在中间部分中的颗粒 。

    METHOD OF GRINDING SEMICONDUCTOR WAFERS AND DEVICE FOR GRINDING BOTH SURFACES OF SEMICONDUCTOR WAFERS
    2.
    发明申请
    METHOD OF GRINDING SEMICONDUCTOR WAFERS AND DEVICE FOR GRINDING BOTH SURFACES OF SEMICONDUCTOR WAFERS 审中-公开
    研磨半导体晶片的方法和研磨半导体晶片表面的器件

    公开(公告)号：US20090298397A1

    公开(公告)日：2009-12-03

    申请号：US12470961

    申请日：2009-05-22

    申请人： Yasunori YAMADA ,  Yuichi KAKIZONO ,  Kazushige TAKAISHI

    发明人： Yasunori YAMADA ,  Yuichi KAKIZONO ,  Kazushige TAKAISHI

    IPC分类号： B24B7/26 ,  B24B1/00

    CPC分类号： B24B37/28

    摘要： A method of grinding semiconductor wafers including simultaneously grinding both surfaces of multiple semiconductor wafers being ground by rotating the multiple semiconductor wafers between a pair of upper and lower rotating surface plates in a state where the multiple wafers are held on a carrier so that centers of the multiple wafers are positioned on a circumference of a single circle, wherein a ratio of an area of a circle passing through the centers of the multiple wafers to an area of one of the multiple wafers is greater than or equal to 1.33 but less than 2.0; a rotational speed of the multiple wafers falls within a range of 5 to 80 rpm; and the grinding of the multiple wafers with the rotating surface plates are conducted with fixed abrasive grains in the presence of an alkali solution.

    摘要翻译： 一种研磨半导体晶片的方法，包括同时研磨正在研磨的多​​个半导体晶片的两个表面的方法，所述两个半导体晶片在多个晶片被保持在载体上的状态下，通过在一对上下旋转表面板之间旋转多个半导体晶片而被研磨， 多个晶片位于单个圆周的圆周上，其中通过多个晶片的中心的圆的面积与多个晶片之一的面积的比率大于或等于1.33但小于2.0; 多个晶片的转速落在5〜80rpm的范围内; 并且利用固定的磨粒在碱性溶液的存在下用旋转的表面板研磨多个晶片。

    COMPUTER SYSTEM
    4.
    发明申请
    COMPUTER SYSTEM 审中-公开
    电脑系统

    公开(公告)号：US20080201474A1

    公开(公告)日：2008-08-21

    申请号：US12028135

    申请日：2008-02-08

    申请人： Yasunori YAMADA

    发明人： Yasunori YAMADA

    IPC分类号： G06F15/173

    CPC分类号： H04L67/08 ,  H04L29/06 ,  H04L67/125

    摘要： A technique for suppressing the need of active device check by an administrator by providing log data to the administrator for judging whether to replace hardware. A computer system includes: a terminal device in which a user performs direct operation or content check, a plurality of personal computers connected to the terminal device via a network and serving as objects of remote operation by the user, and a storage server device which accumulates information created or referenced by the user, and a start server device having a computer operation managing function which selects a usable personal computer and connects it to the terminal device so as to provide a use environment to the user when the user has made an allocation request to any one of the personal computers via the terminal device.

    摘要翻译： 一种用于通过向管理员提供用于判断是否替换硬件的日志数据来抑制由管理员进行主动设备检查的需要的技术。 计算机系统包括：用户执行直接操作或内容检查的终端设备，经由网络连接到终端设备并用作用户的远程操作的对象的多个个人计算机以及累积的存储服务器设备 由用户创建或引用的信息，以及具有计算机操作管理功能的启动服务器设备，其选择可用的个人计算机并将其连接到终端设备，以便在用户做出分配请求时向用户提供使用环境 通过终端设备到任何一个个人计算机。

    RECLAMATION METHOD OF SEMICONDUCTOR WAFER
    6.
    发明申请
    RECLAMATION METHOD OF SEMICONDUCTOR WAFER 有权
    半导体波形的回收方法

    公开(公告)号：US20090291621A1

    公开(公告)日：2009-11-26

    申请号：US12468308

    申请日：2009-05-19

    申请人： Yasunori YAMADA

    发明人： Yasunori YAMADA

    IPC分类号： H01L21/463

    CPC分类号： H01L21/02032 ,  H01L21/02021

    摘要： Chamfer correction is performed to a chamfered portion at least on a front side of a silicon wafer after an incoming inspection. Thereby, a thickness of the chamfered portion on the front side of the wafer is restored, and thus the number of reclamation cycles of the silicon wafer can be increased. In addition, the chamfered portion is not deformed even after reclamation is repeated for a plurality of times.

    摘要翻译： 在进入检查之后，至少在硅晶片的前侧对倒角部进行倒角校正。 由此，能够恢复晶片正面的倒角部的厚度，能够提高硅晶片的再生循环次数。 此外，即使在重复多次重复之后，倒角部也不变形。

    COMPUTER SYSTEM AND METHOD FOR OPERATING THE SAME
    7.
    发明申请
    COMPUTER SYSTEM AND METHOD FOR OPERATING THE SAME 审中-公开
    计算机系统及其操作方法

    公开(公告)号：US20080059845A1

    公开(公告)日：2008-03-06

    申请号：US11831117

    申请日：2007-07-31

    申请人： Yasunori YAMADA

    发明人： Yasunori YAMADA

    IPC分类号： G06F11/34 ,  G06F21/20

    CPC分类号： G06F11/2046 ,  G06F11/2025 ,  G06F11/2041

    摘要： In a computer system, each personal computer includes a bootup management device managing the start operation thereof. The bootup management device excludes a personal computer that failed to start, and provides a user with another personal computer. The user operates the terminal device connected to a network, and can accomplish his work whichever personal computer is connected to his terminal device. An original bootup disk image is allocated to the personal computer determined to be abnormal and it is checked whether the personal computer can operate normally or not. If the personal computer can operate normally, this personal computer is registered in the bootup management device. If unable to operate normally, the personal computer is registered and notified as needing to be maintained.

    摘要翻译： 在计算机系统中，每个个人计算机包括管理其启动操作的启动管理装置。 引导管理装置排除无法启动的个人计算机，并向用户提供另一个个人计算机。 用户操作连接到网络的终端设备，并且可以完成他的工作，无论个人计算机连接到他的终端设备。 将原始的启动盘图像分配给被确定为异常的个人计算机，并检查个人计算机是否能正常运行。 如果个人计算机可以正常运行，则该个人计算机被登记在启动管理装置中。 如果无法正常运行，则个人计算机被注册并通知为需要维护。

    SEMICONDUCTOR WAFER
    9.
    发明申请
    SEMICONDUCTOR WAFER 审中-公开

    公开(公告)号：US20090286047A1

    公开(公告)日：2009-11-19

    申请号：US12465756

    申请日：2009-05-14

    申请人： Yasunori YAMADA

    发明人： Yasunori YAMADA

    IPC分类号： B32B3/02

    CPC分类号： H01L21/02021 ,  H01L29/0657 ,  Y10T428/24777

    摘要： A semiconductor wafer includes front and back side-chamfered surfaces asymmetric to each other with respect to a virtual line extending in a diametrical direction as the center, at half: the height of the outer edge surface. In addition, the height of the front side-chamfered surface is greater than that of the back side-chamfered surface, causing the front side-chamfered portion to be thicker than the back side-chamfered portion, thereby increasing the number of wafer reclamation cycles.

    摘要翻译： 半导体晶片包括相对于沿作为中心的直径方向延伸的虚拟线彼此不对称的前侧和后侧倒角表面的一半：外边缘表面的高度。 此外，前侧倒角面的高度大于后侧倒角面的高度，使得前侧倒角部比后侧倒角部更厚，从而增加晶片回收周期的数量 。